Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/24/2007US20070117278 Formation of devices on a substrate
05/24/2007US20070117277 Methods for fabricating protective layers on semiconductor device components
05/24/2007US20070117276 Small form factory molded memory card and a method thereof
05/24/2007US20070117275 Mems device packaging methods
05/24/2007US20070117274 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
05/24/2007US20070117273 Accurate Alignment of an LED Assembly
05/24/2007US20070117272 Method of making a semiconductor device with improved heat dissipation
05/24/2007US20070117271 Methods and compositions for the formation of recessed electrical features on a substrate
05/24/2007US20070117270 Integrated heat spreader with intermetallic layer and method for making
05/24/2007US20070117269 Method for packaging flash memory cards
05/24/2007US20070117268 Ball grid attachment
05/24/2007US20070117267 Semiconductor Multi-Package Module Having Inverted Land Grid Array (LGA) Package Stacked Over Ball Grid Array (BGA) Package
05/24/2007US20070117266 Method of fabricating a multi-die semiconductor package assembly
05/24/2007US20070117265 Semiconductor Device with Improved Stud Bump
05/24/2007US20070117264 Flip-Chip Semiconductor Device Manufacturing Method
05/24/2007US20070117263 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
05/24/2007US20070117262 Low Profile Stacking System and Method
05/24/2007US20070117261 Multilayer printed wiring board and method for producing the same
05/24/2007US20070117260 Method of manufacturing semiconductor sensor
05/24/2007US20070117259 Semiconductor component and method of manufacture
05/24/2007US20070117258 Method for the molecular bonding of microelectronic components to a polymer film
05/24/2007US20070117257 Organic light emitting diode display
05/24/2007US20070117255 Formation of contacts on semiconductor substrates
05/24/2007US20070117254 Back-illuminated imager and method for making electrical and optical connections to same
05/24/2007US20070117253 Method for providing metal extension in backside illuminated sensor for wafer level testing
05/24/2007US20070117252 Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method
05/24/2007US20070117251 Display device, flat lamp and method of fabricating the display device and flat lamp
05/24/2007US20070117250 Method of increasing a free carrier concentration in a semiconductor substrate
05/24/2007US20070117249 Microelectronic imaging units and methods of manufacturing microelectronic imaging units
05/24/2007US20070117248 Method for the production of light-emitting semiconductor diodes
05/24/2007US20070117247 Manufacturing method of microstructure
05/24/2007US20070117246 Metal mems devices and methods of making same
05/24/2007US20070117245 Wafer level package for micro device and manufacturing method thereof
05/24/2007US20070117244 Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
05/24/2007US20070117243 Method of fabricating a biosensor
05/24/2007US20070117242 Providing photonic control over wafer borne semiconductor devices
05/24/2007US20070117241 Method for making a shadow mask for an apposed discharge plasm display panel
05/24/2007US20070117240 Liquid crystal display with positional marks for bonding drive IC
05/24/2007US20070117239 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
05/24/2007US20070117238 Liquid crystal display device and method for fabricating the same
05/24/2007US20070117237 Amorphous transparent conductive film, sputtering target as its raw material, amorphous transparent electrode substrate, process for producing the same and color filter for liquid crystal display
05/24/2007US20070117236 Method of manufacturing optical module
05/24/2007US20070117235 Method for producing an electrical contact for an optoelectronic semiconductor chip
05/24/2007US20070117234 Sputtered Spring Films With Low Stress Anisotropy
05/24/2007US20070117233 Film pattern forming method, device, electro-optical apparatus, and electronic appliance
05/24/2007US20070117232 Method of studying interaction between immersion fluid and substrate
05/24/2007US20070117231 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor
05/24/2007US20070117230 Computer readable storage medium for work-in-process schedules
05/24/2007US20070117229 Methods for minimizing defects when transferring a semiconductor useful layer
05/24/2007US20070117228 Teaching apparatus and teaching method
05/24/2007US20070117227 Method And System for Iteratively, Selectively Tuning A Parameter Of A Doped Workpiece Using A Pulsed Laser
05/24/2007US20070117226 Method and apparatus for processing timeout in DSG apparatus
05/24/2007US20070117225 Integrated inspection system and defect correction method
05/24/2007US20070117030 photolithography mask; generating a known set of functions (calibrated model) defining the performance of an imaging system which are used to correct for optical proximity effects and to improve the printing of mask patterns; computer program
05/24/2007US20070117029 Exposure pattern or mask and inspection method and manufacture method for the same
05/24/2007US20070117028 Mask handling method, and mask and device or apparatus comprising a gripper therefor, device manufacturing method and device manufactured thereby
05/24/2007US20070116994 Methods of operating fuel cells
05/24/2007US20070116962 Flip-chip type semiconductor is encapsulated by a cured product of a liquid epoxy resin composition comprising a liquid epoxy resin, an amine type curing agent, sulfur-containing phenol compound, an inorganic filler; easy to handle and allows simplification of semiconductor device production process
05/24/2007US20070116863 Apparatus and method for manufacturing semiconductor device
05/24/2007US20070116551 Device and method for holding a substrate
05/24/2007US20070116443 Led heat lamp arrays for cvd heating
05/24/2007US20070116421 Environmentally stable electro-optic device and method for making same
05/24/2007US20070115597 Spin injection devices
05/24/2007US20070115555 Method of forming optical images, apparatus for carrying out said method and process for manufacturing a device using said method
05/24/2007US20070115471 Wafer, exposure mask, method of detecting mark and method of exposure
05/24/2007US20070115458 Optical apparatus, method of determining position of optical element in optical system, and device manufacturing method
05/24/2007US20070115450 Exposure apparatus, exposure method, method for producing device, and optical part
05/24/2007US20070114903 Multi-channel plasma accelerator
05/24/2007US20070114682 Apparatus for supplying water containing dissolved gas
05/24/2007US20070114673 Wiring substrate and electronic parts packaging structure
05/24/2007US20070114671 Interconnect structure and fabricating method thereof
05/24/2007US20070114666 Capture of residual refractory metal within semiconductor device
05/24/2007US20070114662 Interconnecting element between semiconductor chip and circuit support and method
05/24/2007US20070114661 Semiconductor package and method of fabricating the same
05/24/2007US20070114653 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
05/24/2007US20070114647 Carrier board structure with semiconductor chip embedded therein
05/24/2007US20070114637 Article with protective film
05/24/2007US20070114635 Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
05/24/2007US20070114632 Transistor having dielectric stressor elements at different depths from a semiconductor surface for applying shear stress
05/24/2007US20070114623 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
05/24/2007US20070114617 Semiconductor memory device
05/24/2007US20070114615 Method of manufacturing a multilayered doped conductor for a contact in an integrated circuit device
05/24/2007US20070114614 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
05/24/2007US20070114612 Method of fabricating semiconductor devices having MCFET/finFET and related device
05/24/2007US20070114609 Semiconductor substrate and method of manufacturing the same
05/24/2007US20070114606 Semiconductor device and a method of manufacturing the same
05/24/2007US20070114605 Ion implantation of nitrogen into semiconductor substrate prior to oxidation for offset spacer formation
05/24/2007US20070114604 Double-extension formation using offset spacer
05/24/2007US20070114598 Trench gate field effect devices
05/24/2007US20070114594 Non-volatile semiconductor memory element and method of manufacturing the same, and semiconductor integrated circuit device including the non-volatile semiconductor memory element
05/24/2007US20070114593 Transistor for non volatile memory devices having a carbon nanotube channel and electrically floating quantum dots in its gate dielectric
05/24/2007US20070114592 Method of forming non-volatile memory cell using spacers and non-volatile memory cell formed according to the method
05/24/2007US20070114591 Integrated circuit devices having a resistor pattern and plug pattern that are made from a same material
05/24/2007US20070114590 Semiconductor device and method of manufacturing the same
05/24/2007US20070114588 Semiconductor memory device with trench-type stacked cell capacitors and method for manufacturing the same
05/24/2007US20070114586 Electrical contact for high dielectric constant capacitors and method for fabricating the same
05/24/2007US20070114585 Active photosensitive structure with buried depletion layer
05/24/2007US20070114584 Active photosensitive structure with buried depletion layer
05/24/2007US20070114582 Polydiode structure for photo diode
05/24/2007US20070114579 Method for integrally forming a damascene gate structure and a resistive device