Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/22/2007US7221994 Operational model for simulating manufacture flow and simulating method thereof
05/22/2007US7221993 Systems and methods for transferring small lot size substrate carriers between processing tools
05/22/2007US7221991 System and method for monitoring manufacturing apparatuses
05/22/2007US7221788 Method of inspecting a mask or reticle for detecting a defect, and mask or reticle inspection system
05/22/2007US7221614 Stacked semiconductor memory device
05/22/2007US7221596 pFET nonvolatile memory
05/22/2007US7221583 Magnetic film, multilayer magnetic film, method and mechanism of magnetization inversion of magnetic film, and magnetic random access memory
05/22/2007US7221576 Dynamic RAM-and semiconductor device
05/22/2007US7221553 Substrate support having heat transfer system
05/22/2007US7221501 Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
05/22/2007US7221486 Method and apparatus for picking up 2D image of an object to be sensed
05/22/2007US7221460 Optical system in exposure apparatus, and device manufacturing method
05/22/2007US7221431 Exposure apparatus
05/22/2007US7221430 Lithographic apparatus and device manufacturing method
05/22/2007US7221214 Delay value adjusting method and semiconductor integrated circuit
05/22/2007US7221211 Semiconductor integrated circuit apparatus
05/22/2007US7221184 Semiconductor device with bus terminating function
05/22/2007US7221177 Probe apparatus with optical length-measuring unit and probe testing method
05/22/2007US7221176 Vacuum prober and vacuum probe method
05/22/2007US7221174 Probe holder for testing of a test device
05/22/2007US7221091 Organic electroluminescent display device and method of fabricating the same
05/22/2007US7221059 Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
05/22/2007US7221058 Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip
05/22/2007US7221057 Stacked IC device having functions for selecting and counting IC chips
05/22/2007US7221056 Semiconductor integrated circuit device and manufacturing method thereof
05/22/2007US7221054 Bump structure
05/22/2007US7221049 Circuit device and manufacturing method thereof
05/22/2007US7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
05/22/2007US7221039 Thin film transistor (TFT) device structure employing silicon rich silicon oxide passivation layer
05/22/2007US7221038 Method of fabricating substrates and substrates obtained by this method
05/22/2007US7221035 Semiconductor structure avoiding poly stringer formation
05/22/2007US7221034 Semiconductor structure including vias
05/22/2007US7221033 Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
05/22/2007US7221030 Semiconductor device
05/22/2007US7221029 Semiconductor device and semiconductor memory using the same
05/22/2007US7221028 High voltage transistor and method of manufacturing the same
05/22/2007US7221026 Computer systems containing resistors which include doped silicon/germanium
05/22/2007US7221023 Asymmetric source/drain transistor employing selective epitaxial growth (SEG) layer and method of fabricating same
05/22/2007US7221020 Method to construct a self aligned recess gate for DRAM access devices
05/22/2007US7221018 NROM flash memory with a high-permittivity gate dielectric
05/22/2007US7221016 Semiconductor device with memory function and method of manufacture
05/22/2007US7221015 Semiconductor device and method of manufacturing the same
05/22/2007US7221014 DRAM devices having an increased density layout
05/22/2007US7221013 Semiconductor device
05/22/2007US7221011 High-voltage vertical transistor with a multi-gradient drain doping profile
05/22/2007US7221010 Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors
05/22/2007US7221009 Semiconductor device
05/22/2007US7221008 Bitline direction shielding to avoid cross coupling between adjacent cells for NAND flash memory
05/22/2007US7221005 Negative resistance field-effect device
05/22/2007US7221002 Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element
05/22/2007US7221001 Semiconductor light-emitting device and process for producing the same
05/22/2007US7220995 Substrate for electronic device, electronic device and methods of manufacturing same
05/22/2007US7220994 In plane switching mode liquid crystal display device
05/22/2007US7220993 Thin film transistor having a metal induced lateral crystallization region and method for fabricating the same
05/22/2007US7220990 Technique for evaluating a fabrication of a die and wafer
05/22/2007US7220985 Self aligned memory element and wordline
05/22/2007US7220984 Influence of surface geometry on metal properties
05/22/2007US7220976 Ion source and ion implanter having the same
05/22/2007US7220975 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device
05/22/2007US7220969 Mask blanks inspection tool
05/22/2007US7220937 Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination
05/22/2007US7220922 Electronic component, component mounting equipment, and component mounting method
05/22/2007US7220921 Sheet-like board member and method of manufacturing a semiconductor device
05/22/2007US7220788 Fluororubber molded article and method for producing the same
05/22/2007US7220785 Anisotropically conductive adhesive comprising crushable microcapsules adhered to a surface of conductive particles
05/22/2007US7220714 comprises carbon dioxide, additive (tetramethylammoniumfluoride) for removing residues, inhibitor (ethylene glycol) of residues, and co-solvent for dissolving additive and inhibitor in carbon dioxide at pressurized fluid conditions; for removal of photoresists during semiconductor processing
05/22/2007US7220690 Glass ceramic having a low thermal expansion
05/22/2007US7220687 Method to improve water-barrier performance by changing film surface morphology
05/22/2007US7220686 Process for contact opening definition for active element electrical connections
05/22/2007US7220685 Method for depositing porous films
05/22/2007US7220684 Semiconductor device and method of manufacturing the same
05/22/2007US7220683 Transparent amorphous carbon structure in semiconductor devices
05/22/2007US7220682 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate
05/22/2007US7220681 Semiconductor device and method of fabricating the same
05/22/2007US7220680 Method for photolithography in semiconductor manufacturing
05/22/2007US7220679 Method for forming patterns in a semiconductor device
05/22/2007US7220678 Method for etching of a silicon substrate and etching apparatus
05/22/2007US7220677 WAT process to avoid wiring defects
05/22/2007US7220676 Carboxylic acids having either hydroxyl or mercapto groups, monocarboxylic acids, dicarboxylic acids and salts thereof, an abrasive and water; reducing edge rounding (roll-off) of hard discs to increase recording capacity; polishing
05/22/2007US7220675 Method of forming metal wiring of semiconductor device
05/22/2007US7220674 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
05/22/2007US7220673 Method for depositing tungsten-containing layers by vapor deposition techniques
05/22/2007US7220672 Semiconductor device comprising metal silicide films formed to cover gate electrode and source-drain diffusion layers and method of manufacturing the same
05/22/2007US7220671 Organometallic precursors for the chemical phase deposition of metal films in interconnect applications
05/22/2007US7220670 Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same
05/22/2007US7220669 Thin films for magnetic device
05/22/2007US7220667 Semiconductor device and method of fabricating the same
05/22/2007US7220666 Interconnection element for BGA housings and method for producing the same
05/22/2007US7220665 H2 plasma treatment
05/22/2007US7220664 Fabrication method for semiconductor structure in a substrate, the semiconductor structure having at least two regions that are to be patterned differently
05/22/2007US7220663 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
05/22/2007US7220662 Fully silicided field effect transistors
05/22/2007US7220661 Method of manufacturing a Schottky barrier rectifier
05/22/2007US7220660 Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
05/22/2007US7220659 Method for manufacturing a semiconductor device
05/22/2007US7220658 Growth of reduced dislocation density non-polar gallium nitride by hydride vapor phase epitaxy
05/22/2007US7220657 Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device
05/22/2007US7220656 Strained semiconductor by wafer bonding with misorientation
05/22/2007US7220655 Method of forming an alignment mark on a wafer, and a wafer comprising same
05/22/2007US7220654 Method for manufacturing semiconductor substrate
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