Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/26/2007US20070090479 Controlling bond fronts in wafer-scale packaging
04/26/2007US20070090473 Microelectromechanical component and method for the production thereof
04/26/2007US20070090471 Low threshold voltage semiconductor device with dual threshold voltage control means
04/26/2007US20070090468 Semiconductor device with silicon-film fins and method of manufacturing the same
04/26/2007US20070090466 Methods of forming electronic devices having partially elevated source/drain structures
04/26/2007US20070090457 Thin film transistor substrate for display unit
04/26/2007US20070090455 Electronic device including transistor structures with sidewall spacers and a process for forming the electronic device
04/26/2007US20070090452 Recess channel transistor for preventing deterioration of device characteristics due to misalignment of gate layers and method of forming the same
04/26/2007US20070090451 Lateral dmos transistors including retrograde regions therein and methods of fabricating the same
04/26/2007US20070090450 Semiconductor device with high dielectric constant insulating film and manufacturing method for the same
04/26/2007US20070090448 Systems and methods for memory structure comprising embedded flash memory
04/26/2007US20070090446 Hardmask etch for gate polyetch
04/26/2007US20070090445 Non-Volatile Memory Devices with Wraparound-Shaped Floating Gate Electrodes and Methods of Forming Same
04/26/2007US20070090444 Nonvolatile memory device including nano dot and method of fabricating the same
04/26/2007US20070090443 Method of fabricating a semiconductor device having self-aligned floating gate and related device
04/26/2007US20070090436 Deep trench capacitor
04/26/2007US20070090435 Mos transistor with recessed gate and method of fabricating the same
04/26/2007US20070090434 Power semiconductor device and method therefor
04/26/2007US20070090433 Isolation collar void and methods of forming the same
04/26/2007US20070090432 Method and system for incorporating high voltage devices in an EEPROM
04/26/2007US20070090428 Integrated semiconductor structure for SRAM cells
04/26/2007US20070090427 Semiconductor device and method of manufacturing same
04/26/2007US20070090423 CMOS image sensor
04/26/2007US20070090419 CMOS image sensor and manufacturing method thereof
04/26/2007US20070090418 Method for fabricating a high performance PIN focal plane structure using three handle wafers
04/26/2007US20070090415 Power device with high switching speed and manufacturing method thereof
04/26/2007US20070090407 Thin film transistor array substrate and manufacturing method thereof
04/26/2007US20070090404 Process for the fabrication of thin-film device and thin-film device
04/26/2007US20070090370 Silicon carbide semiconductor device and manufacturing method therefor
04/26/2007US20070090369 Method for manufacturing p-type group iii nitride semiconductor, and group iii nitride semiconductor light-emitting device
04/26/2007US20070090368 Method of manufacturing electro-optical device, electro-optical device, transferred chip, transfer origin substrate, and electronic apparatus
04/26/2007US20070090367 Thin film transistor array panel and manufacturing method thereof
04/26/2007US20070090366 TFT array substrate and photo-masking method for fabricating same
04/26/2007US20070090364 Method of manufacturing an image TFT array for an indirect X-ray sensor and structure thereof
04/26/2007US20070090362 Thin film transistor, method of manufacturing the same and flat panel display having the thin film transistor
04/26/2007US20070090360 Blanket implant diode
04/26/2007US20070090358 Light-emitting device and method for manufacturing the same
04/26/2007US20070090357 Thin film transistor, pixel structure and repairing method thereof
04/26/2007US20070090355 Single separable electrode and self-contained pad viability tester
04/26/2007US20070090349 Organic thin film transistor, flat panel display apparatus comprising the same, and method of manufacturing the organic thin film transistor
04/26/2007US20070090341 Group i-vii semiconductor single crystal thin film and process for producing same
04/26/2007US20070090325 Etching solution for silicon oxide and method of manufacturing a semiconductor device using the same
04/26/2007US20070090094 Polishing with a composition of an abrasive, hydrogen peroxide, an organic acid, a heterocyclic compound, a phosphonic acid, and water
04/26/2007US20070090093 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, control program and computer storage medium
04/26/2007US20070090092 Method and device for removing layers in some areas of glass plates
04/26/2007US20070090091 chemical, plasma vapor deposition; atomic layer deposition
04/26/2007US20070090090 Dry etching method
04/26/2007US20070090088 Methods And Systems For Laser Processing
04/26/2007US20070090032 Plasma treatment apparatus
04/26/2007US20070089852 Heating and cooling apparatus, and vacuum processing apparatus equipped with this apparatus
04/26/2007US20070089836 Semiconductor process chamber
04/26/2007US20070089835 Method and apparatus for measuring electron density of plasma and plasma processing apparatus
04/26/2007US20070089817 Method for providing gas to a processing chamber
04/26/2007US20070089671 Yield and line width performance for liquid polymers and other materials
04/26/2007US20070089669 Apparatus and method for growth of a thin film
04/26/2007US20070089385 Film deposition apparatus having hole-like rotary filter plate for capturing fine particles and film deposition method
04/26/2007US20070089291 Electronic part mounting substrate and method for producing same
04/26/2007DE19929859B4 Herstellungsverfahren für Trenchkondensator Preparation process for trench capacitor
04/26/2007DE19525521B4 Verfahren zum Reinigen von Substraten A method for cleaning substrates
04/26/2007DE112005001296T5 Halbleitervorrichtung mit reduziertem Kontaktwiderstand A semiconductor device with reduced contact resistance
04/26/2007DE112005001294T5 Halbleiteroberflächenprüfungsvorrichtung sowie Beleuchtungsverfahren Semiconductor surface inspection apparatus and method of illumination
04/26/2007DE112005001179T5 Verbesserte dielektrische Passivierung für Halbleiterbauelemente Improved dielectric passivation for semiconductor devices
04/26/2007DE10345447B4 Verfahren zum Herstellen eines Halbleiter-Bauteils A method of manufacturing a semiconductor device
04/26/2007DE10314504B4 Verfahren zur Herstellung einer nitridhaltigen Isolationsschicht durch Kompensieren von Stickstoffungleichförmigkeiten A method of manufacturing a nitride-insulating layer by compensating Stickstoffungleichförmigkeiten
04/26/2007DE10303449B4 Verfahren zum Umhüllen eines elektronischen Bauelementes Process for coating an electronic component
04/26/2007DE10255623B4 Verfahren zum Justieren eines Wafers in einem Photolithographieverfahren Method for adjusting a wafer in a photolithography process
04/26/2007DE10254457B4 Verfahren zur Herstellung einer von einem Träger abgelösten Halbleiterschicht A process for producing a carrier from a detached semiconductor layer
04/26/2007DE10246389B4 Verfahren zum Herstellen eines Trench-Halbleiterbauelements A method of manufacturing a trench semiconductor device
04/26/2007DE10208787B4 Verfahren zum Füllen von teilweise bauchigen tiefen Gräben oder tiefen Gräben mit einer Flankensteilheit von 90° oder größer und dieses verwendende Verfahren zur Herstellung von MOS-Feldeffekttransistoren und IGBTs Method for filling partially bulbous deep trenches or deep trenches with a slope of 90 ° or greater, and this method used for the production of MOS field-effect transistors and IGBTs
04/26/2007DE102006049613A1 Flash memory device fabrication by forming gate electrode of string selection transistor on substrate between two trench isolation regions, forming trenches, forming inter-gate dielectric layer segments, and forming string selection line
04/26/2007DE102006045126A1 Fabricating connection electrode e.g. for power MOSFET or IGBT, requires forming electrode layer on side-walls and floor of trench
04/26/2007DE102006041436A1 Electron beam dosage computing method for e.g. electron beam lithographic device, involves utilizing parameter values to create illustration of basic dosages of beams and to prepare illustration of proximity effect correction coefficients
04/26/2007DE102006030866A1 Bearbeitungsverfahren für einen Halbleiterwafer A method for processing a semiconductor wafer
04/26/2007DE102006017525A1 Semiconductor storage device, has number of land-contact surfaces made of insulating material and with prescribed width and length
04/26/2007DE102005052055B3 Transistor and semiconductor components and production process for thin film silicon on insulator transistor has embedded deformed layer
04/26/2007DE102005051332A1 Semiconductor substrate for producing semiconductor component, includes monocrystalline material having crystal structure compressed in areas with extrinsic, permanent curvature
04/26/2007DE102005051036A1 Method for fabricating an integrated module, requires housing material for functioning together holding structure in substrate
04/26/2007DE102005049598A1 Hybrid Chuck Hybrid Chuck
04/26/2007DE102005049279B3 Halbleiterspeicherbauelement und Herstellungsverfahren The semiconductor memory device and manufacturing method
04/26/2007DE102005048197B3 Halbleiterspeicherbauelement mit vergrabenen Bitleitungen und selbstjustierenden Bitleitungskontakten und dessen Herstellungsverfahren The semiconductor memory device with buried bit lines and self-aligned bit line and its manufacturing method
04/26/2007DE102005041225B3 Verfahren zur Herstellung vertiefter verformter Drain/Source-Gebiete in NMOS- und PMOS-Transistoren A process for producing a deformed recessed drain / source regions in the NMOS and PMOS transistors
04/25/2007EP1777756A1 Semiconductor light emitting device, wafer for semiconductor light emitting device, and method of preparing the same
04/25/2007EP1777752A2 Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
04/25/2007EP1777751A2 Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
04/25/2007EP1777750A2 Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
04/25/2007EP1777742A2 Semiconductor chip with through via and method of manufacturing the semiconductor chip
04/25/2007EP1777739A2 Semiconductor device and fabrication method therefor
04/25/2007EP1777738A1 Component mounting method and component mounting apparatus
04/25/2007EP1777737A1 High-electron-mobility transistor, field-effect transistor, epitaxial substrate, method for manufacturing epitaxial substrate, and method for manufacturing group iii nitride transistor
04/25/2007EP1777736A1 Electrolytic processing device and substrate processing apparatus
04/25/2007EP1777735A2 Recycling process of an epitaxial donor wafer
04/25/2007EP1777734A2 Method and apparatus for peeling a surface protective film
04/25/2007EP1777733A2 Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer
04/25/2007EP1777714A1 Design of low inductance embedded capacitor layer connections
04/25/2007EP1777581A2 Fabrication of a wiring pattern and of an active matrix substrate
04/25/2007EP1777511A2 Scanning system for inspecting anomalies on surfaces
04/25/2007EP1777325A2 Single crystalline a-plane nitride semiconductor wafer having orientation flat
04/25/2007EP1777278A1 Adhesive composition and sheet having an adhesive layer of the composition
04/25/2007EP1777203A1 Ceramic film and method of manufacturing the same, ferroelectric capacitor, semiconductor device, and other element
04/25/2007EP1777194A2 Method for forming microelectronic spring structures on a substrate