Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/01/2007US7211481 Method to strain NMOS devices while mitigating dopant diffusion for PMOS using a capped poly layer
05/01/2007US7211480 Semiconductor device with shallow trench isolation and its manufacture method
05/01/2007US7211479 Silicon rich barrier layers for integrated circuit devices
05/01/2007US7211478 Diagonal deep well region for routing body-bias voltage for MOSFETS in surface well regions
05/01/2007US7211477 High voltage field effect device and method
05/01/2007US7211476 Semiconductor device and method of manufacturing the same
05/01/2007US7211475 CMOS thin film transistor
05/01/2007US7211474 SOI device with body contact self-aligned to gate
05/01/2007US7211473 Method and structure for controlling floating body effects
05/01/2007US7211472 Method for producing a multichip module and multichip module
05/01/2007US7211471 Exposed lead QFP package fabricated through the use of a partial saw process
05/01/2007US7211470 Method and apparatus for depositing conductive paste in circuitized substrate openings
05/01/2007US7211469 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
05/01/2007US7211468 Method for encapsulating a plurality of electronic components
05/01/2007US7211467 Method for fabricating leadless packages with mold locking characteristics
05/01/2007US7211466 Stacked die semiconductor device
05/01/2007US7211465 Method of using capacitive bonding in a high frequency integrated circuit
05/01/2007US7211464 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
05/01/2007US7211463 Process to improve carrier mobility of organic semiconductor
05/01/2007US7211462 Process for large-scale production of CdTe/CdS thin film solar cells
05/01/2007US7211461 Manufacturing apparatus
05/01/2007US7211460 Methods for exposing device features on a semiconductor device
05/01/2007US7211459 Fabrication method of an ion sensitive field effect transistor
05/01/2007US7211458 Methods of fabricating strained semiconductor-on-insulator field-effect transistors and related devices
05/01/2007US7211457 Transflective LCD (liquid crystal display) panel and method of constructing the same
05/01/2007US7211456 Method for electro-luminescent display fabrication
05/01/2007US7211455 Method for manufacturing semiconductor module
05/01/2007US7211454 Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate
05/01/2007US7211453 Method and apparatus for personalization of semiconductor
05/01/2007US7211452 Method and apparatus for uniformity and brightness correction in an OLED display
05/01/2007US7211451 Process for producing a component module
05/01/2007US7211450 System and method for detection of spatial signature yield loss
05/01/2007US7211449 Enhanced uniqueness for pattern recognition
05/01/2007US7211448 Semiconductor device manufacturing method capable of reliable inspection for hole opening and semiconductor devices manufactured by method
05/01/2007US7211447 Structure and method to fabricate high performance MTJ devices for MRAM applications
05/01/2007US7211446 Method of patterning a magnetic tunnel junction stack for a magneto-resistive random access memory
05/01/2007US7211371 Gate electrode wiring, transparent conducting electrode, and the first electrode of the storage capacity are formed while the first mask is processing. selective deposition of the first metal wiring, photo-resist lift-off
05/01/2007US7211370 exposing a photoresist coating to radiation that penetrates the wafer, at the side having the electronic circuits along the dicing lines, developing the resist to selectively remove the exposed material along the dicing lines, and dicing by etching
05/01/2007US7211365 Negative photoresists for short wavelength imaging
05/01/2007US7211354 Mask substrate and its manufacturing method
05/01/2007US7211337 Compound crystal and method of manufacturing same
05/01/2007US7211295 Heating a reaction chamber to a predetermined temperature, the reaction chamber containing an object to be processed having a surface provided with at least a silicon layer, energizing a gas prior to reaching the reaction chamber to produce water, forming silicon dioxide film
05/01/2007US7211215 Mould, encapsulating device and method of encapsulation
05/01/2007US7211200 Wet etch for selectively removing a metal nitride extrusion comprising: an oxidizing agent; a chelating agent; and at least a portion of a metal nitride extrusion that results from the selective dissolution of the metal nitride
05/01/2007US7211197 Exposure layer of copper by etching ,with gas, silicon nitride layer; using mixture of trifluoromethane and oxygen; suppression oxidation
05/01/2007US7211196 Method and system of discriminating substrate type
05/01/2007US7211195 Method for providing a liftoff process using a single layer resist and chemical mechanical polishing and sensor formed therewith
05/01/2007US7211186 Forming conductive layers on a semiconductor wafer surface without losing space on the surface by clamping; a relative motion, rotational and lateral, established between the contacts and the wafer surface; consistancy
05/01/2007US7211174 Method and system to provide electrical contacts for electrotreating processes
05/01/2007US7211170 Twist-N-Lock wafer area pressure ring and assembly
05/01/2007US7211168 Substrate supporting plate and stripping method for supporting plate
05/01/2007US7211156 Method for cleaning a ceramic member for use in a system for producing semiconductors, a cleaning agent and a combination of cleaning agents
05/01/2007US7211155 Apparatuses and methods for cleaning test probes
05/01/2007US7211154 Electrode-built-in susceptor
05/01/2007US7211153 Ceramic joined body, substrate holding structure and substrate processing apparatus
05/01/2007US7211152 Heating element CVD system and connection structure between heating element and electric power supply mechanism in the heating element CVD system
05/01/2007US7211145 Substrate processing apparatus and substrate processing method
05/01/2007US7211144 Pulsed nucleation deposition of tungsten layers
05/01/2007US7211143 Sacrificial template method of fabricating a nanotube
05/01/2007US7211122 Polishing composition and rinse composition
05/01/2007US7210987 Wafer grinding method
05/01/2007US7210979 Apparatus and method for manufacturing organic EL display device
05/01/2007US7210925 Heat treatment jig for silicon semiconductor substrate
05/01/2007US7210924 Heat treatment system and a method for cooling a loading chamber
05/01/2007US7210864 Coating and developing apparatus
05/01/2007US7210807 Optical semiconductor device and method of manufacturing optical semiconductor device
05/01/2007US7210589 Transport apparatus
05/01/2007US7210424 High-density plasma processing apparatus
05/01/2007US7210246 Methods and systems for handling a workpiece in vacuum-based material handling system
05/01/2007US7210224 Method for forming an antifuse
05/01/2007CA2403231C Vertical electrical interconnections in a stack
05/01/2007CA2282486C Inspection system
04/2007
04/26/2007WO2007048108A2 Monolithically-pumped erbium-doped waveguide amplifiers and lasers
04/26/2007WO2007047949A2 Methods for growing carbon nanotubes on single crystal substrates
04/26/2007WO2007047928A2 Superlattice and turbostratically disordered thermoelectric materials
04/26/2007WO2007047888A2 Method and apparatus for converting precursor layers into photovoltaic absorbers
04/26/2007WO2007047822A2 Nanoporous low-k films with infiltrated porosity
04/26/2007WO2007047808A2 Stacked integrated circuit chip assembly
04/26/2007WO2007047713A2 Trench schottky device with single barrier
04/26/2007WO2007047565A2 Patterned devices and related methods
04/26/2007WO2007047547A2 Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material
04/26/2007WO2007047536A2 Method and apparatus for flag-less wafer bonding tool
04/26/2007WO2007047429A1 A cmos device with zero soft error rate
04/26/2007WO2007047390A2 Integration process flow for flash devices
04/26/2007WO2007047369A2 Method for fabricating a gate dielectric of a field effect transistor
04/26/2007WO2007047284A1 Reduction of iso-dense field thickness bias through gas jet for gapfill process
04/26/2007WO2007047272A1 Camera based pin grid array (pga) inspection system with pin base mask and low angle lighting
04/26/2007WO2007047265A1 Bit line implant
04/26/2007WO2007047186A2 A method for fabricating a high performance pin focal plane structure using three handle wafers
04/26/2007WO2007047165A2 Programmable fuse with silicon germanium
04/26/2007WO2007047164A2 Voltage controlled oscillator with a multiple gate transistor and method therefor
04/26/2007WO2007047095A2 Integrated chamber cleaning system
04/26/2007WO2007047019A1 Method for fabricating silicon nitride spacer structures
04/26/2007WO2007046945A2 Product-related feedback for process control
04/26/2007WO2007046936A2 P-n junction diode and method of manufacturing the same
04/26/2007WO2007046930A1 Semiconductor film composition
04/26/2007WO2007046922A1 Controlling bond fronts in wafer-scale packaging
04/26/2007WO2007046920A1 Self-aligned gate isolation
04/26/2007WO2007046883A1 One-time programmable crosspoint memory with a diode as an antifuse
04/26/2007WO2007046852A2 Discretized processing and process sequence integration of substrate regions