Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/18/2007EP1525623B8 Semiconductor structure for imaging detectors
04/18/2007EP1483722B1 Memory module assembly using partially defective chips
04/18/2007EP1464088B1 Electroluminescent device
04/18/2007EP1446840B1 Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
04/18/2007EP1444055A4 Tape compositions for the deposition of electronic features
04/18/2007EP1438738A4 Methods and apparatus for patterning a surface
04/18/2007EP1430516B1 Tool for handling wafers and epitaxial growth station
04/18/2007EP1417701B1 Methods of forming capacitor electrodes and capacitor constructions
04/18/2007EP1390978B1 Semiconductor memory device and method for the production thereof
04/18/2007EP1378002B8 Metal-insulator-metal capacitor in copper
04/18/2007EP1316108B1 Fabrication process of a semiconductor device comprising an intermediate low-dielectric silicon nitride film
04/18/2007EP1257879B1 Radiation sensitive copolymers, photoresist compositions thereof and deep uv bilayer systems thereof
04/18/2007EP1226220B1 Polishing system and method of its use
04/18/2007EP1192419B1 Integrated and multi-axis sensor assembly and packaging
04/18/2007EP1171644B1 Method and apparatus for controlling polymerized teos build-up in vacuum pump lines
04/18/2007EP1097468B1 Method and apparatus for processing wafers
04/18/2007EP1085578B1 Method of manufacturing thin-film transistor
04/18/2007CN2891286Y Image sensing and encapsulation structure
04/18/2007CN2891277Y Counter for IC card module
04/18/2007CN2891271Y Wafer positioning and control system for ion implantation machine
04/18/2007CN2891270Y Heat-insulating and gas-supply apparatus in long-life ion source
04/18/2007CN2891269Y Apparatus for insulation between ion source cathode, heating electron gun, and arc chamber
04/18/2007CN2890082Y Wafer chip positioning and controlling system
04/18/2007CN2890081Y Wafer platform scanning device
04/18/2007CN2890080Y Wide range current detection automatic gearshift device of ion implantation machine
04/18/2007CN2890011Y Precise automatic lifting device driven coded motor
04/18/2007CN1951164A Plate storing body for supplying component and component supplying apparatus
04/18/2007CN1950955A Etching of substrates of light emitting devices
04/18/2007CN1950950A Field effect transistor, method for manufacturing the same and electronic device using the field effect transistor
04/18/2007CN1950949A Co-planar thin film transistor having additional source/drain insulation layer
04/18/2007CN1950946A Semiconductor device based on Si-Ge with high stress liner for enhanced channel carrier mobility
04/18/2007CN1950940A Charge-trapping memory cell array and method for production
04/18/2007CN1950939A 半导体装置 Semiconductor device
04/18/2007CN1950938A Heat treatment after a smart-cut separation
04/18/2007CN1950937A Method for improving the quality of a taken thin layer
04/18/2007CN1950936A Transfer robot and transfer apparatus
04/18/2007CN1950935A Resin paste for wafer bonding
04/18/2007CN1950934A Integrated ball and via package and formation process
04/18/2007CN1950933A Coating liquid for forming organic multilayer film, method for manufacturing field effect transistor, and field effect transistor
04/18/2007CN1950932A An improved method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
04/18/2007CN1950931A Gas supply integration unit
04/18/2007CN1950930A Polishing pad and method for manufacture of semiconductor device using the same
04/18/2007CN1950929A Exposure equipment, exposure method and device manufacturing method
04/18/2007CN1950928A Substrate carrier having reduced height
04/18/2007CN1950927A Device for separating and positioning module bridges
04/18/2007CN1950835A Method for manufacturing sheet provided with IC tag, apparatus for manufacturing sheet provided with ICc tag, method for fixing IC chip, apparatus for fixing IC chip, and IC tag
04/18/2007CN1950753A Pattern forming method
04/18/2007CN1950545A Apparatus including showerhead electrode and heater for plasma processing
04/18/2007CN1950542A Yield improvement in silicon-germanium epitaxial growth
04/18/2007CN1950538A Variable quadruple electromagnet array, particularly used in a multi-step process for forming a metal barrier in a sputter reactor
04/18/2007CN1950475A Resin paste for die bonding
04/18/2007CN1949954A Method for making metal wire
04/18/2007CN1949550A Power type package and mfg. method thereof
04/18/2007CN1949546A Method for preparing p type copper sulfide transparent conducting film
04/18/2007CN1949541A Microelectronic device and method of manufacturing a microelectronic device
04/18/2007CN1949540A Semiconductor device and method for fabricating the same
04/18/2007CN1949539A Nitride read only memory device with buried diffusion spacers and method for making the same
04/18/2007CN1949538A Semiconductor device and method for manufacturing the same
04/18/2007CN1949537A Semiconductor element
04/18/2007CN1949535A Non-volatile memory body and operating method and mfg. method thereof
04/18/2007CN1949532A Semiconductor structure and mfg. method thereof
04/18/2007CN1949529A High open rate organic electroluminescence device and mfg. method thereof
04/18/2007CN1949528A Passive electrically testable acceleration and voltage measurement devices and method of manufacture
04/18/2007CN1949527A Wafer level chip scale package of image sensor and manufacturing method thereof
04/18/2007CN1949524A Pixel structure and mfg. method thereof
04/18/2007CN1949523A Non-volatile memory devices and methods of forming the same
04/18/2007CN1949521A Method and apparatus for operating nonvolatile memory cells with modified band structure
04/18/2007CN1949520A Method and apparatus for operating charge trapping nonvolatile memory
04/18/2007CN1949519A Dynamic random access memory and mfg. method thereof
04/18/2007CN1949518A Semiconductor memory device and method of fabricating the same
04/18/2007CN1949511A 显示器件及其制造方法 A display device and manufacturing method thereof
04/18/2007CN1949508A Infrared focal plane detector with antireflective convergence microlens and microlens preparing method
04/18/2007CN1949506A Hybrid module and its manufacturing process
04/18/2007CN1949503A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/18/2007CN1949500A Wiring board, semiconductor device, and method for manufacturing the same
04/18/2007CN1949499A Wiring board, semiconductor device, and method of manufacturing the same
04/18/2007CN1949494A Lead frame for semiconductor device and manufacturing methode thereof
04/18/2007CN1949491A 'N' shape electric connectioned wafer stage chip size packaging structure and mfg. method thereof
04/18/2007CN1949487A Packaging structure of flip-chip on film capable of preventing sealing material from overflow
04/18/2007CN1949486A Semiconductor device, method for assembling semiconductor device
04/18/2007CN1949485A Semiconductor structure and mfg. method thereof
04/18/2007CN1949484A Method for mfg. thin film transistor array substrages
04/18/2007CN1949483A Manufacturing method of semiconductor with recessed shallow trench isolation and storage circuit
04/18/2007CN1949482A Method of fabricating semiconductor memory device having plurality of storage node electrodes
04/18/2007CN1949481A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/18/2007CN1949480A Method for making vertical double diffusion FET compatible conventional FET
04/18/2007CN1949479A Method for mfg. double grid side wall in semiconductor device
04/18/2007CN1949478A Method and system for removing impairment of integrated circuit
04/18/2007CN1949477A Body silicon MEMS and CMOS circuit integrating method capable of removing residual silicon
04/18/2007CN1949476A Method for mfg. organic LED array substrate
04/18/2007CN1949475A Method for mfg. cross array structure orgnaic devices by self-assembling technique
04/18/2007CN1949474A Wiring correction method
04/18/2007CN1949473A Method for forming contact hole of semiconductor device
04/18/2007CN1949472A Semiconductor device and method for producing the same
04/18/2007CN1949471A Fixer for preventing wafer shift in wet corrosion process
04/18/2007CN1949470A Test key with decoder for testing globality of grid oxide of semiconductor device
04/18/2007CN1949469A Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor
04/18/2007CN1949468A Method for interconnecting and packaging 3-D multi-chip module
04/18/2007CN1949467A Coreless substrate and manufacturing method thereof
04/18/2007CN1949466A Method for mfg. semiconductor device and method for removing gap wall