Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/12/2007US20070082419 Optical Pickup Unit and Method of Manufacturing the Same
04/12/2007US20070082418 Method for manufacturing a light emitting device and light emitting device made therefrom
04/12/2007US20070082417 Method and structure for reducing prior level edge interference with critical dimension measurement
04/12/2007US20070082416 Semiconductor device
04/12/2007US20070082415 Method of manufacturing a semiconductor device having a dual gate structure
04/12/2007US20070082414 Perpendicular magnetic recording medium, method for production of the same, and magnetic recording apparatus
04/12/2007US20070082413 Semiconductor memory device with a capacitor formed therein and a method for forming the same
04/12/2007US20070082292 Water-soluble material, chemically amplified resist and pattern formation method using the same
04/12/2007US20070082273 Photomask and image device manufacturing method
04/12/2007US20070082272 Masks, lithography device and semiconductor component
04/12/2007US20070082144 Method for forming thin film pattern, thin film manufacturing device, conductive thin film wiring, electro-optic device, electronic apparatus, and non-contact card medium
04/12/2007US20070081931 abrasive material for polishing silicon oxide layer or silicon nitride layer on silicon substrate; forming a shallow trench isolation; chemical mechanical polishing; obtained via a low-temperature calcination, pulverization, and a high-temperature calcination; high pore fraction and low strength
04/12/2007US20070081881 Substrate processing apparatus and substrate transfer method
04/12/2007US20070081880 Wafer-handling method, system, and apparatus
04/12/2007US20070081879 Discontinuous conveyor system
04/12/2007US20070081423 Time piece with LED light means
04/12/2007US20070081380 Semiconductor Integrated Circuit
04/12/2007US20070081276 Magnetoresistance effect element, magnetic head, magnetic reproducing apparatus, and magnetic memory
04/12/2007US20070081170 Overlay metrology method and apparatus using more than one grating per measurement direction
04/12/2007US20070081161 Alignment method and apparatus and exposure apparatus
04/12/2007US20070081142 Stage base, stage apparatus, exposure apparatus, and device manufacturing method
04/12/2007US20070081136 Exposure apparatus and device fabrication method
04/12/2007US20070080918 Display device
04/12/2007US20070080464 Support structures for semiconductor devices
04/12/2007US20070080459 Semiconductor device including metal interconnection and method for forming metal interconnection
04/12/2007US20070080457 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
04/12/2007US20070080455 Semiconductors and methods of making
04/12/2007US20070080453 Semiconductor chip having a bump with conductive particles and method of manufacturing the same
04/12/2007US20070080452 Bump structure and its forming method
04/12/2007US20070080451 Intermetallic solder with low melting point
04/12/2007US20070080448 Method and structure for optimizing yield of 3-d chip manufacture
04/12/2007US20070080447 Electronic apparatus
04/12/2007US20070080434 Semiconductor package having an interfacial adhesive layer
04/12/2007US20070080425 Method for simultaneous fabrication of a nanocrystal and non-nanocrystal device
04/12/2007US20070080424 Well for CMOS imager and method of formation
04/12/2007US20070080423 Semiconductor device and manufacturing method thereof for reducing the area of the memory cell region
04/12/2007US20070080421 Memory device having highly integrated cell structure and method of its fabrication
04/12/2007US20070080418 Wafer-level chip-scale package of image sensor and method of manufacturing the same
04/12/2007US20070080416 Semiconductor device and a method of manufacturing the same
04/12/2007US20070080411 Semiconductive film with dopant diffusion barrier and tunable work function
04/12/2007US20070080410 Method of forming transistor having recess channel in semiconductor memory, and structure thereof
04/12/2007US20070080408 Method for forming a silicidated contact
04/12/2007US20070080401 Structure and method for forming asymmetrical overlap capacitance in field effect transistors
04/12/2007US20070080400 Low Noise Vertical Variable Gate Control Voltage JFET Device in a BiCMOS Process and Methods to Build this Device
04/12/2007US20070080399 Semiconductor device and production method therefor
04/12/2007US20070080397 Semiconductor device including field effect transistor having asymmetric structure and method of manufacturing the same
04/12/2007US20070080396 Metal oxide semiconductor device and fabricating method thereof
04/12/2007US20070080393 Semiconductor device having n-channel type MOS transistor with gate electrode layer featuring small average polycrystalline silicon grain size
04/12/2007US20070080392 Semiconductor device and method of fabricating the same
04/12/2007US20070080391 Semiconductor device with front side metallization and method for the production thereof
04/12/2007US20070080389 Dynamic control of capacitance elements in field effect structures
04/12/2007US20070080384 Phase change memory devices using magnetic resistance effect, methods of operating and methods of fabricating the same
04/12/2007US20070080380 Self-aligned gate isolation
04/12/2007US20070080368 Nitride semiconductor light-emitting device and method of manufacture thereof
04/12/2007US20070080366 Nitride semiconductor substrate, and method for working nitride semiconductor substrate
04/12/2007US20070080350 Panel for flexible display device and manufacturing method thereof
04/12/2007US20070080340 Variable Capacitor Single-Electron Device
04/12/2007US20070080335 Gettering using voids formed by surface transformation
04/12/2007US20070080246 Electrospray systems and methods
04/12/2007US20070080142 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
04/12/2007US20070080140 Plasma reactor control by translating desired values of m plasma parameters to values of n chamber parameters
04/12/2007US20070080139 Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure
04/12/2007US20070080138 Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of plural chamber parameters
04/12/2007US20070080137 Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure
04/12/2007US20070080136 Etching method and etching equipment
04/12/2007US20070080096 Clean device with clean box-opening/closing device
04/12/2007US20070080057 Plating apparatus, plating cup and cathode ring
04/12/2007US20070079935 Applicators and cooling systems for a plasma device
04/12/2007US20070079934 Gas dispersion plate and manufacturing method therefor
04/12/2007US20070079933 Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
04/12/2007US20070079932 Directed purge for contact free drying of wafers
04/12/2007US20070079927 Buffer layers for organic electroluminescent devices and methods of manufacture and use
04/12/2007US20070079849 Integrated chamber cleaning system
04/12/2007US20070079761 Heat transfer assembly
04/12/2007US20070079488 On-chip bypass capacitor and method of manufacturing the same
04/12/2007DE19960823B4 Verfahren zur Herstellung einer epitaxierten Halbleiterscheibe und deren Verwendung A process for producing an epitaxially coated semiconductor wafer, and the use thereof
04/12/2007DE19758077B4 Einrichtung zum Steuern des Prüfens integrierter Schaltkreise und Verfahren zum Steuern des Prüfens integrierter Schaltkreise Means for controlling the testing of integrated circuits and methods for controlling the testing of integrated circuits
04/12/2007DE19611240B4 Leitfähige Paste auf Silberbasis sowie deren Verwendung als Leiter auf Keramischen Leiterplatten The conductive paste of silver-based, as well as their use as conductors on ceramic circuit boards
04/12/2007DE19527131B4 Halbleitervorrichtung mit einer T-förmigen Gatestruktur und Verfahren zu deren Herstellung A semiconductor device comprising a T-shaped gate structure and process for their preparation
04/12/2007DE112005000735T5 Siliciumelektrodenplatte für ein Plasmaätzen mit überlegener Haltbarkeit Silicon electrode plate for plasma etching with superior durability
04/12/2007DE10393523B4 Behälter zum Lagern einer Vielzahl von Präzision erfordernden Substratscheiben A container for storing a variety of precision-requiring substrate wafers
04/12/2007DE10335385B4 ROM-Speicherzelle und -Baustein sowie Entwurfsverfahren hierfür ROM memory cell and building block design and method therefor
04/12/2007DE10260185B4 Halbleiterspeicher mit vertikalen Charge-trapping-Speicherzellen und Verfahren zu seiner Herstellung A semiconductor memory with vertical charge-trapping memory cells and methods for its preparation
04/12/2007DE102006047169A1 Herstellungsverfahren für Halbleitersubstrate Manufacturing processes for semiconductor substrates
04/12/2007DE102006046386A1 Waferverarbeitungsverfahren und Waferverarbeitungsapparatur Wafer processing method and wafer processing equipment
04/12/2007DE102006045214A1 Halbleitervorrichtung mit einem LDMOS-Transistor und Verfahren zur Herstellung derselben A semiconductor device comprising a LDMOS transistor and method of manufacturing the same
04/12/2007DE102006044369A1 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity
04/12/2007DE102006044368A1 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity
04/12/2007DE102006040784A1 Laserstrahlbearbeitungsmaschine Laser beam processing machine
04/12/2007DE102006035030A1 Verfahren zum Kleben eines Schutzbandes eines Wafers und Klebevorrichtung A method of bonding a protecting tape and a wafer bonding apparatus
04/12/2007DE102006004627B3 Leistungshalbleiterbauelement mit Ladungskompensationsstruktur und Verfahren zur Herstellung desselben Power semiconductor component thereof having charge compensation structure and method for producing
04/12/2007DE102006003393A1 Verfahren zur Kontaktierung von Bitleitungen für nicht-flüchtige Speicherzellen A method for contacting bit lines for non-volatile memory cells
04/12/2007DE102005055280B3 Connecting elements for semiconductor components have mushroom shape with first metal area filling out indentations on top of insulating layer and with second metal area on containing refractory inter-metallic phases of metals of solder
04/12/2007DE102005051414B3 Semiconductor component with wiring substrate and solder balls and production processes has central plastic mass and lower film template for lower solder ball arrangement
04/12/2007DE102005048921A1 Verfahren zum Verbinden zweier Körper, sowie Baugruppe A method for connecting two bodies, as well as assembly
04/12/2007DE102005048826B3 Semiconductor component has pretensioned double-sided adhesive foil between back of semiconductor chip and chip connecting surface with circuit carrier to separate into individual areas without tools
04/12/2007DE102005048482A1 Method for coating electrically insulating surfaces by CVD or PVD e.g. for materials research, involves forming micro-heating elements on ceramic substrate
04/12/2007DE102005048363A1 Method for protection of delicate nano-structures from scratching, e.g. for silicon wafers, involves application of spin-on-glass in several discrete steps
04/12/2007DE102005048361A1 Method for passivating the surface of semiconductor silicon circuits and discrete components involves locally exposing surface of silicon and producing primary needle-like silicon structures by reactive ion etching
04/12/2007DE102005048000A1 Transistor mit zuverlässiger Source-Dotierung und Verfahren zur Herstellung Transistor with reliable source doping and methods for preparing