Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/10/2007US7202160 Method of forming an insulating structure having an insulating interlayer and a capping layer and method of forming a metal wiring structure using the same
04/10/2007US7202159 Diffusion barriers comprising a self-assembled monolayer
04/10/2007US7202158 Method for fabricating a metal-insulator-metal capacitor
04/10/2007US7202157 Method for forming metallic interconnects in semiconductor devices
04/10/2007US7202156 Process for manufacturing a wiring substrate
04/10/2007US7202155 Method for manufacturing wiring and method for manufacturing semiconductor device
04/10/2007US7202154 Suspension for filling via holes in silicon and method for making the same
04/10/2007US7202153 Method for forming, under a thin layer of a first material, portions of another material and/or empty areas
04/10/2007US7202152 Semiconductor device with inductive component and method of making
04/10/2007US7202151 Method for fabricating a semiconductor device having a metallic silicide layer
04/10/2007US7202150 Semiconductor memory device and manufacturing method therefor
04/10/2007US7202149 Semiconductor device and manufacturing method thereof
04/10/2007US7202148 Method utilizing compensation features in semiconductor processing
04/10/2007US7202147 Semiconductor device and method for fabricating the same
04/10/2007US7202146 Process for producing doped semiconductor wafers from silicon, and the wafers produced thereby
04/10/2007US7202145 Strained Si formed by anneal
04/10/2007US7202144 Manufacturing method of semiconductor film and image display device
04/10/2007US7202143 Low temperature production of large-grain polycrystalline semiconductors
04/10/2007US7202142 Method for producing low defect density strained -Si channel MOSFETS
04/10/2007US7202141 Method of separating layers of material
04/10/2007US7202140 Method to fabricate Ge and Si devices together for performance enhancement
04/10/2007US7202139 MOSFET device with a strained channel
04/10/2007US7202138 Spin coating for maximum fill characteristic yielding a planarized thin film surface
04/10/2007US7202137 Process for producing an integrated electronic circuit comprising superposed components and integrated electronic circuit thus obtained
04/10/2007US7202136 Silicon germanium heterojunction bipolar transistor with carbon incorporation
04/10/2007US7202134 Method of forming transistors with ultra-short gate feature
04/10/2007US7202133 Structure and method to form source and drain regions over doped depletion regions
04/10/2007US7202132 Protecting silicon germanium sidewall with silicon for strained silicon/silicon germanium MOSFETs
04/10/2007US7202131 Method of fabricating semiconductor device
04/10/2007US7202130 Spacer for a split gate flash memory cell and a memory cell employing the same
04/10/2007US7202129 Source lines for NAND memory devices
04/10/2007US7202128 Method of forming a memory device having improved erase speed
04/10/2007US7202127 Methods of forming a plurality of capacitors
04/10/2007US7202126 Semiconductor device and method of manufacturing same
04/10/2007US7202125 Low-voltage, multiple thin-gate oxide and low-resistance gate electrode
04/10/2007US7202124 Strained gettering layers for semiconductor processes
04/10/2007US7202123 Mesa isolation technology for extremely thin silicon-on-insulator semiconductor devices
04/10/2007US7202122 Cobalt silicidation process for substrates with a silicon—germanium layer
04/10/2007US7202121 Methods for preserving strained semiconductor substrate layers during CMOS processing
04/10/2007US7202120 Semiconductor integrated circuit device and fabrication process thereof
04/10/2007US7202119 Method of manufacturing semiconductor device
04/10/2007US7202118 Fully depleted SOI MOSFET arrangement with sunken source/drain regions
04/10/2007US7202117 Method of making a planar double-gated transistor
04/10/2007US7202116 Thin film transistor substrate for display device and fabricating method thereof
04/10/2007US7202115 Thin film transistor, its manufacture method and display device
04/10/2007US7202113 Wafer level bumpless method of making a flip chip mounted semiconductor device package
04/10/2007US7202112 Micro lead frame packages and methods of manufacturing the same
04/10/2007US7202111 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
04/10/2007US7202110 Embedded flat film molding
04/10/2007US7202109 Insulation and reinforcement of individual bonding wires in integrated circuit packages
04/10/2007US7202108 Semiconductor wafer, semiconductor chip and method for manufacturing the same
04/10/2007US7202107 Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
04/10/2007US7202106 Multi-chip semiconductor connector and method
04/10/2007US7202105 Multi-chip semiconductor connector assembly method
04/10/2007US7202104 Co-sputter deposition of metal-doped chalcogenides
04/10/2007US7202103 Overlapped color filter fabrication technique
04/10/2007US7202102 Doped absorption for enhanced responsivity for high speed photodiodes
04/10/2007US7202101 Multi-metal layer MEMS structure and process for making the same
04/10/2007US7202100 Method of manufacturing a cloverleaf microgyroscope and cloverleaf microgyroscope
04/10/2007US7202099 Method of fabricating a laser diode that includes thermally cleaning a deposition reactor using a gas mixture of arsine and hydrogen
04/10/2007US7202098 Method and structure to reduce optical crosstalk in a solid state imager
04/10/2007US7202097 Light polarizing film, a method of continuously fabricating same, and reflective optical film using same
04/10/2007US7202096 Control TFT for OLED display
04/10/2007US7202095 Method for measuring silicide proportion, method for measuring annealing temperature, method for fabricating semiconductor device and x-ray photo receiver
04/10/2007US7202094 Process for locating, displaying, analyzing, and optionally monitoring potential transient defect sites in one or more integrated circuit chips of a semiconductor substrate
04/10/2007US7202015 acid-decomposable resin in which an alicyclic structure showing no absorption in the 193 nm range is introduced into the main or side chain of a polymer
04/10/2007US7202014 Stimulus-sensitive composition, compound and pattern formation method using the stimulation-sensitive composition
04/10/2007US7202010 Suitable for lithography
04/10/2007US7202007 Method of forming patterned films
04/10/2007US7201969 has excellent adhesive properties and proper adhesive force in regard to a surface of a semiconductor wafer, which can prevent contamination and breakage of a wafer surface due to penetration of grinding water
04/10/2007US7201943 Methods of forming atomic layers of a material on a substrate by sequentially introducing precursors of the material
04/10/2007US7201936 Method of feedback control of sub-atmospheric chemical vapor deposition processes
04/10/2007US7201852 Method for removing defects from silicon bodies by a selective etching process
04/10/2007US7201851 Vacuum processing apparatus and substrate transfer method
04/10/2007US7201829 Mask plate design
04/10/2007US7201828 Planar plating apparatus
04/10/2007US7201823 High throughput plasma treatment system
04/10/2007US7201808 Method and apparatus for rotating a semiconductor substrate
04/10/2007US7201807 Reacting a metal with one gas; forming oxides; decompsoition with second gas
04/10/2007US7201803 Valve control system for atomic layer deposition chamber
04/10/2007US7201800 Process for making silicon wafers with stabilized oxygen precipitate nucleation centers
04/10/2007US7201786 Dust bin and filter for robotic vacuum cleaner
04/10/2007US7201784 Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics
04/10/2007US7201647 Subpad having robust, sealed edges
04/10/2007US7201642 Process for producing improved membranes
04/10/2007US7201640 Method of sucking water and water sucking device
04/10/2007US7201636 Chemical mechanical polishing a substrate having a filler layer and a stop layer
04/10/2007US7201632 In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
04/10/2007US7201551 Vacuum processing apparatus and semiconductor manufacturing line using the same
04/10/2007US7201328 Semiconductor devices and manufacturing method therefor and electric commerce method and transponder reader
04/10/2007US7201304 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder
04/10/2007US7201280 Wafer boat for consolidation of porous thin layer
04/10/2007US7201276 Front opening substrate container with bottom plate
04/10/2007US7201174 Silicon oxyfluoride film is formed on a wafer using a plasma vapor deposition method; film remaining inside chamber is cleaned up using a gas containing nitrogen trifluoride
04/10/2007US7201078 Transporting apparatus
04/10/2007US7201022 Systems and methods for filling voids and improving properties of porous thin films
04/10/2007US7201016 Refrigerant supply apparatus
04/10/2007US7200930 Probe for semiconductor devices
04/10/2007US7200924 Method of packaging electronic parts
04/10/2007US7200920 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module