Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/24/2007US7208094 Methods of bridging lateral nanowires and device using same
04/24/2007US7208076 Substrate processing apparatus and method
04/24/2007US7208074 Substrate processing apparatus and substrate plating apparatus
04/24/2007US7208069 Device for etching semiconductors with a large surface area
04/24/2007US7208067 Method and system for monitoring RF impedance to determine conditions of a wafer on an electrostatic chuck
04/24/2007US7208066 Substrate processing apparatus and substrate processing method
04/24/2007US7208065 Structure for measuring the etching speed
04/24/2007US7208058 SOI substrate and manufacturing method thereof
04/24/2007US7208049 Process solutions containing surfactants used as post-chemical mechanical planarization treatment
04/24/2007US7208047 Apparatus and method for thermally isolating a heat chamber
04/24/2007US7208046 Spray coating apparatus and fixtures
04/24/2007US7208043 Silicon semiconductor substrate and preparation thereof
04/24/2007US7208021 Fabrication of close-spaced MEMS devices by method of precise adhesion regulation
04/24/2007US7207878 Conductive polishing article for electrochemical mechanical polishing
04/24/2007US7207864 Polishing apparatus
04/24/2007US7207862 Polishing apparatus and method for detecting foreign matter on polishing surface
04/24/2007US7207777 Methods of handling wind turbine blades and mounting said blades on a wind turbine, system and gripping unit for handling a wind turbine blade
04/24/2007US7207766 Load lock chamber for large area substrate processing system
04/24/2007US7207763 Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system
04/24/2007US7207720 Static gas bearing system, stage mechanism, exposure apparatus, and device manufacturing method
04/24/2007US7207706 Light emitting diode having diffraction grating and planar light source device using the same
04/24/2007US7207442 Die storage tray having machined grooves and vacuum channels
04/24/2007US7207367 Method and apparatus for joining adhesive tape
04/24/2007US7207340 Method and system for removal of gas and plasma processing apparatus
04/24/2007US7207339 Method for cleaning a plasma enhanced CVD chamber
04/24/2007US7207096 Method of manufacturing high performance copper inductors with bond pads
04/19/2007WO2007044934A2 Methods for characterizing semiconductor material using optical metrology
04/19/2007WO2007044896A1 Self-aligned trench filling for narrow gap isolation regions
04/19/2007WO2007044542A2 Method of reducing edge height at the overlap of a layer deposited on a stepped substrate
04/19/2007WO2007044530A2 Methods and apparatus for epitaxial film formation
04/19/2007WO2007044447A2 Composition and method for selectively etching gate spacer oxide material
04/19/2007WO2007044446A1 Oxidizing aqueous cleaner for the removal of post-etch residues
04/19/2007WO2007044324A2 Structure and method for forming asymmetrical overlap capacitance in field effect transistors
04/19/2007WO2007044190A2 Semiconductor device having nano-pillars and method therefor
04/19/2007WO2007044168A1 Methods and apparatus for fabricating conductive features on glass substrates used in liquid crystal displays
04/19/2007WO2007044145A2 Method and apparatus for the low temperature deposition of doped silicon nitride films
04/19/2007WO2007043987A2 Nano-molding process
04/19/2007WO2007043764A1 Atmospheric pressure plasma shower unit, and equipment and method for manufacturing semiconductor package using the same
04/19/2007WO2007043755A1 Rapid freezing/vacuum drying method and apparatus of a semiconductor wafer
04/19/2007WO2007043709A1 Method and apparatus for manufacturing semiconductor device
04/19/2007WO2007043654A1 Chip pickup apparatus, chip pickup method, chip peeling apparatus and chip peeling method
04/19/2007WO2007043646A1 Apparatus and method for processing semiconductor
04/19/2007WO2007043645A1 Process for production of devices
04/19/2007WO2007043644A1 Semiconductor digital circuit, fifo buffer circuit, and data transferring method
04/19/2007WO2007043634A1 Method for manufacturing multilayer wiring
04/19/2007WO2007043562A1 Interconnector, solar battery string using such interconnector, method for manufacturing such solar battery string and solar battery module using such solar battery string
04/19/2007WO2007043556A1 Material for forming film overlying photoresist
04/19/2007WO2007043535A1 Optical characteristic measuring method, exposure method, device manufacturing method, inspecting apparatus and measuring method
04/19/2007WO2007043528A1 Plasma processing apparatus, plasma processing method and tray
04/19/2007WO2007043519A1 Wafer heating apparatus having electrostatic attraction function
04/19/2007WO2007043517A1 Polishing solution for cmp and method of polishing
04/19/2007WO2007043491A1 Semiconductor storage device and method for manufacturing same
04/19/2007WO2007043478A1 Substrate processing apparatus and substrate processing method
04/19/2007WO2007043470A1 Transfer product, transfer product fabricating method, and transfer product arrangement position identifying method
04/19/2007WO2007043419A1 Transistor element, display device and these manufacturing methods
04/19/2007WO2007043414A1 Multilayer reflecting mirror, multilayer reflecting mirror manufacturing method, optical system, exposure apparatus and device manufacturing method
04/19/2007WO2007043355A1 Method of mounting electronic components
04/19/2007WO2007043340A1 Semiconductor device
04/19/2007WO2007043320A1 Fluorescent x-ray analytical method
04/19/2007WO2007043319A1 Semiconductor device
04/19/2007WO2007043312A1 Method for metal silicate film formation and recording medium
04/19/2007WO2007043285A1 Manufacturing method of semiconductor device
04/19/2007WO2007043267A1 Apparatus and method for peeling sheet
04/19/2007WO2007043254A1 Bonding apparatus
04/19/2007WO2007043217A1 Pellicle storing container
04/19/2007WO2007043215A1 HIGH-PURITY Ru ALLOY TARGET, PROCESS FOR PRODUCING THE SAME AND SPUTTERED FILM
04/19/2007WO2007043207A1 Substrate storing apparatus
04/19/2007WO2007043206A1 Semiconductor production apparatus and process
04/19/2007WO2007043205A1 Irradiation unit, method of irradiation and semiconductor device
04/19/2007WO2007043152A1 Semiconductor device and method for manufacturing same
04/19/2007WO2007043128A1 Ferroelectric memory, method of manufacturing the same, and method of manufacturing semiconductor device
04/19/2007WO2007043116A1 Semiconductor device and its fabrication method
04/19/2007WO2007043100A1 Semiconductor device and its fabrication method
04/19/2007WO2007043056A2 Novel integrated circuit support structures and the fabrication thereof
04/19/2007WO2007042850A1 Insulated gate field-effet transistor having a dummy gate
04/19/2007WO2007042797A1 Positive displacement pumping chamber
04/19/2007WO2007042606A1 Measuring method, arrangement and software product
04/19/2007WO2007042521A2 Production of self-organized pin-type nanostructures, and the rather extensive applications thereof
04/19/2007WO2007042520A2 Self-organized pin-type nanostructures, and production thereof on silicon
04/19/2007WO2007042071A1 Assembly comprising at least two components that are electrically conductively operatively connected, and method for producing the assembly
04/19/2007WO2007042017A1 Process and device for the plasma treatment of objects
04/19/2007WO2007027726A3 Conformal coverings for electronic devices
04/19/2007WO2007027473A3 Technique for forming recessed strained drain/source in nmos and pmos transistors
04/19/2007WO2007027473A2 Technique for forming recessed strained drain/source in nmos and pmos transistors
04/19/2007WO2007024714A3 Process for modifying dielectric materials
04/19/2007WO2007019081A3 Application of autonomic self healing composites to integrated circuit packaging
04/19/2007WO2007017763A3 Method of production of a film
04/19/2007WO2007017401A3 Method for integrating functional nanostructures into microelectric and nanoelectric circuits
04/19/2007WO2007016196A3 Directed purge for contact free drying of wafers
04/19/2007WO2007010315A3 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
04/19/2007WO2007001296A3 Method for chemical vapor deposition in high aspect ratio spaces
04/19/2007WO2006138235A3 Compositions and methods for selective removal of metal or metal alloy after metal silicide formation
04/19/2007WO2006127586A3 Methods for forming arrays of small, closely spaced features
04/19/2007WO2006123105A3 Semiconductor device and method of forming a semiconductor device
04/19/2007WO2006118720A3 Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides
04/19/2007WO2006117196A3 Method for growing carbon nanotubes having a predetermined chirality
04/19/2007WO2006081352A3 System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition process
04/19/2007WO2006052955A3 Method of manufacturing rfid devices using fluidic self assembly and a local
04/19/2007WO2006044804A3 Multi chip leadframe package
04/19/2007WO2006044320A3 Overlay measurement target