| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/19/2007 | US20070085093 Light-emitting diode and method for manufacturing same, integrated light-emitting diode and method for manufacturing same, method for growing a nitride-based iii-v group compound semiconductor, substrate for growing a nitride-based iii-v group compound semiconductor, light source cell unit, light-emitting diode backlight, light-emitting diode illuminating device, light-emitting diode display and electronic instrument, electronic device and method for manufacturing same |
| 04/19/2007 | US20070085088 Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array |
| 04/19/2007 | US20070085087 Semiconductor light-emitting device, and image display device and lighting unit comprising same |
| 04/19/2007 | US20070085080 Semiconductor device and method of manufacturing the same |
| 04/19/2007 | US20070085069 Method and apparatus for manufacturing ic chip packaged device |
| 04/19/2007 | US20070085020 Method for controlling charged particle beam, and charged particle beam apparatus |
| 04/19/2007 | US20070084904 Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment |
| 04/19/2007 | US20070084848 Heat treating apparatus and method |
| 04/19/2007 | US20070084829 System for processing a workpiece |
| 04/19/2007 | US20070084828 Polishing composition for a semiconductor substrate |
| 04/19/2007 | US20070084827 Semiconductor processing |
| 04/19/2007 | US20070084826 Method of forming high aspect ratio apertures |
| 04/19/2007 | US20070084824 Thermal inkjet printhead processing with silicon etching |
| 04/19/2007 | US20070084697 Extraction of modular belt carriers of electronic components |
| 04/19/2007 | US20070084562 Plasma processing chamber |
| 04/19/2007 | US20070084561 Device for liquid treatment of wafer-shaped articles |
| 04/19/2007 | US20070084560 Wet processing using a fluid meniscus, apparatus and method |
| 04/19/2007 | US20070084401 Device for carrying out a surface treatment of substrates under vacuum |
| 04/19/2007 | US20070084398 Monocrystalline diamond layer and method for the production thereof |
| 04/19/2007 | US20070084345 Unit for separating gas |
| 04/19/2007 | US20070084043 Conductive Adhesive Attachment of Capacitor Terminals |
| 04/19/2007 | DE4334715B4 Verfahren zur Montage von mit elektrischen Anschlüssen versehenen Bauteilen Method for mounting of components provided with electrical terminals |
| 04/19/2007 | DE19929239B4 Verfahren zur Herstellung von MOS-FET-Halbleiterelementen A process for producing MOS-FET semiconductor elements |
| 04/19/2007 | DE19605634B4 Aktivmatrixanzeigegerät Active matrix display device |
| 04/19/2007 | DE112004002862T5 Verfahren zum Herstellen einer Halbleitervorrichtung und Halbleitervorrichtung A method of manufacturing a semiconductor device and semiconductor device |
| 04/19/2007 | DE112004002858T5 Träger für eine Stapel-Halbleitervorrichtung und Verfahren zum Herstellen derselben The support for a stack-type semiconductor device and method of manufacturing the same |
| 04/19/2007 | DE10341576B4 Verfahren zum Herstellen einer vertikalen Hartmaske A method of manufacturing a vertical hardmask |
| 04/19/2007 | DE10306620B4 Integrierte Testschaltung in einer integrierten Schaltung Integrated test circuit in an integrated circuit |
| 04/19/2007 | DE10213296B9 Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens Electronic component having a semiconductor chip, a process for its preparation and process for the preparation of a benefit |
| 04/19/2007 | DE10203762B4 Nichtflüchtiges Halbleiterspeicherbauelement und Verfahren zu seiner Herstellung A non-volatile semiconductor memory device and method for its preparation |
| 04/19/2007 | DE10203397B4 Chip-Size-Package mit integriertem passiven Bauelement Chip-size package with integrated passive component |
| 04/19/2007 | DE102006045822A1 Herstellungsverfahren für eine integrierte Halbleiterstruktur und entsprechende integrierte Halbleiterstruktur Manufacturing method of an integrated semiconductor structure and corresponding integrated semiconductor structure |
| 04/19/2007 | DE102006040818A1 Siliziumkarbidhalbleitervorrichtung mit hoher Kanalbeweglichkeit und Verfahren zu deren Fertigung Silicon carbide semiconductor device having high channel mobility and process for its manufacturing |
| 04/19/2007 | DE102006028057A1 Vorrichtung zum Lagern von kontaminationsempfindlichen, plattenförmigen Gegenständen, insbesondere zum Lagern von Halbleiterwafern Means for storing contamination-sensitive plate-shaped objects, in particular for the storage of semiconductor wafers |
| 04/19/2007 | DE102005052734A1 Semiconductor structure e.g. diffusion metal oxide semiconductor power transistor, has field electrodes region formed in shape of needle and smaller than maximum extension in direction perpendicular to one of main surfaces of substrate |
| 04/19/2007 | DE102005049111A1 Verfahren zur Herstellung von mikromechanischen Bauteilen in integrierten Schaltungen und Anordnung eines Halbleiters auf einem Substrat A process for preparing micromechanical components in integrated circuits and arrangement of a semiconductor on a substrate |
| 04/19/2007 | DE102005048774A1 Substrate for use as field effect transistor, has intermediate layer formed between coating and surface of substrate or electrically non-conducting layer, where intermediate layer is formed from metal oxide or sulfide |
| 04/19/2007 | DE102005048447A1 Semiconductor power component e.g. bipolar transistor, for high-voltage application, has charge compensation regions with vertically stacked pn-junctions, where sum of breakdown voltages of junctions is smaller than voltage of drift zones |
| 04/19/2007 | DE102005048362A1 Optical radiation methods/devices for converting nano structures has nano structures for improving optical behavior in components/apparatus and/or improving behavior of sensors |
| 04/19/2007 | DE102005048153A1 Halbleiterbauteil mit Halbleiterchip und Klebstofffolie und Verfahren zur Herstellung desselben Of the same semiconductor device with semiconductor chip and the adhesive sheet and method for producing |
| 04/19/2007 | DE102005047856A1 Semiconductor component has component parts comprising a wiring substrate with structured metallization, a ceramic substrate with a structured metal layer, flat conductor framework, a semiconductor chip and bond wires |
| 04/19/2007 | DE102005047106A1 Leistungshalbleitermodul The power semiconductor module |
| 04/19/2007 | DE102005040875B4 Charge-Trapping-Speicher und Verfahren zu dessen Herstellung Charge trapping memory and method for its production |
| 04/19/2007 | DE102004043517B4 Halbleiterspeicherbauelement mit Speicherzellen mit Floating-Gate-Elektrode und Herstellungsverfahren A semiconductor memory device having memory cells with floating gate electrode and production method |
| 04/19/2007 | DE102004003275B4 Halbleiterbauteil mit Verbindungselementen auf Halbleiterchips und Verfahren zur Herstellung derselben A semiconductor device comprising connecting elements to the semiconductor chip and method of manufacturing the same |
| 04/19/2007 | DE10133791B4 Verfahren zur Herstellung eines elektronischen Bauteils A method of manufacturing an electronic component |
| 04/19/2007 | DE10036208B4 Halbleiteraufbau mit vergrabenem Inselgebiet und Konaktgebiet Semiconductor structure buried island region and Konaktgebiet |
| 04/18/2007 | EP1776004A1 Method and device for mounting solder ball |
| 04/18/2007 | EP1775835A2 Method of processing a discrete time input signal |
| 04/18/2007 | EP1775834A2 Method and system for efficient and accurate filtering and interpolation |
| 04/18/2007 | EP1775775A1 Field effect transistor and manufacturing method thereof |
| 04/18/2007 | EP1775771A2 Method for producing shallow trench isolations (STI) of semiconductor devices |
| 04/18/2007 | EP1775768A1 Semiconductor device having three-dimensional stack structure and method for manufacturing the same |
| 04/18/2007 | EP1775767A2 Method of fabricating a vertically montable IC package |
| 04/18/2007 | EP1775764A1 Semiconductor device and electronic device |
| 04/18/2007 | EP1775763A2 Method of forming local interconnects and conductive lines, and resulting structure |
| 04/18/2007 | EP1775762A2 Laminated substrate manufacturing method and laminated substrate manufactured by the method |
| 04/18/2007 | EP1775761A1 Through substrate and interposer, and method for manufacturing through substrate |
| 04/18/2007 | EP1775760A1 Wafer processing tape |
| 04/18/2007 | EP1775758A2 Silicon wafer substrate locking stage and silicon wafer substrate temperature measuring method |
| 04/18/2007 | EP1775757A1 A method and an apparatus for bonding wafers |
| 04/18/2007 | EP1775755A1 Euv light source, euv exposure system, and production method for semiconductor device |
| 04/18/2007 | EP1775754A1 Process system and process liquid supply method |
| 04/18/2007 | EP1775753A2 Lightweight bondhead assembly |
| 04/18/2007 | EP1775649A1 Production system |
| 04/18/2007 | EP1775633A1 Composition for antireflection coating and method for forming pattern using same |
| 04/18/2007 | EP1775355A2 Method of growing a gallium nitride single crystal |
| 04/18/2007 | EP1775339A1 Aqueous cleaning composition and method for using same |
| 04/18/2007 | EP1775337A1 Aqueous cleaning composition for removing residues and method using same |
| 04/18/2007 | EP1775316A1 Polyamide |
| 04/18/2007 | EP1775068A1 Method of adhering polishing pads and jig for adhering the same |
| 04/18/2007 | EP1775059A1 Laser processing method and semiconductor device |
| 04/18/2007 | EP1774596A2 High-voltage nmos-transistor and associated production method |
| 04/18/2007 | EP1774595A1 Laminating system |
| 04/18/2007 | EP1774591A1 An organic ferroelectric or electret device with via connections and a method for its manufacture |
| 04/18/2007 | EP1774590A1 Module integration integrated circuits |
| 04/18/2007 | EP1774589A1 Assembling two substrates by molecular adhesion, one of the two supporting an electrically conductive film |
| 04/18/2007 | EP1774588A1 Assembling two substrates by molecular adhesion |
| 04/18/2007 | EP1774586A1 Isolation trenches for memory devices |
| 04/18/2007 | EP1774585A1 Process system and device for transporting substrates |
| 04/18/2007 | EP1774584A2 Method for the production of an electric component and component |
| 04/18/2007 | EP1774583A2 Method and apparatus for producing co-planar bonding pads on a substrate |
| 04/18/2007 | EP1774582A2 Micro-castellated interposer |
| 04/18/2007 | EP1774581A2 Devices and methodes of making the same |
| 04/18/2007 | EP1774580A2 Method of forming a semiconductor device and structure thereof |
| 04/18/2007 | EP1774579A2 Method for producing a multilayer structure comprising a separating layer |
| 04/18/2007 | EP1774578A1 Systems and methods for charging a cleaning solution used for cleaning integrated circuit substrates |
| 04/18/2007 | EP1774577A2 Silicon-rich nickel-silicide ohmic contacts for sic semiconductor devices |
| 04/18/2007 | EP1774576A1 Integrated circuit comprising a capacitor with metal electrodes, and method of producing one such capacitor |
| 04/18/2007 | EP1774575A2 Biofabrication of transistors including field effect transistors |
| 04/18/2007 | EP1774574A1 System for handling of wafers within a process tool |
| 04/18/2007 | EP1774573A1 Die attach area cut-on-fly method and apparatus |
| 04/18/2007 | EP1774572A2 Method for etching a layer on a substrate |
| 04/18/2007 | EP1774571A2 In-line heater for use in semiconductor wet chemical processing and method of manufacturing the same |
| 04/18/2007 | EP1774547A1 Microfabricated system for magnetic field generation and focusing |
| 04/18/2007 | EP1774542A2 Method for bilayer resist plasma etch |
| 04/18/2007 | EP1774054A1 Variable quadruple electromagnet array, particularly used in a multi-step process for forming a metal barrier in a sputter reactor |
| 04/18/2007 | EP1773959A1 Method of polishing a tungsten-containing substrate |
| 04/18/2007 | EP1773730A2 Method and apparatus for pretreatment of polymeric materials |
| 04/18/2007 | EP1581968A4 Integrated antifuse structure for finfet and cmos devices |