| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/19/2007 | US20070087495 Photomask and method for manufacturing thin film transistor |
| 04/19/2007 | US20070087494 Method of manufacturing a semiconductor apparatus |
| 04/19/2007 | US20070087493 Trench schottky device with single barrier |
| 04/19/2007 | US20070087492 Method for forming semiconductor film, method for manufacturing semiconductor device and electrooptic device, apparatus for performing the same, and semiconductor device and electrooptic device |
| 04/19/2007 | US20070087491 Transistor and method of fabricating the same |
| 04/19/2007 | US20070087490 Thin film transistor and method of fabricating the same |
| 04/19/2007 | US20070087489 Organic thin film transistor, method of manufacturing the same, and flat panel display comprising the same |
| 04/19/2007 | US20070087488 Semiconductor device and manufacturing method thereof |
| 04/19/2007 | US20070087487 Semiconductor device and manufacturing method thereof |
| 04/19/2007 | US20070087486 Thin-film transistor, TFT-array substrate, liquid-crystal display device and method of fabricating the same |
| 04/19/2007 | US20070087485 Methods for fabricating polysilicon film and thin film transistors |
| 04/19/2007 | US20070087484 Heating Element Of A Printhead Having Resistive Layer Over Conductive Layer |
| 04/19/2007 | US20070087483 Heat sink and method for its production |
| 04/19/2007 | US20070087482 Method and apparatus for operating nonvolatile memory cells with modified band structure |
| 04/19/2007 | US20070087481 Underfill aiding process for a tape |
| 04/19/2007 | US20070087480 Chip package method |
| 04/19/2007 | US20070087479 Method of manufacturing low CTE substrates for use with low-k flip-chip package devices |
| 04/19/2007 | US20070087478 Semiconductor chip package and method for manufacturing the same |
| 04/19/2007 | US20070087477 Semiconductor device having a low-resistance bus interconnect, method of manufacturing same, and display apparatus employing same |
| 04/19/2007 | US20070087476 Apparatus for Improved Power Distribution in Wirebond Semiconductor Packages |
| 04/19/2007 | US20070087475 Method and apparatus for peeling surface protective film |
| 04/19/2007 | US20070087474 Assembly process for out-of-plane MEMS and three-axis sensors |
| 04/19/2007 | US20070087473 Method for manufacturing semiconductor package substrate |
| 04/19/2007 | US20070087472 Methods for magnetically directed self assembly |
| 04/19/2007 | US20070087471 Semiconductor package and method of manufacturing the same |
| 04/19/2007 | US20070087470 Vapor phase synthesis of metal and metal oxide nanowires |
| 04/19/2007 | US20070087469 Particulate for organic and inorganic light active devices and methods for fabricating the same |
| 04/19/2007 | US20070087468 Method for producing electronic components |
| 04/19/2007 | US20070087467 CMOS image sensor |
| 04/19/2007 | US20070087466 Integrated Microphone |
| 04/19/2007 | US20070087465 Micromechanical component having an anodically bonded cap and a manufacturing method |
| 04/19/2007 | US20070087464 Method for producing etched holes and/or etched trenches as well as a diaphragm sensor unit |
| 04/19/2007 | US20070087463 Pixel sensor having doped isolation structure sidewall |
| 04/19/2007 | US20070087462 Method of forming a device package having edge interconnect pad |
| 04/19/2007 | US20070087461 Light emitting diode and method for manufacturing the same |
| 04/19/2007 | US20070087460 Method of fabricating nitride-based semiconductor laser diode |
| 04/19/2007 | US20070087459 Patchwork patterned devices and related methods |
| 04/19/2007 | US20070087458 Semiconductor device and manufacturing method of the same |
| 04/19/2007 | US20070087457 Method for inspecting and mending defect of photo-resist and manufacturing process of printed circuit board |
| 04/19/2007 | US20070087456 Substrate processing method and substrate processing apparatus |
| 04/19/2007 | US20070087455 Independent control of ion density, ion energy distribution and ion dissociation in a plasma reactor |
| 04/19/2007 | US20070087454 Method of fabricating a magnetic shift register |
| 04/19/2007 | US20070087328 Method of Coating Lipid Membranes |
| 04/19/2007 | US20070087299 Heat treatment jig for semiconductor silicon substrate |
| 04/19/2007 | US20070087284 Multipass multiphoton absorption method and apparatus |
| 04/19/2007 | US20070087274 Wiring correction method |
| 04/19/2007 | US20070087230 Method and apparatus for integrated-circuit battery devices |
| 04/19/2007 | US20070087124 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device |
| 04/19/2007 | US20070087122 Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument |
| 04/19/2007 | US20070087079 Method and System for Integrated Circuit Packaging |
| 04/19/2007 | US20070086881 Dual substrate loadlock process equipment |
| 04/19/2007 | US20070086644 Non-lot based method for assembling integrated circuit devices |
| 04/19/2007 | US20070086143 Plasma generator and plasma etching apparatus |
| 04/19/2007 | US20070085986 Exposure apparatus and aberration correction method |
| 04/19/2007 | US20070085953 Flexible electronics using ion implantation to adhere polymer substrate to single crystal silicon substrate |
| 04/19/2007 | US20070085938 Display device, method for manufacturing the same, and television apparatus |
| 04/19/2007 | US20070085905 Method and apparatus for substrate imaging |
| 04/19/2007 | US20070085600 Semiconductor integrated circuit device |
| 04/19/2007 | US20070085599 Potential Detector and Semiconductor Integrated Circuit |
| 04/19/2007 | US20070085595 Semiconductor apparatus |
| 04/19/2007 | US20070085477 Barrier thin film, and organic el element using the barrier thin film |
| 04/19/2007 | US20070085226 Liquid substance supply device for vaporizing system, vaporizer, vaporization performance appraisal method |
| 04/19/2007 | US20070085224 Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor |
| 04/19/2007 | US20070085222 Molded integrated circuit package with exposed active area |
| 04/19/2007 | US20070085219 Method for manufacture of wafer level package with air pads |
| 04/19/2007 | US20070085218 Flip chip package |
| 04/19/2007 | US20070085207 Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor device |
| 04/19/2007 | US20070085206 Chip packaging process |
| 04/19/2007 | US20070085205 Semiconductor device with electroless plating metal connecting layer and method for fabricating the same |
| 04/19/2007 | US20070085203 Multilayer printed wiring board |
| 04/19/2007 | US20070085189 Semiconductor chip and method of manufacturing semiconductor chip |
| 04/19/2007 | US20070085185 Stacked integrated circuit chip assembly |
| 04/19/2007 | US20070085184 Stacked die packaging system |
| 04/19/2007 | US20070085183 Integrated circuit |
| 04/19/2007 | US20070085182 Semiconductor device and fabrication method thereof |
| 04/19/2007 | US20070085180 Image sensor mounted by mass reflow |
| 04/19/2007 | US20070085177 includes a small amount of residual carbon and has a high current density prepared using a composition that includes a nano-sized inorganic material |
| 04/19/2007 | US20070085173 Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages |
| 04/19/2007 | US20070085170 Single crystalline a-plane nitride semiconductor wafer having orientation flat |
| 04/19/2007 | US20070085169 Semiconductor thin film forming method and semiconductor device |
| 04/19/2007 | US20070085167 Heterojunction bipolar transistor and method for manufacturing same |
| 04/19/2007 | US20070085164 Method of Manufacture for a Trench Isolation Structure Having an Implanted Buffer Layer |
| 04/19/2007 | US20070085163 Gallium nitride thin film on sapphire substrate having reduced bending deformation |
| 04/19/2007 | US20070085162 Capping of copper structures in hydrophobic ild using aqueous electro-less bath |
| 04/19/2007 | US20070085154 Forming method and forming system for insulation film |
| 04/19/2007 | US20070085153 Voltage controlled oscillator with a multiple gate transistor and method therefor |
| 04/19/2007 | US20070085150 Non-volatile semiconductor memory device and method of manufacturing the same |
| 04/19/2007 | US20070085147 Semiconductor Device and Manufacturing Method Thereof |
| 04/19/2007 | US20070085139 Semiconductor device |
| 04/19/2007 | US20070085138 Semiconductor device and manufacturing method thereof |
| 04/19/2007 | US20070085134 Semiconductor memory device with increased node capacitance |
| 04/19/2007 | US20070085128 Semiconductor device and method for fabricating the same |
| 04/19/2007 | US20070085127 Semiconductor device and method of manufacturing the same |
| 04/19/2007 | US20070085124 Non-volatile memory device and manufacturing method and operating method thereof |
| 04/19/2007 | US20070085123 Dynamic random access memory and manufacturing method thereof |
| 04/19/2007 | US20070085115 Memory cell, pixel structure and manufacturing process of memory cell for display panels |
| 04/19/2007 | US20070085112 Thin film transistor, display device and liquid crystal display device and method for manufacturing the same |
| 04/19/2007 | US20070085104 Robust Group III Light Emitting Diode for High Reliability in Standard Packaging Applications |
| 04/19/2007 | US20070085099 Semiconductor substrate cutting method |
| 04/19/2007 | US20070085094 Flat panel display with improved white balance |