Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/05/2007DE10338259B4 Halbleitereinrichtung Semiconductor device
04/05/2007DE10337858B4 Grabenkondensator und Verfahren zur Herstellung eines Grabenkondensators Grave capacitor and method for manufacturing a capacitor grave
04/05/2007DE10334576B4 Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse A method of manufacturing a semiconductor device with a plastic housing
04/05/2007DE10310842B4 Elektronisches Bauteil mit Halbleiterchip und Kunststoffgehäuse Electronic component with semiconductor chip and the plastic housing
04/05/2007DE10310779B4 Integrierte Speicherschaltung mit erhöhter Zuverlässigkeit The integrated memory circuit with increased reliability
04/05/2007DE10260238B4 Adapter zum Testen einer oder mehrerer Leiteranordnungen und Verfahren Adapter for testing one or more printed circuit assemblies and methods
04/05/2007DE10245090B4 Verfahren zur Herstellung eines mittels Feldeffekt steuerbaren Halbleiterbauelementes mit einer in einer Kanalzone angeordneten Rekombinationszone A method for producing a controllable means of field-effect semiconductor device having a channel region disposed in a recombination zone
04/05/2007DE10241168B4 Analoge Eingangsauswahlschaltung zum Schutz gegen negative Überspannung Analog input selection circuit for protection against negative overvoltage
04/05/2007DE10209059B4 Ein Halbleiterelement mit unterschiedlichen Metall-Halbleiterbereichen, die auf einem Halbleitergebiet gebildet sind, und Verfahren zur Herstellung des Halbleiterelements A semiconductor element with different metal-semiconductor regions which are formed on a semiconductor region, and method for manufacturing the semiconductor element
04/05/2007DE102006039897A1 Non-volatile memory cell e.g. electrically erasable programmable read-only memory cell for e.g. flash electrically erasable programmable read-only memory array has floating gate electrode provided at tunnel oxide layer
04/05/2007DE102006037710A1 Verfahren zur Herstellung einer Grabenisolation eines Halbleiterbauelements A process for the preparation of a grave insulation of a semiconductor device
04/05/2007DE102006000482A1 Elektronische Vorrichtung, die auf Gruppe-III-Elementnitriden beruhende Halbleiter enthält Contains electronic device, semiconductor-based group-III-Elementnitriden
04/05/2007DE102005053509A1 Process to manufacture a semiconductor component, e.g. a flash storage component
04/05/2007DE102005049977B3 Tempering process for semi conductor compound plate involves fixing plate and plastics housing its underneath on holder and generating and maintaining temperature gradient for defined time interval until cooling to reduce risk of curvature
04/05/2007DE102005047509A1 Device for separating flat substrate stuck to semiconductor support has holding elements movable relative to one another through positioning members with mechanical separators to separate substrate from support over defined path
04/05/2007DE102005047221A1 Semiconductor layer structure of at least five different layers on a silicon based substrate
04/05/2007DE102005047081A1 Process for plasma-free etching of silicon with etching gas useful in production of deep structures such as through holes or troughs where silicon has one or more regions to be etched as layer on substrate or on substrate itself
04/05/2007DE102005046978A1 Production of a semiconductor component used in the production of integrated circuits comprises selectively forming a first etch stop layer over a first or second transistor element and forming a second contact etch stop layer
04/05/2007DE102005046975A1 Process to manufacture a semiconductor component with aperture cut through a dielectric material stack
04/05/2007DE102005046974B3 Manufacturing semiconductor elements by producing different mechanical shaping in different substrate fields by producing layers with different modified inner voltage
04/05/2007DE102005046973A1 Superimposed measuring structure used in the production of integrated circuits comprises a first periodic structure formed in a first component layer and a second periodic structure formed in a second component arranged over the first layer
04/05/2007DE102005046972A1 Method for progressive process control e.g. for fabrication of semiconductor components, requires obtaining measurement data from some processed substrates
04/05/2007DE102005046711A1 Semiconductor device manufacture e.g. for TEDFET, by forming trench, filling with semiconductor material, removing sacrificial layer and replacing with dielectric
04/05/2007DE102005046404A1 Method for reducing scattering in the sagging of rolled metal base plates for semi conductor modules involves rolling base plates in preferential such as longitudinal direction
04/05/2007DE102005046403A1 Production of an integrated semiconductor circuit arrangement comprises forming a semiconductor circuit with first type field effect transistors and forming lateral edge regions to protect the gate insulation below the gate electrodes
04/05/2007DE102005046280A1 Electronic semiconductor component for electronic circuits has flipchip contacts surrounded by insulating material
04/05/2007DE102005042331B3 Verfahren zur Herstellung von Halbleiterspeicherbauelementen A process for the manufacture of semiconductor memory devices
04/05/2007DE102004036909B4 Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung Basic semiconductor device having wiring substrate and intermediate wiring board for a semiconductor component stack and process for their preparation
04/05/2007DE102004028852B4 Verfahren zur Ausbildung von Trench-Speicherzellenstrukturen für DRAMs Method of forming trench DRAM memory cell structures for
04/05/2007DE102004005804B4 Verfahren zur Verfüllung von Isolationsgräben unter Nutzung von CMOS-Standardprozessen zur Realisierung dielektrisch isolierter Gebiete auf SOI Scheiben Method for filling of isolation trenches using CMOS standard processes for the realization of dielectrically isolated areas on SOI wafers
04/05/2007DE10196362B4 Leistungsdiode mit weichem Ausschaltverhalten (Soft Recovery) und darauf bezogenes Verfahren Power diode with soft turn-off (soft recovery) and related method
04/05/2007DE10134444B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit örtlich ausgebildeten Kanal-Stop-Fremdstoffzonen. A process for producing a semiconductor device with locally formed channel stop impurity regions.
04/05/2007DE10129348B4 Mittels Feldeffekt steuerbares Halbleiterbauelement und Verfahen zu dessen Herstellung By means of field-effect-controllable semiconductor component and Procedure for the preparation thereof
04/05/2007DE10035344B4 Verfahren zur Herstellung einer Schattenmaske A method of manufacturing a shadow mask
04/05/2007CA2623842A1 System, apparatus, and method for increasing particle density and energy by creating a controlled plasma environment into a gaseous media
04/05/2007CA2623555A1 Field-effect semiconductor device including superlattice regions
04/04/2007EP1771050A1 Printed circuit board and method of manufacturing printed circuit board
04/04/2007EP1770859A1 High-frequency element, power supply element, and communication device
04/04/2007EP1770795A2 Substrate for epitaxy, method of fabricating it and method of fabricating a semiconductor chip
04/04/2007EP1770790A2 Transparent thin film transistor (TFT) and its method of manufacture
04/04/2007EP1770789A2 Semiconductor Devices and Methods of Manufacture Thereof
04/04/2007EP1770788A2 Semiconductor device having oxide semiconductor layer and manufacturing method thereof
04/04/2007EP1770787A2 Semiconductor device with a MOS transistor and method of manufacturing the same
04/04/2007EP1770786A1 Semiconductor device and method of manufacturing a semiconductor device
04/04/2007EP1770785A1 Semiconductor device and method of manifacturing a semiconductor device
04/04/2007EP1770784A1 Semiconductor device and method of manifacturing a semiconductor device
04/04/2007EP1770779A2 Electro-optical device and electronic device
04/04/2007EP1770778A1 Apparatus for obtaining double stable resistance values, method for manufacturing the same, metal oxide thin film and method for manufacturing the same
04/04/2007EP1770773A2 Heat spreader module and method of manufacturing same
04/04/2007EP1770772A1 Process for manufacturing a non-volatile memory device
04/04/2007EP1770771A2 Substrate transfer apparatus
04/04/2007EP1770769A1 Vertical MOS transistor and method of producing the same
04/04/2007EP1770768A2 Polishing method, polishing composition and polishing composition kit
04/04/2007EP1770767A2 GaAs semiconductor substrate and semiconductor device
04/04/2007EP1770766A2 Epitaxial substrate, device using it and corresponding fabrication method
04/04/2007EP1770765A2 Substrate processing method
04/04/2007EP1770764A2 Semiconductor device
04/04/2007EP1770763A1 Substrate processing apparatus and substrate processing method
04/04/2007EP1770762A1 Substrate processing apparatus and substrate processing method
04/04/2007EP1770761A1 Substrate processing apparatus and substrate processing method
04/04/2007EP1770760A1 Substrate processing apparatus and substrate processing method
04/04/2007EP1770759A2 Substrate thermal management system
04/04/2007EP1770758A2 Heating process of the light irradiation type
04/04/2007EP1770753A2 Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
04/04/2007EP1770726A1 MIM-capacitor and corresponding method of manufacturing
04/04/2007EP1770712A1 Program/erase method for P-channel charge trapping memory device
04/04/2007EP1770136A2 Polishing composition and polishing method
04/04/2007EP1770032A1 Levitation transportation device and levitation transportation method
04/04/2007EP1769536A2 Active matrix electronic array device having built in resistive heating arrangement
04/04/2007EP1769531A2 Assembly and method of placing the assembly on an external board
04/04/2007EP1769530A2 Systems and methods for harvesting and integrating nanowires
04/04/2007EP1769529A1 Gallium nitride materials and methods associated with the same
04/04/2007EP1769102A2 Substrate support system and method
04/04/2007EP1717861A9 Vertical MOSFET transistor, in particular operating as a selector in nonvolatile memory devices
04/04/2007EP1697985B1 Combinations of resin compositions and methods of use thereof
04/04/2007EP1683161A4 Stress assisted current driven switching for magnetic memory applications
04/04/2007EP1636853A4 Steady-state-non-equilibrium distribution of free carriers and photon energy up-conversion using same
04/04/2007EP1631416A4 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
04/04/2007EP1620581B1 Plasma treatment for purifying copper or nickel
04/04/2007EP1589567B1 Member for plasma etching device and method for manufacture thereof
04/04/2007EP1535296A4 Micro-electromechanical switch having a deformable elastomeric conductive element
04/04/2007EP1444717B1 Tunable multi-zone gas injection system
04/04/2007EP1422279B1 Semiconductor package with a die attach adhesive having silane functionality
04/04/2007EP1404594A4 Horizontal cassette
04/04/2007EP1395894A4 Low power clock distribution methodology
04/04/2007EP1386352B1 Trench-gate semiconductor devices and their manufacture
04/04/2007EP1378932B1 Semiconductor chip mounting apparatus and mounting method
04/04/2007EP1364394B1 Method for producing structures on the nanometric scale
04/04/2007EP1354343B1 Use of endpoint system to match individual processing stations within a tool
04/04/2007EP1320895B1 Trench dmos transistor having lightly doped source structure
04/04/2007EP1308717A4 X-ray measuring and testing system
04/04/2007EP1296367B1 Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
04/04/2007EP1009020B1 Exposure method and exposure apparatus
04/04/2007EP0957511B1 Chemical vapor deposition method
04/04/2007CN2886802Y Vacuum tweezer
04/04/2007CN2886591Y Bottom extracting type wafer delivering device in auto wafer tester
04/04/2007CN1943111A Surface acoustic wave device
04/04/2007CN1943055A Methods of fabricating vertical carbon nanotube field effect transistors for arrangement in arrays and field effect transistors and arrays formed thereby
04/04/2007CN1943050A Production method of compound semiconductor light-emitting device wafer
04/04/2007CN1943048A Boron phosphide-based semiconductor light-emitting device