| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/26/2007 | WO2007046773A1 Fabrication of transistors |
| 04/26/2007 | WO2007046654A1 Adaptively coupled plasma source having uniform magnetic field distribution and plasma chamber having the same |
| 04/26/2007 | WO2007046629A1 Semiconductor package sorting method |
| 04/26/2007 | WO2007046582A1 A method for fabricating nanogap and nanogap sensor |
| 04/26/2007 | WO2007046546A1 A method for fabricating a high-k dielectric layer |
| 04/26/2007 | WO2007046523A1 Exposure apparatus and device manufacturing method |
| 04/26/2007 | WO2007046465A1 Nitride semiconductor device and method for manufacturing same |
| 04/26/2007 | WO2007046454A1 Mask blank and method for manufacturing transfer mask |
| 04/26/2007 | WO2007046453A1 Polymers of vinylnaphthalene derivatives, compositions for forming antireflection coatings, and antireflection coatings |
| 04/26/2007 | WO2007046442A1 Novel compound, acid generator, chemical amplification type photoresist composition, resist layer laminate and method of forming resist pattern |
| 04/26/2007 | WO2007046432A1 Method of forming metal oxide film, metal oxide film and optical electronic device |
| 04/26/2007 | WO2007046430A1 Article loading/unloading method and article loading/unloading device, exposure method and exposure apparatus, and method of manufacturing device |
| 04/26/2007 | WO2007046420A1 Cerium oxide slurry, cerium oxide polishing liquid, and method for polishing substrate by using those |
| 04/26/2007 | WO2007046416A1 Electronic component mounting method |
| 04/26/2007 | WO2007046415A1 Exposure apparatus and method of exposure |
| 04/26/2007 | WO2007046414A1 Processing apparatus |
| 04/26/2007 | WO2007046408A1 Plotting device and plotting method |
| 04/26/2007 | WO2007046399A1 Thermosetting resin composition and photosemiconductor encapsulation material |
| 04/26/2007 | WO2007046388A1 Positive resist composition, positive resist composition for thermal flow process, and method for formation of resist patterns |
| 04/26/2007 | WO2007046350A1 Mram operation method |
| 04/26/2007 | WO2007046349A1 Mram and its operation method |
| 04/26/2007 | WO2007046290A1 Semiconductor device and manufacturing method thereof |
| 04/26/2007 | WO2007046268A1 Semiconductor device and method for adjusting characteristics of semiconductor device |
| 04/26/2007 | WO2007046254A1 Mosfet and method for manufacturing mosfet |
| 04/26/2007 | WO2007046234A1 Measuring device |
| 04/26/2007 | WO2007046208A1 Resist composition and method of forming resist pattern |
| 04/26/2007 | WO2007046204A1 Substrate treating apparatus, method of substrate treatment, program, and recording medium in which program is recorded |
| 04/26/2007 | WO2007046190A1 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices |
| 04/26/2007 | WO2007046189A1 Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices |
| 04/26/2007 | WO2007046181A1 Semiconductor thin film and process for producing the same |
| 04/26/2007 | WO2007046169A1 Semiconductor device, thin-film transistor and methods for manufacturing those |
| 04/26/2007 | WO2007046150A1 Fin type semiconductor device and method for manufacturing same |
| 04/26/2007 | WO2007046110A1 A method and apparatus for the formation of patterns on surfaces and an assembly and alignment of the structure thereof |
| 04/26/2007 | WO2007046062A2 Redistribution layer for wafer-level chip scale package and method therefor |
| 04/26/2007 | WO2007045759A1 Treating a germanium layer bonded to a substrate |
| 04/26/2007 | WO2007045658A1 Selective removal of a silicon oxide layer |
| 04/26/2007 | WO2007045532A1 Field effect transistors (fets) with inverted source/drain metallic contacts, and method of fabricating same |
| 04/26/2007 | WO2007045444A1 Hybrid chuck |
| 04/26/2007 | WO2007045331A1 Device for storing contamination-sensitive, flat articles, especially for storing semiconductor wafers |
| 04/26/2007 | WO2007045269A1 Method for cleaning a semiconductor structure and chemistry thereof |
| 04/26/2007 | WO2007045268A1 Method for removing etch residue and chemistry therefor |
| 04/26/2007 | WO2007030332A3 Methods of forming openings into dielectric material |
| 04/26/2007 | WO2007025859A3 Semiconductor structure with a laterally functional construction |
| 04/26/2007 | WO2007011582A3 High density nand non-volatile memory device |
| 04/26/2007 | WO2007008999A3 Localized surface annealing of components for substrate processing chambers |
| 04/26/2007 | WO2007005230A3 Method for removing material from semiconductor wafer and apparatus for performing the same |
| 04/26/2007 | WO2006138370A3 Memory using hole trapping in high-k dielectrics |
| 04/26/2007 | WO2006138246A3 Electronic device package heat sink assembly |
| 04/26/2007 | WO2006137841A3 Asymetric layout structures for transistors and methods of fabricating the same |
| 04/26/2007 | WO2006107414A3 Method of forming an electronic device |
| 04/26/2007 | WO2006101856A3 A plasma enhanced atomic layer deposition system and method |
| 04/26/2007 | WO2006098820A3 Method of forming a semiconductor device having a diffusion barrier stack and structure thereof |
| 04/26/2007 | WO2006086151A3 Consolidated flip chip bga assembly process and apparatus |
| 04/26/2007 | WO2006081003A3 Metal gate transistor for cmos process and method for making |
| 04/26/2007 | WO2006079979A3 A method of manufacturing a semiconductor device |
| 04/26/2007 | WO2006068958A3 Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same |
| 04/26/2007 | WO2006060575A3 Method for forming self-aligned dual salicide in cmos technologies |
| 04/26/2007 | WO2006050051A3 Transistor structure with dual trench for optimized stress effect and method thereof |
| 04/26/2007 | WO2006049780A8 Magnetoresistive random access memory device structures and methods for fabricating the same |
| 04/26/2007 | WO2006026110A3 Yttria insulator ring for use inside a plasma chamber |
| 04/26/2007 | WO2005109487A3 Cystotomy catheter capture device and methods of using same |
| 04/26/2007 | WO2005098091B1 A method of plasma etch endpoint detection using a v-i probe diagnostics |
| 04/26/2007 | US20070094632 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture |
| 04/26/2007 | US20070094625 Net/wiring selection method, net selection method, wiring selection method, and delay improvement method |
| 04/26/2007 | US20070094622 Methods, Apparatus and Computer Program Products for Generating Selective Netlists that Include Interconnection Influences at Pre-Layout and Post-Layout Design Stages |
| 04/26/2007 | US20070093375 Glass ceramics and a method for manufacturing the same |
| 04/26/2007 | US20070093186 Substrate delivery mechanism |
| 04/26/2007 | US20070093079 Imprinting method and imprinting apparatus |
| 04/26/2007 | US20070093078 Porous insulating film, method for producing the same, and semiconductor device using the same |
| 04/26/2007 | US20070093077 Method of forming a trench semiconductor device and structure therefor |
| 04/26/2007 | US20070093076 Electromagnetic treatment in atmospheric-plasma coating process |
| 04/26/2007 | US20070093075 Method for using film formation apparatus |
| 04/26/2007 | US20070093074 Ge-based semiconductor structure fabricated using a non-oxygen chalcogen passivation step |
| 04/26/2007 | US20070093073 Technique for the growth and fabrication of semipolar (Ga,A1,In,B)N thin films, heterostructures, and devices |
| 04/26/2007 | US20070093072 Epitaxial wafer and method for producing same |
| 04/26/2007 | US20070093071 Method and apparatus for processing a wafer |
| 04/26/2007 | US20070093070 Triple layer anti-reflective hard mask |
| 04/26/2007 | US20070093069 Purge process after dry etching |
| 04/26/2007 | US20070093068 Manufacturing method of semiconductor device |
| 04/26/2007 | US20070093067 Wafer edge cleaning process |
| 04/26/2007 | US20070093066 Stacked wafer or die packaging with enhanced thermal and device performance |
| 04/26/2007 | US20070093065 Method for manufacturing a semiconductor wafer |
| 04/26/2007 | US20070093064 Polishing method of Cu film and method for manufacturing semiconductor device |
| 04/26/2007 | US20070093063 Method of chemical mechanical polishing and method of fabricating semiconductor device using the same |
| 04/26/2007 | US20070093062 Semiconductor device fabrication method |
| 04/26/2007 | US20070093061 Solvent removal of photoresist mask and gold impregnated residue and process |
| 04/26/2007 | US20070093060 Semiconductor device having a cu interconnection |
| 04/26/2007 | US20070093059 Method And Apparatus For Thin Film Solar Cell Manufacturing |
| 04/26/2007 | US20070093058 Method for producing electric contact and electrical connector |
| 04/26/2007 | US20070093057 Method of reducing charging damage to integrated circuits during semiconductor manufacturing |
| 04/26/2007 | US20070093056 Method for forming metal line and semiconductor device including the same |
| 04/26/2007 | US20070093055 High-aspect ratio contact hole and method of making the same |
| 04/26/2007 | US20070093054 Multiple device types including an inverted-T channel transistor and method therefor |
| 04/26/2007 | US20070093053 Method of fabricating interconnect structure |
| 04/26/2007 | US20070093052 Semiconductor device have multiple wiring layers and method of producing the same |
| 04/26/2007 | US20070093051 Laminated structure, piezoelectric actuator and method of manufacturing the same |
| 04/26/2007 | US20070093050 Interconnection structures for semiconductor devices and methods of forming the same |
| 04/26/2007 | US20070093049 Electronic interconnects and methods of making same |
| 04/26/2007 | US20070093048 Method for forming metal line of semiconductor device |
| 04/26/2007 | US20070093047 Semiconductor device and method for fabricating the same |