Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/24/2007WO2007058781A2 Method of fabricating an exposed die package
05/24/2007WO2007058774A1 Polishing process for producing damage free surfaces on semi-insulating silicon carbide wafers
05/24/2007WO2007058720A1 Method for fabricating controlled stress silicon nitride films
05/24/2007WO2007058715A2 Method of fabricating a silicon nitride stack
05/24/2007WO2007058693A1 Method of automatically carrying ic-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester
05/24/2007WO2007058459A1 Pick and place apparatus
05/24/2007WO2007058416A1 Apparatus for removing particle for an exposure system
05/24/2007WO2007058365A1 Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film
05/24/2007WO2007058354A1 Exposure method and device manufacturing method using the same, exposure apparatus, and substrate treatment method and apparatus
05/24/2007WO2007058345A1 Radiation-sensitive resin composition
05/24/2007WO2007058329A1 Semiconductor device and manufacturing method thereof
05/24/2007WO2007058315A1 Stocker
05/24/2007WO2007058286A1 Method and apparatus for cleaning substrate
05/24/2007WO2007058284A1 Wet etching method and wet etching apparatus
05/24/2007WO2007058265A1 Bipolar transistor and its manufacturing method
05/24/2007WO2007058262A1 Laser processing method
05/24/2007WO2007058240A1 Substrate processing method, photomask manufacturing method, photomask and device manufacturing method
05/24/2007WO2007058231A1 Semiconductor thin film, method for producing same, thin film transistor and active-matrix-driven display panel
05/24/2007WO2007058188A1 Exposure apparatus, exposure method and device manufacturing method
05/24/2007WO2007058159A1 Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method
05/24/2007WO2007058151A1 Plane position detecting apparatus, exposure apparatus and device manufacturing method
05/24/2007WO2007058148A1 Aluminum member or aluminum alloy member with excellent corrosion resistance
05/24/2007WO2007058144A1 Hot electron transistor
05/24/2007WO2007058120A1 Process for producing semiconductor device and substrate treatment apparatus
05/24/2007WO2007058088A1 Semiconductor integrated circuit
05/24/2007WO2007058068A1 Heating apparatus, heat treatment apparatus, computer program and storage medium
05/24/2007WO2007058051A1 Alloyed fluorocopolymer
05/24/2007WO2007058042A1 Semiconductor device and method for manufacturing same
05/24/2007WO2007058034A1 Packaging body
05/24/2007WO2007057990A1 Electronic component test equipment and method for loading performance board on the electronic component test equipment
05/24/2007WO2007057982A1 Au-Sn ALLOY BUMP HAVING NO TRAPPED-IN LARGE VOID AND PROCESS FOR PRODUCING THE SAME
05/24/2007WO2007057954A1 Semiconductor device and method for manufacturing same
05/24/2007WO2007057944A1 Electronic component test equipment and method for loading performance board on the electronic component test equipment
05/24/2007WO2007057803A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
05/24/2007WO2007057796A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
05/24/2007WO2007057795A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
05/24/2007WO2007057381A1 Treating a sige layer for selective etching
05/24/2007WO2007057357A2 Semiconductor devices having complementary multiple-gate transistors with different gate dielectrics and methods of manufacture thereof
05/24/2007WO2007057318A1 Process for temporary fixing of a polymeric layer material on rough surfaces
05/24/2007WO2007057048A1 Method for forming a semiconductor device having a salicide layer
05/24/2007WO2007056875A1 Transporting apparatus for disc-shaped workpieces
05/24/2007WO2007041710A3 Gallium nitride material transistors and methods for wideband applications
05/24/2007WO2007037504A9 Method for producing group 3-5 nitride semiconductor and method for manufacturing light-emitting device
05/24/2007WO2007032149A9 High-frequency device using magnetic multi-layer film dot
05/24/2007WO2007027648A3 Flash memory with recessed floating gate
05/24/2007WO2007011451A3 Aqueous microfabrication of functional bioelectronic architectures
05/24/2007WO2007004595A3 Semiconductor device and manufacturing method thereof
05/24/2007WO2007002043A9 Semiconductor device including shallow trench isolation (sti) regions with a superlattice therebetween and associated methods
05/24/2007WO2006115576A3 Semiconductor die edge reconditioning
05/24/2007WO2006112995A3 Glass-based semiconductor on insulator structures and methods of making same
05/24/2007WO2006104578A3 Manufacturing ccds in a conventional cmos process
05/24/2007WO2006102429A3 Above room temperature ferromagnetic silicon
05/24/2007WO2006078281A3 Systems and methods for harvesting and integrating nanowires
05/24/2007WO2006060134A8 Restricted radiated heating assembly for high temperature processing
05/24/2007WO2006029388A3 Method and apparatus for fabricating low-k dielectrics, conducting films, and strain-controlling conformable silica-carbon materials
05/24/2007WO2004102634A3 Metal mems devices and methods of making same
05/24/2007WO2004077523A3 Micromachined assembly with a multi-layer cap defining cavity
05/24/2007US20070118828 Generation of metal holes by via mutation
05/24/2007US20070118824 Methods, systems, and computer program products for improving yield in integrated circuit device fabrication and related devices
05/24/2007US20070118349 Generation and use of integrated circuit profile-based simulation information
05/24/2007US20070118341 Simulation apparatus, simulation method, and computer program product
05/24/2007US20070118242 System and method for product yield prediction
05/24/2007US20070117892 Coating composition, porous silica-based film, method for producing porous silica-based film and semiconductor device
05/24/2007US20070117876 Alkali-soluble resin containing fluorenediphenoxy residues; photopolymerizable monomer (dipentaerythritol hexaacrylate); photoinitiator; solvent; black pigment; coatable on a liquid crystal display substrate by slit coating; heat resistance
05/24/2007US20070117414 Methods and apparatus for epitaxial film formation
05/24/2007US20070117413 Process for the production of a nitrogenous layer a semiconductor or metal surface
05/24/2007US20070117412 Method for forming a silicon oxide layer using spin-on glass
05/24/2007US20070117411 Rework process for photoresist film
05/24/2007US20070117410 Method for manufacturing semiconductor device using immersion lithography process
05/24/2007US20070117409 Aligner and Semiconductor Device Manufacturing Method Using the Aligner
05/24/2007US20070117408 Method for reducing film stress for sicoh low-k dielectric materials
05/24/2007US20070117407 Method for forming substrates for MOS transistor components and its products
05/24/2007US20070117406 Semiconductor element and method for manufacturing the same
05/24/2007US20070117405 Method of manufacturing a semiconductor device
05/24/2007US20070117404 Modification of electrical properties for semiconductor wafers
05/24/2007US20070117403 Method of Fabricating an RF Substrate with Selected Electrical Properties
05/24/2007US20070117402 Methods of forming silicon nano-crystals using plasma ion implantation and semiconductor devices using the same
05/24/2007US20070117401 Carbon nanotube deposition with a stencil
05/24/2007US20070117400 Substrate treating apparatus
05/24/2007US20070117399 Method to improve profile control and n/p loading in dual doped gate applications
05/24/2007US20070117398 Film formation apparatus and method of using the same
05/24/2007US20070117397 Remote plasma pre-clean with low hydrogen pressure
05/24/2007US20070117396 Selective etching of titanium nitride with xenon difluoride
05/24/2007US20070117395 Method for manufacturing semiconductor device
05/24/2007US20070117394 Polishing slurry for CMP and polishing method
05/24/2007US20070117393 Hardened porous polymer chemical mechanical polishing (CMP) pad
05/24/2007US20070117392 Coiled circuit device with active circuitry and methods for making the same
05/24/2007US20070117391 Method for manufacturing multi-thickness gate dielectric layer of semiconductor device
05/24/2007US20070117390 Method for fabricating semiconductor device
05/24/2007US20070117389 Pattern formation method using nanoimprinting and device for carrying out same
05/24/2007US20070117388 Fabrication of semiconductor devices
05/24/2007US20070117387 Semiconductor device and manufacturing method thereof
05/24/2007US20070117386 Substrate for evaluation
05/24/2007US20070117385 Tantalum amide complexes for depositing tantalum-containing films, and method of making same
05/24/2007US20070117384 Chemical vapor deposition metallization processes and chemical vapor deposition apparatus used therein
05/24/2007US20070117383 Precursor material delivery system with staging volume for atomic layer deposition
05/24/2007US20070117382 Method of forming a barrier layer of a semiconductor device
05/24/2007US20070117381 Silicon rich barrier layers for integrated circuit devices
05/24/2007US20070117380 Resin product, production method for the same, and deposition method for a metallic coating
05/24/2007US20070117379 Multiple seed layers for interconnects