H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2006
12/12/2006	US7148090 Method of fabricating a TFT device formed by printing
12/12/2006	US7148089 Method for forming copper fuse links
12/12/2006	US7148088 Memory structure and method making
12/12/2006	US7148087 Electronic package having a folded flexible substrate and method of manufacturing the same
12/12/2006	US7148086 Semiconductor package with controlled solder bump wetting and fabrication method therefor
12/12/2006	US7148085 Gold spot plated leadframes for semiconductor devices and method of fabrication
12/12/2006	US7148084 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
12/12/2006	US7148083 Transfer mold semiconductor packaging processes
12/12/2006	US7148082 Method of making a semiconductor chip assembly with a press-fit ground plane
12/12/2006	US7148081 Method of manufacturing a semiconductor device
12/12/2006	US7148080 Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
12/12/2006	US7148079 Diamond like carbon silicon on insulator substrates and methods of fabrication thereof
12/12/2006	US7148078 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
12/12/2006	US7148077 Micromechanical structural element having a diaphragm and method for producing such a structural element
12/12/2006	US7148075 Vertical semiconductor devices or chips and method of mass production of the same
12/12/2006	US7148074 Method and apparatus for using a capacitor array to measure alignment between system components
12/12/2006	US7148073 Methods and systems for preparing a copper containing substrate for analysis
12/12/2006	US7148072 Method and apparatus for oxidizing conductive redeposition in TMR sensors
12/12/2006	US7147994 Top ARC polymers, method of preparation thereof and top ARC compositions comprising the same
12/12/2006	US7147987 Positive resist composition and pattern formation method using the same
12/12/2006	US7147984 Patterning semiconductors; using polymer and acid generator mixture
12/12/2006	US7147983 Dyed photoresists and methods and articles of manufacture comprising same
12/12/2006	US7147977 A wafer is held on a pin chuck, and a pattern is transferred by exposure to light; the differences in distance between a focal position of the exposure light and the principal surface of the wafer held on the pin chuck are set at 50% or less; high precision lithography patterns; miniaturization
12/12/2006	US7147975 For forming a fine pattern in fabrication of semiconductor integrated circuit devices
12/12/2006	US7147920 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity
12/12/2006	US7147900 Method for forming silicon-containing insulation film having low dielectric constant treated with electron beam radiation
12/12/2006	US7147805 Composition for forming a transparent conducting film, solution for forming a transparent conducting film and method of forming a transparent conducting film
12/12/2006	US7147798 For etching an aluminum surface in the presence of solder bumps, containing phosphoric acid, nitric acid, acetic acid, an amine oxide surfactant, a Pb solubilizing additive, and deionized water; solder bumps are phosphate-free after etching.
12/12/2006	US7147795 Method for surface treatment
12/12/2006	US7147793 Method of and apparatus for tailoring an etch profile
12/12/2006	US7147782 Method and apparatus for metal removal by ion exchange
12/12/2006	US7147766 Depositing barrier layer; depositing seed layer of metal on barrier layer; removing seed layer from barrier layer, electroplating metal using portion of seed layer and exposed portions of barrier layer; removing excess plated metal
12/12/2006	US7147749 Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
12/12/2006	US7147748 Plasma processing method
12/12/2006	US7147747 Plasma processing apparatus and plasma processing method
12/12/2006	US7147743 Base material; an energy- beam-curable thermo-expandable viscoelastic layer comprising thermo-expandable microspheres; and a pressure-sensitive adhesive layer, in this order.
12/12/2006	US7147740 Method of transferring a laminate and method of manufacturing a semiconductor device
12/12/2006	US7147739 Systems for assembling components on submounts and methods therefor
12/12/2006	US7147735 Vibratable die attachment tool
12/12/2006	US7147721 Apparatus and method for cleaning electronic packages
12/12/2006	US7147720 Non-contact cool-down station for wafers
12/12/2006	US7147719 Double slit-valve doors for plasma processing
12/12/2006	US7147718 Device and method for the deposition of, in particular, crystalline layers on, in particular, crystalline substrates
12/12/2006	US7147712 Method of semiconductor nanoparticle synthesis
12/12/2006	US7147711 Method of producing silicon wafer and silicon wafer
12/12/2006	US7147710 Method of manufacturing epitaxial silicon wafer
12/12/2006	US7147709 Non-contact etch annealing of strained layers
12/12/2006	US7147674 Pretreated porous electrode and method for manufacturing same
12/12/2006	US7147530 Electroluminescence display device and method of manufacturing the same
12/12/2006	US7147447 Plastic semiconductor package having improved control of dimensions
12/12/2006	US7147424 Automatic door opener
12/12/2006	US7147359 Lamp assembly having flexibly positioned rigid plug
12/12/2006	US7147166 Substrate transfer apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing method
12/12/2006	US7147107 Packaging platform having an adjustable thickness
12/12/2006	US7146910 Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus
12/12/2006	US7146744 Method and apparatus for surface treatment
12/12/2006	US7146722 Method of forming a bond pad structure
12/12/2006	US7146718 Apparatus for mounting semiconductors
12/12/2006	US7146712 Pattern forming method and method of making microdevice
12/12/2006	CA2302020C Interface circuit for full-custom and semi-custom clock domains
12/12/2006	CA2286906C A method of producing a heat transfer device
12/12/2006	CA2116746C Ohmic contact structure of high integrated semiconductor device and method for making the same
12/12/2006	CA2087625C Non-systolic time delay and integration printing
12/07/2006	WO2006130811A2 Electronic device manufacturing chamber and methods of forming the same
12/07/2006	WO2006130801A2 Tft charge storage memory cell having high-mobility corrugated channel and method of manufacturing the same
12/07/2006	WO2006130744A1 Tungsten silicide etch process with reduced etch rate micro-loading
12/07/2006	WO2006130439A1 Process for removal of metals and alloys from a substrate
12/07/2006	WO2006130410A2 Active material emitting device
12/07/2006	WO2006130375A2 Technique for reducing silicide non-uniformities by adapting avertical dopant profile
12/07/2006	WO2006130309A2 Sidewall spacers on a memory device
12/07/2006	WO2006130281A1 Electrical connector with load bearing features
12/07/2006	WO2006130250A1 Technique for forming copper-containing lines embedded in a low-k dielectric by providing a stiffening layer
12/07/2006	WO2006130222A1 Method and composition for preparing a semiconductor surface for deposition of a barrier material
12/07/2006	WO2006129971A1 Probe card
12/07/2006	WO2006129941A1 Solder bonding method for sputtering target
12/07/2006	WO2006129907A1 Mold for transfer molding
12/07/2006	WO2006129875A1 Radiation-sensitive resin composition, layered product, and process for producing the same
12/07/2006	WO2006129864A1 Image exposure apparatus
12/07/2006	WO2006129817A1 Semiconductor device, manufacturing method thereof, and manufacturing method of antenna
12/07/2006	WO2006129800A1 Surface treating agent for pattern formation
12/07/2006	WO2006129775A1 Semiconductor device
12/07/2006	WO2006129742A1 Semiconductor device
12/07/2006	WO2006129741A1 Semiconductor device
12/07/2006	WO2006129739A1 Semiconductor device
12/07/2006	WO2006129718A1 Organic thin-film transistor
12/07/2006	WO2006129715A1 Opening/closing structure for container for conveying thin plate
12/07/2006	WO2006129711A1 Evaluation system and evaluation method
12/07/2006	WO2006129671A1 Film forming apparatus and method
12/07/2006	WO2006129653A1 Exposure apparatus and exposure method
12/07/2006	WO2006129643A1 Plasma treatment apparatus and plasma treatment method
12/07/2006	WO2006129637A1 Semiconductor device
12/07/2006	WO2006129630A1 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same
12/07/2006	WO2006129613A1 Protection circuit, and semiconductor device and light emitting device using such protection circuit
12/07/2006	WO2006129591A1 Plasma processing apparatus
12/07/2006	WO2006129581A1 Plotting device and method
12/07/2006	WO2006129576A1 Magnetic random access memory
12/07/2006	WO2006129574A1 Calixresorcinarene compound, photoresist base comprising the same, and composition thereof
12/07/2006	WO2006129565A1 Resist material, and resist material for electron beam recording
12/07/2006	WO2006129553A1 Group iii-v nitride compound semiconductor device and electrode-forming method
12/07/2006	WO2006129549A1 Semiconductor cleaning liquid composition containing phosphonic acid and ascorbic acid, and method of cleaning

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