Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/25/2007EP1776743A1 Method for fabricating lateral semiconductor device
04/25/2007EP1776719A2 Integrated circuit with multiple spacer insulating region widths
04/25/2007EP1776717A2 Gripper unit, mounting head, and method for fitting substrates with electrical components
04/25/2007EP1776716A1 Test apparatus
04/25/2007EP1776715A1 Method for forming a gate electrode having a metal
04/25/2007EP1776714A2 Method for etching mesa isolation in antimony based compound semiconductor structures
04/25/2007EP1776607A1 Transmissive element
04/25/2007EP1776300A2 Non-contact support platforms for distance adjustment
04/25/2007EP1776204A2 Sonotrode conveying unit for treating ultrasonic workpieces and method for operating a sonotrode conveying unit
04/25/2007EP1649496B1 Adjusting analog electric circuit outputs
04/25/2007EP1535317A4 High temperature anisotropic etching of multi-layer structures
04/25/2007EP1525586B1 Sublithographic nanoscale memory architecture
04/25/2007EP1485949A4 Novel planarization method for multi-layer lithography processing
04/25/2007EP1483182A4 Reinforced chemical mechanical planarization belt
04/25/2007EP1459358A4 Methods and apparatus for conditioning and temperature control of a processing surface
04/25/2007EP1455961A4 Extrusion tool, method for manufacturing shaped article with fins, and heat sink
04/25/2007EP1425109B1 Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods
04/25/2007EP1388162B1 Universal backplane assembly and methods
04/25/2007EP1386356B1 Fluxless flip chip interconnection
04/25/2007EP1266399A4 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
04/25/2007EP1169896B8 Low stress die attachment
04/25/2007EP1166319B1 Multi-electron -beam lithography apparatus with mutually different beam limiting apertures
04/25/2007EP1147551B1 Method of producing a top gate thin-film transistor
04/25/2007EP1060519B1 Method for producing a mos transistor memory cell
04/25/2007EP1044494A4 Method and apparatus for clamping a substrate
04/25/2007EP1021827B1 Dual damascene metallization
04/25/2007EP1008176B1 Method for making an anisotropic conductive coating with conductive inserts
04/25/2007EP0976147B1 Method for forming a silicide region on a silicon body
04/25/2007CN2893919Y Semiconductor and lead wire bonded chip size encapsulation used thereof
04/25/2007CN2893917Y Structural component with residues adhering treatment surface and substrate treatment chamber including the same
04/25/2007CN2892882Y 真空锁系统 Vacuum lock system
04/25/2007CN1954652A Part feeding head device and part mounting head device
04/25/2007CN1954441A Semiconductor device of high breakdown voltage and manufacturing method thereof
04/25/2007CN1954439A Integration of strained Ge into advanced CMOS technology
04/25/2007CN1954435A STI formation in semiconductor device including SOI and bulk silicon regions
04/25/2007CN1954434A Bitline implant utilizing dual poly
04/25/2007CN1954433A Nrom器件 Nrom devices
04/25/2007CN1954432A Methods and apparatus for wordline protection in flash memory devices
04/25/2007CN1954424A Selectivity control in a plasma processing system
04/25/2007CN1954423A Sawing and handler system for manufacturing semiconductor package
04/25/2007CN1954422A Preparing a surface of a semiconductor wafer for bonding with another wafer
04/25/2007CN1954421A Method of forming strained Si/SiGe on insulator with silicon germanium buffer
04/25/2007CN1954420A Substrate storage container and method of positioning the container
04/25/2007CN1954419A Tape bonding apparatus and tape bonding method and electronic device production method
04/25/2007CN1954418A Semiconductor device and method for fabricating the same, semiconductor substrate and method for producing the same
04/25/2007CN1954417A Method for the creation of an integrated electronic circuit and integrated electronic circuit thus obtained
04/25/2007CN1954416A Dual doped polysilicon and silicon germanium etch
04/25/2007CN1954415A Microcontamination abatement method in semiconductor processing
04/25/2007CN1954414A Gap type conductive interconnecting structure in semiconductor device
04/25/2007CN1954413A Method for cleaning substrate surface
04/25/2007CN1954412A Fabrication of interconnect structures
04/25/2007CN1954411A Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
04/25/2007CN1954410A Separately strained N-channel and P-channel transistors
04/25/2007CN1954409A Implanted counted dopant ions
04/25/2007CN1954408A Exposure apparatus, exposure method, and method for producing device
04/25/2007CN1954407A Exposure method and method for producing device
04/25/2007CN1954406A Projection optical system, exposure apparatus, and exposure method
04/25/2007CN1954403A In-situ monitoring on a spinning-disk ion implanter
04/25/2007CN1954275A 生产系统 Production System
04/25/2007CN1954267A Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof
04/25/2007CN1954265A Antireflective film-forming composition containing vinyl ether compound
04/25/2007CN1954264A Positive photosensitive resin composition, and interlayer dielectrics and micro lenses made therefrom
04/25/2007CN1954263A Formation of metal-insulator-metal capacitor using a hardmask
04/25/2007CN1954095A Treating device and heater unit
04/25/2007CN1954017A Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation
04/25/2007CN1953953A Metal complex comprising beta-diketonato as ligand
04/25/2007CN1953932A Tap unit for a beverage dispenser
04/25/2007CN1953842A Composition for polishing
04/25/2007CN1953635A Independent control of ion density, energy distribution and dissociation in a plasma reactor
04/25/2007CN1953239A Method of manufacturing organic el element, organic el element, and organic el display device
04/25/2007CN1953221A Photoelectric sensor, optical module and method of producing same
04/25/2007CN1953220A A method for preparing indium-gallium-aluminium-nitrogen film and luminescent device on the silicon substrate
04/25/2007CN1953218A Manufacture method for diode light-emitting device and its structure
04/25/2007CN1953210A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/25/2007CN1953209A High voltage semiconductor device, semiconductor device and forming method thereof
04/25/2007CN1953208A Metal-oxide semiconductor transistor component
04/25/2007CN1953207A Memory cell for display, pixel structure and manufacture method for memory cell
04/25/2007CN1953205A Silicon-based one-electron transistor with quantum limit by oxygen injection and its manufacture method
04/25/2007CN1953202A Organic light emitting display device and method of fabricating the same
04/25/2007CN1953201A Electro luminescent display and its manufacture method
04/25/2007CN1953200A Organic emitting device, method for preparing the same and removable display
04/25/2007CN1953195A CMOS image sensor and method for manufacturing the same
04/25/2007CN1953194A CMOS image sensor and method for manufacturing the same
04/25/2007CN1953190A Array substrate, method of manufacturing and liquid crystal display device comprising the same
04/25/2007CN1953189A Thin film transistor, thin film transistor substrate and making method of the same
04/25/2007CN1953188A Liquid-crystal display device with thin-film transistors and method of fabricating the same
04/25/2007CN1953187A Array substrate, method of manufacturing and liquid crystal display device comprising the same
04/25/2007CN1953186A Thin film transistor substrate capable of improving adhesion between laies
04/25/2007CN1953185A System and methods for memory structure comprising embedded flash memory
04/25/2007CN1953184A Semiconductor device and method of manufacturing the same
04/25/2007CN1953183A Non-volatile memory and manufacturing method
04/25/2007CN1953180A Semiconductor integrated circuit and method of designing the same
04/25/2007CN1953176A Direct encapsulation technique of mental base of light-emitting diode
04/25/2007CN1953175A Complex RF device and method for manufacturing the same
04/25/2007CN1953173A Wiring test structures for determining open and short circuits in semiconductor devices and forming method of the same
04/25/2007CN1953171A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/25/2007CN1953170A 半导体器件 Semiconductor devices
04/25/2007CN1953169A Power core devices and methods of making thereof
04/25/2007CN1953167A Semiconductor element
04/25/2007CN1953166A Solder bump structure for flip chip semiconductor devices and method of manufacture therefore