| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/07/2006 | US20060273465 Semiconductor device and manufacturing method therefor |
| 12/07/2006 | US20060273462 System and method based on field-effect transistors for addressing nanometer-scale devices |
| 12/07/2006 | US20060273460 Method and structure for determining thermal cycle reliability |
| 12/07/2006 | US20060273459 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry |
| 12/07/2006 | US20060273457 Data line layout in semiconductor memory device and method of forming the same |
| 12/07/2006 | US20060273456 Multiple spacer steps for pitch multiplication |
| 12/07/2006 | US20060273448 Semiconductor structures having electrophoretically insulated vias |
| 12/07/2006 | US20060273440 Stacking apparatus and method for stacking integrated circuit elements |
| 12/07/2006 | US20060273439 Three-dimensional multichip stack electronic package structure |
| 12/07/2006 | US20060273438 Stacked chip security |
| 12/07/2006 | US20060273434 Semiconductor device and the manufacturing method for the same |
| 12/07/2006 | US20060273433 Semiconductor device |
| 12/07/2006 | US20060273431 Interconnects having sealing structures to enable selective metal capping layers |
| 12/07/2006 | US20060273430 Method of wafer-level packaging using low-aspect ratio through-wafer holes |
| 12/07/2006 | US20060273427 Vertical metal-insulator-metal (MIM) capacitors |
| 12/07/2006 | US20060273420 Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof |
| 12/07/2006 | US20060273415 Transistor for memory device and method for manufacturing the same |
| 12/07/2006 | US20060273414 Refractory metal-based electrodes for work function setting in semiconductor devices |
| 12/07/2006 | US20060273412 Method of manufacturing semiconductor device |
| 12/07/2006 | US20060273411 In-situ nitridation of high-k dielectrics |
| 12/07/2006 | US20060273408 Semiconductor device |
| 12/07/2006 | US20060273406 Semiconductor integrated circuit device having deposited layer for gate insulation |
| 12/07/2006 | US20060273405 Semiconductor device and method for patterning |
| 12/07/2006 | US20060273394 Semiconductor device and method of manufacturing same |
| 12/07/2006 | US20060273392 Semiconductor device and method of manufacturing the same |
| 12/07/2006 | US20060273387 Insulated gate-type semiconductor device and manufacturing method thereof |
| 12/07/2006 | US20060273385 Trenched MOSFET device with contact trenches filled with tungsten plugs |
| 12/07/2006 | US20060273384 Structure for avalanche improvement of ultra high density trench MOSFET |
| 12/07/2006 | US20060273383 High density hybrid MOSFET device |
| 12/07/2006 | US20060273382 High density trench MOSFET with low gate resistance and reduced source contact space |
| 12/07/2006 | US20060273380 Source contact and metal scheme for high density trench MOSFET |
| 12/07/2006 | US20060273377 Nonvolatile memory device and method of manufacturing the same |
| 12/07/2006 | US20060273376 Method of manufacturing devices comprising conductive nano-dots, and devices comprising same |
| 12/07/2006 | US20060273369 Capacitor for semiconductor device and method of forming the same |
| 12/07/2006 | US20060273367 Semiconductor device and manufacturing method therefor |
| 12/07/2006 | US20060273365 Semiconductor device and its manufacture method, and measurement fixture for the semiconductor device |
| 12/07/2006 | US20060273362 Photoelectric conversion layer, photoelectric conversion device and imaging device, and method for applying electric field thereto |
| 12/07/2006 | US20060273357 Semiconductor device and manufacturing method thereof |
| 12/07/2006 | US20060273355 CMOS image sensor and method for manufacturing the same |
| 12/07/2006 | US20060273343 A1xInyGa1-x-yN mixture crystal substrate, method of growing same and method of producing same |
| 12/07/2006 | US20060273339 Contacting Scheme for Large and Small Area Semiconductor Light Emitting Flip Chip Devices |
| 12/07/2006 | US20060273330 Semiconductor device using partial SOI substrate and manufacturing method thereof |
| 12/07/2006 | US20060273326 Semiconductor Light Emitting Device, its Manufacturing Method, Semiconductor Device and Its Manufacturing Method |
| 12/07/2006 | US20060273324 Light-emitting diode and process for producing the same |
| 12/07/2006 | US20060273322 Silicon layer with high resistance and fabricating method thereof |
| 12/07/2006 | US20060273319 Integrated circuit device and manufacturing method thereof |
| 12/07/2006 | US20060273306 Such as 3,5-dimethoxy-alpha,alpha-dimethylbenzyloxycarbonyl-3-mercaptopropyltriethoxysilane |
| 12/07/2006 | US20060273072 Tungsten silicide etch process with reduced etch rate micro-loading |
| 12/07/2006 | US20060273071 Removing one of an alterated layer (formed by dry-etching or ashing)and deposited layer formed on organic film pattern, then fusing film for deformation; dielectrics; for semiconductors, liquid crystal displays; photolithography |
| 12/07/2006 | US20060273070 Photoresist polymer, photoresist composition and method for manufacturing semiconductor device |
| 12/07/2006 | US20060273068 Methods for preparing a bonding surface of a semiconductor wafer |
| 12/07/2006 | US20060272987 Transfer mechanism and transfer method of semiconductor package |
| 12/07/2006 | US20060272975 Thin plate supporting container |
| 12/07/2006 | US20060272974 Thin plate supporting container |
| 12/07/2006 | US20060272973 Thin plate supporting container |
| 12/07/2006 | US20060272972 Thin plate supporting container |
| 12/07/2006 | US20060272966 Thin plate supporting container |
| 12/07/2006 | US20060272920 Multi-position stop mechanism |
| 12/07/2006 | US20060272776 Method and apparatus for extracting ions from an ion source for use in ion implantation |
| 12/07/2006 | US20060272775 Method and apparatus for extracting ions from an ion source for use in ion implantation |
| 12/07/2006 | US20060272774 Substrate support with clamping electrical connector |
| 12/07/2006 | US20060272773 Semiconductor substrate polishing methods and equipment |
| 12/07/2006 | US20060272169 Purging apparatus and purging method |
| 12/07/2006 | DE19734113B4 Verfahren zur Herstellung von mikromechanischen Bauelementen A process for preparing micromechanical components |
| 12/07/2006 | DE19626396B4 Verfahren und Vorrichtung zur Herstellung und zum Schleifen von Siliziumscheiben Method and apparatus for the production and grinding of silicon wafers |
| 12/07/2006 | DE19540894B4 Verfahren zur Verhinderung der Absorption von Feuchtigkeit in eine Störstellen enthaltende Isolationsschicht A method for preventing absorption of moisture in an impurity-containing insulating layer |
| 12/07/2006 | DE19522338B4 Chipträgeranordnung mit einer Durchkontaktierung Chip carrier assembly with a via |
| 12/07/2006 | DE10250889B4 Verbesserte SiC-Barrierenschicht für eine Kupfermetallisierungsschicht mit einem Dielektrikum mit kleinem ε und Verfahren zur Herstellung derselben Improved SiC barrier layer for a copper metallization with a dielectric with a small ε, and methods for making same |
| 12/07/2006 | DE102006023879A1 Verfahren zum Häusen eines Bildsensors und ein gehäuster Bildsensor A method of packaging a image sensor and a housed image sensor |
| 12/07/2006 | DE102006014812A1 Sichtprüfeinrichtung und Sichtprüfverfahren Sichtprüfeinrichtung view and test methods |
| 12/07/2006 | DE102006004845A1 Verfahren und Schaltungsstruktur, die eine photoabgebildete Lötmaske verwenden Method and circuit structure using a photoimaged solder mask |
| 12/07/2006 | DE102005034119B3 Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection |
| 12/07/2006 | DE102005027714A1 Charge-Trapping-Speicherbauelement Charge-trapping memory device |
| 12/07/2006 | DE102005026229B4 Halbleiter-Package, das ein Neuverteilungsmuster enthält, und Verfahren zu dessen Herstellung The semiconductor package containing a Neuverteilungsmuster, and process for its preparation |
| 12/07/2006 | DE102005025123A1 Large substrate wet chemical treatment performing method for manufacturing solar cells, involves inserting substrate in cell and exerting force on substrate edge, where exertion of force fixes substrate and inside of cell is sealed outward |
| 12/07/2006 | DE102005024915A1 Verfahren und System für eine fortschrittliche Prozesssteuerung mit anlagenabhängigen Maschinenkonstanten Method and system for advanced process control with plant-specific machine constants |
| 12/07/2006 | DE102005024914A1 Verfahren zum Ausbilden elektrisch leitfähiger Leitungen in einem integrierten Schaltkreis A method for forming electrically conductive lines in an integrated circuit |
| 12/07/2006 | DE102005024912A1 Technik zur Herstellung von kupferenthaltenden Leitungen, die in einem Dielektrikum mit kleinem ε eingebettet sind, durch Vorsehen einer Versteifungsschicht Art for the preparation of copper-containing conduits that are embedded in a dielectric with small ε, by providing a reinforcement layer |
| 12/07/2006 | DE102005024910A1 Verfahren und System zur In-Line-Steuerung der Lothöcker-Abscheidung Method and system for in-line control of the deposition of solder bump |
| 12/07/2006 | DE102005024855A1 Speicher und Verfahren zu seiner Herstellung Memory and method for its preparation |
| 12/07/2006 | DE102005024182A1 Cleaning arrangement for e.g. front opening unified pod, has transport device with cleaning stations arranged in cleaning area, where two cleaning stations are arranged one upon the other and lies one behind the other in transport direction |
| 12/07/2006 | DE102005022780A1 Halbleiterchips für Tag-Anwendungen, Vorrichtungen zur Montage dieser Halbleiterchips und Montageverfahren Semiconductor chips day applications, devices for mounting the semiconductor chip and method of assembly |
| 12/07/2006 | DE102005021099A1 GaN-Schichten GaN layers |
| 12/07/2006 | DE102005004433B4 Halbleiterbauelement mit integriertem Kondensator und Herstellungsverfahren A semiconductor device with an integrated capacitor and manufacturing method |
| 12/07/2006 | DE102004039803B4 Verfahren zur Herstellung einer Leitbahnanordnung mit erhöhter kapazitiver Kopplung sowie zugehörige Leitbahnanordnung A process for preparing a Interconnect arrangement with increased capacitive coupling and associated Interconnect arrangement |
| 12/07/2006 | DE10140046B4 Verfahren zum Vereinzeln von Halbleiterchips A method for separating semiconductor chips |
| 12/07/2006 | CA2596555A1 Active material emitting device |
| 12/06/2006 | EP1729554A2 Soldering method, electronic part, and part-exchanging method |
| 12/06/2006 | EP1729551A1 Plasma generating equipment |
| 12/06/2006 | EP1729414A2 Surface acoustic wave device and method of manufacturing the same |
| 12/06/2006 | EP1729356A1 Switching device |
| 12/06/2006 | EP1729339A2 Magnetic memory and method of manufacturing same |
| 12/06/2006 | EP1729338A2 Method for forming a semiconductor memory device with a recessed gate |
| 12/06/2006 | EP1729337A2 Electronic device and method of manufacturing the same |
| 12/06/2006 | EP1729336A1 Wafer processing device and wafer processing method |
| 12/06/2006 | EP1729335A1 Turning device for heavy object |
| 12/06/2006 | EP1729334A1 Solder composition and method of bump formation therewith |
| 12/06/2006 | EP1729333A2 Method of manufacturing ferroelectric layer and method of manufacturing electronic device |
| 12/06/2006 | EP1729332A1 Schedule control method in spin etching and spin etching system |
| 12/06/2006 | EP1729331A1 Method and apparatus for forming silicon dots |