H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2006
12/07/2006	WO2006129547A1 Bonding apparatus
12/07/2006	WO2006129538A1 Semiconductor wafer cleaning composition containing phosphonic acid and method of cleaning
12/07/2006	WO2006129520A1 Compression bonding release sheet and roll
12/07/2006	WO2006129514A1 Fine mesh and mold therefor
12/07/2006	WO2006129488A1 Semiconductor storage apparatus and semiconductor integrated circuit incorporating the same
12/07/2006	WO2006129485A1 Bonded wafer manufacturing method and apparatus for grinding outer circumference of bonded wafer
12/07/2006	WO2006129484A1 Process for manufacture of bonded wafer
12/07/2006	WO2006129458A1 Wafer with fixing agent and method for producing wafer with fixing agent
12/07/2006	WO2006129444A1 Solar cell element and method for fabricating same
12/07/2006	WO2006129423A1 Semiconductor device and method for manufacturing same
12/07/2006	WO2006129385A1 Substrate carrying device
12/07/2006	WO2006129374A1 Patterning method
12/07/2006	WO2006129366A1 Semiconductor device and method for manufacturing same
12/07/2006	WO2006129348A1 Semiconductor manufacturing apparatus
12/07/2006	WO2006129347A1 Semiconductor inspecting/manufacturing apparatus
12/07/2006	WO2006129343A1 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
12/07/2006	WO2006129342A1 Semiconductor device and method for manufacturing same
12/07/2006	WO2006129341A1 Semiconductor device and method for manufacturing same
12/07/2006	WO2006128898A1 Method for producing vertical electrical contact connections in semiconductor wafers
12/07/2006	WO2006128713A2 Optical imaging arrangement
12/07/2006	WO2006128247A1 Method and apparatus for hydrogenation of thin film silicon on glass
12/07/2006	WO2006107545A3 Method for forming a barrier/seed layer for copper metallization
12/07/2006	WO2006103158A3 Integration scheme for fully silicided gate
12/07/2006	WO2006096528A3 Stabilized photoresist structure for etching process
12/07/2006	WO2006094980A3 Photovoltaic cell containing a semiconductor photovoltaically active material
12/07/2006	WO2006093770B1 Method to remove resist, etch residue, and copper oxide from substrates having copper and low-k dielectric material
12/07/2006	WO2006086084A3 Target design for high-power laser accelerated ions
12/07/2006	WO2006083257A3 Drug delivery apparatus utilizing cantilever
12/07/2006	WO2006082585A3 Sample preparation for micro-analysis
12/07/2006	WO2006078354A3 Micro-feature fill process and apparatus using hexachlorodisilane or other chlorine-containing silicon precursor
12/07/2006	WO2006074444A3 Enzyme activity measurements using bio-layer interferometry
12/07/2006	WO2006052791A3 Insulation film semiconductor device and method
12/07/2006	WO2006047061A8 Use of defined compounds for the manufacture of a medicament for preventing/ treating diseases resulting from somatic mutation
12/07/2006	WO2006040500A3 Method for producing planar transporting resonance heterostructures
12/07/2006	WO2006014515A3 Two-dimensional silicon controlled rectifier
12/07/2006	WO2005109475A3 Zeolite films for low k applications
12/07/2006	WO2005104236A3 Optical devices featuring textured semiconductor layers
12/07/2006	WO2005098923A8 Methods of forming trench isolation regions
12/07/2006	WO2005091988A3 Method and device with durable contact on silicon carbide
12/07/2006	WO2005088745A8 Magnetoresistive element and its manufacturing method
12/07/2006	WO2005074027A3 Integrated circuit chip with electrostatic discharge protection device
12/07/2006	WO2005071716A3 Method of correction for wafer crystal cut error in semiconductor processing
12/07/2006	WO2005050714A3 High temperature electronic devices
12/07/2006	WO2005038878A3 Developer-soluble materials and methods of using the same in via-first dual damascene applications
12/07/2006	WO2005038867A3 Semiconductor device with a toroidal-like junction
12/07/2006	WO2005020284A3 Thin film dielectrics with perovskite structure and preparation thereof
12/07/2006	WO2004053942A3 Measuring alignment between a wafer chuck and polishing/plating receptacle
12/07/2006	US20060277506 System and method for product yield prediction
12/07/2006	US20060276113 Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices
12/07/2006	US20060276056 Nanotube articles with adjustable electrical conductivity and methods of making the same
12/07/2006	US20060276055 Method of forming an oxygen- or nitrogen-terminated silicon nanocrystalline structure and an oxygen- or nitrogen-terminated silicon nanocrystalline structure formed by the method
12/07/2006	US20060276054 In situ oxide cap layer development
12/07/2006	US20060276053 Spin-on glass composition, method of preparing the spin-on glass composition and method of forming a porous silicon oxide layer using the spin-on glass composition
12/07/2006	US20060276052 Method for producing a component comprising at least one germanium-based element and component obtained by such a method
12/07/2006	US20060276051 Oxidation method and oxidation system
12/07/2006	US20060276050 Method for manufacturing crystalline dielectric film,crystalline dielectric film manufactured thereby and thin film capacitor having the same
12/07/2006	US20060276049 High efficiency trap for deposition process
12/07/2006	US20060276048 Methods of etching nickel silicide and cobalt silicide and methods of forming conductive lines
12/07/2006	US20060276047 Macroporous silicon microcavity with tunable pore size
12/07/2006	US20060276046 Substrate processing system and substrate processing method
12/07/2006	US20060276045 Hard mask structure for deep trenched super-junction device
12/07/2006	US20060276044 Forming a resin mold, interposing a photosensitive polymer forming layers, exposing the layered structure with an electron beam, ultraviolet radiation or visible radiaton, removing an exposed photosensitive polymer, and filling the vacant portion with a metal
12/07/2006	US20060276043 Method and systems for single- or multi-period edge definition lithography
12/07/2006	US20060276042 Versatile system for conditioning slurry in cmp process
12/07/2006	US20060276041 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
12/07/2006	US20060276040 Ion implanted microscale and nanoscale device method
12/07/2006	US20060276039 Neck height equalization in magnetic write pole mold
12/07/2006	US20060276038 Thermal desorption of oxide from surfaces
12/07/2006	US20060276037 Plasma enhanced atomic layer deposition (PEALD) equipment and method of forming a conducting thin film using the same thereof
12/07/2006	US20060276036 Systems and methods for plasma etching
12/07/2006	US20060276035 Contact structure and contact liner process
12/07/2006	US20060276034 Forming via contacts in MRAM cells
12/07/2006	US20060276033 Adhesion of tungsten nitride films to a silicon surface
12/07/2006	US20060276032 Fabrication method for a semiconductor device
12/07/2006	US20060276031 Method for forming via-hole in semiconductor device
12/07/2006	US20060276030 Novel method to implement stress free polishing
12/07/2006	US20060276029 Semiconductor device and method for manufacturing same
12/07/2006	US20060276028 Method of manufacturing semiconductor device
12/07/2006	US20060276027 Interconnects with harmonized stress and methods for fabricating the same
12/07/2006	US20060276026 Semiconductor device and method for fabricating the same
12/07/2006	US20060276025 Method for manufacturing semiconductor device
12/07/2006	US20060276024 Process for forming an electronic device including workpieces and a conductive member therebetween
12/07/2006	US20060276023 Method for forming bumps
12/07/2006	US20060276022 Capping copper bumps
12/07/2006	US20060276021 Method for forming metal line of semiconductor device
12/07/2006	US20060276020 Deposition methods for barrier and tungsten materials
12/07/2006	US20060276019 Method for production of contacts on a wafer
12/07/2006	US20060276018 Method for fabricating semiconductor device
12/07/2006	US20060276017 MOS transistor and fabrication method thereof
12/07/2006	US20060276016 Nickel bonding cap over copper metalized bondpads
12/07/2006	US20060276015 Method and apparatus for reducing dielectric charging in MEMS structures
12/07/2006	US20060276014 Self-aligned high-energy implantation for deep junction structure
12/07/2006	US20060276013 Sequential lateral solidification mask
12/07/2006	US20060276012 Method of manufacturing a semiconductor device
12/07/2006	US20060276011 Amorphization/templated recrystallization method for hybrid orientation substrates
12/07/2006	US20060276010 Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium
12/07/2006	US20060276009 Method for cutting junction Board, and chip
12/07/2006	US20060276008 Thinning
12/07/2006	US20060276007 Manufacturing method of thin film device substrate
12/07/2006	US20060276006 Method of segmenting a wafer

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