Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/29/2007US7223673 Method of manufacturing semiconductor device with crack prevention ring
05/29/2007US7223672 Processes for forming backplanes for electro-optic displays
05/29/2007US7223671 Chemical conversion film of tantalum or niobium, method for forming the same and electrolytic capacitor using the same
05/29/2007US7223670 DUV laser annealing and stabilization of SiCOH films
05/29/2007US7223669 Structure and method for collar self-aligned to buried plate
05/29/2007US7223668 Method of etching metallic thin film on thin film resistor
05/29/2007US7223667 Compensated linearity voltage-control-capacitor device by standard CMOS process
05/29/2007US7223666 Semiconductor device that includes a silicide region that is not in contact with the lightly doped region
05/29/2007US7223665 Method for manufacturing dielectric thin film capacitor
05/29/2007US7223664 Semiconductor device and method for fabricating the same
05/29/2007US7223663 MOS transistors and methods of manufacturing the same
05/29/2007US7223662 Method of forming an epitaxial layer for raised drain and source regions by removing surface defects of the initial crystal surface
05/29/2007US7223661 Method of manufacturing semiconductor device
05/29/2007US7223660 Flash assisted annealing
05/29/2007US7223659 Memory device and fabrication method thereof
05/29/2007US7223658 Flash memory structure and method for fabricating the same
05/29/2007US7223657 Methods of fabricating flash memory devices with floating gates that have reduced seams
05/29/2007US7223655 Method for manufacturing NAND flash device
05/29/2007US7223654 MIM capacitor and method of fabricating same
05/29/2007US7223653 Process for forming a buried plate
05/29/2007US7223652 Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
05/29/2007US7223651 Dram memory cell with a trench capacitor and method for production thereof
05/29/2007US7223650 Self-aligned gate isolation
05/29/2007US7223649 Method of fabricating transistor of DRAM semiconductor device
05/29/2007US7223648 Method for manufacturing a semiconductor element
05/29/2007US7223647 Method for forming integrated advanced semiconductor device using sacrificial stress layer
05/29/2007US7223646 Manufacturing method of semiconductor device suppressing short-channel effect
05/29/2007US7223645 Semiconductor device with mushroom electrode and manufacture method thereof
05/29/2007US7223644 Method and apparatus for producing polycrystalline silicon film and method of manufacturing semiconductor device and thin-film transistor
05/29/2007US7223643 Method of manufacturing a semiconductor device
05/29/2007US7223642 Method for fabricating liquid crystal display device
05/29/2007US7223641 Semiconductor device, method for manufacturing the same, liquid crystal television and EL television
05/29/2007US7223640 Semiconductor component and method of manufacture
05/29/2007US7223639 Method of producing an electronic component and a panel with a plurality of electronic components
05/29/2007US7223638 Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
05/29/2007US7223637 Method of manufacturing a sensor device with binding material having a foaming agent
05/29/2007US7223636 Manufacturing method of semiconductor device and semiconductor device
05/29/2007US7223635 Oriented self-location of microstructures with alignment structures
05/29/2007US7223634 Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus
05/29/2007US7223633 Method for solder crack deflection
05/29/2007US7223632 Active matrix substrate, method of manufacturing the same, and display device
05/29/2007US7223631 Windowed package having embedded frame
05/29/2007US7223630 Low stress semiconductor device coating and method of forming thereof
05/29/2007US7223629 Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
05/29/2007US7223628 High temperature attachment of organic molecules to substrates
05/29/2007US7223627 Memory element and its method of formation
05/29/2007US7223626 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
05/29/2007US7223625 CMOS image sensor and method for fabricating the same
05/29/2007US7223624 Micromechanical device with thinned cantilever structure and related methods
05/29/2007US7223623 Method for forming a modified semiconductor having a plurality of band gaps
05/29/2007US7223622 Active-matrix substrate and method of fabricating same
05/29/2007US7223621 Method of fabricating an array substrate
05/29/2007US7223620 Process for the production of light-emitting diode light sources with a luminescence conversion element
05/29/2007US7223619 VCSEL with integrated lens
05/29/2007US7223618 Fabrication of laser diode array
05/29/2007US7223617 Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
05/29/2007US7223616 Test structures in unused areas of semiconductor integrated circuits and methods for designing the same
05/29/2007US7223615 High emissivity capacitor structure
05/29/2007US7223614 Method for manufacturing semiconductor device, and semiconductor device
05/29/2007US7223613 Ferroelectric polymer memory with a thick interface layer
05/29/2007US7223612 Alignment of MTJ stack to conductive lines in the absence of topography
05/29/2007US7223611 Fabrication of nanowires
05/29/2007US7223526 plasma enhanced thermal decomposition of hydrocarbon gas mixtures in close proximity to substrate surfaces, results in deposition of an amorphous carbon layer on the substrate surfaces; film compatible with integrated circuit fabrication
05/29/2007US7223525 Process for generating a hard mask for the patterning of a layer
05/29/2007US7223517 Lithographic antireflective hardmask compositions and uses thereof
05/29/2007US7223504 mask includes multiple transmissive areas having a plurality of first slits for adjusting energy of the laser illumination passing through the mask; and an opaque area; for laser illumination to convert amorphous silicon into polysilicon
05/29/2007US7223449 Film deposition method
05/29/2007US7223446 Plasma CVD apparatus and dry cleaning method of the same
05/29/2007US7223444 Determinating shape of surface; stamp for transferring electricity charging; fine geometric shapes
05/29/2007US7223352 Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal
05/29/2007US7223323 Multi-chemistry plating system
05/29/2007US7223321 Faraday shield disposed within an inductively coupled plasma etching apparatus
05/29/2007US7223320 Method and apparatus for expanding a semiconductor wafer
05/29/2007US7223319 A peeling mechanism peels a pressure sensitive adhesive tape from a semiconductor wafer by using suction; reduced damage during manufacture
05/29/2007US7223316 Method for manufacturing electronic component
05/29/2007US7223308 Apparatus to improve wafer temperature uniformity for face-up wet processing
05/29/2007US7223306 Laser apparatus, laser irradiation method, and manufacturing method of semiconductor device
05/29/2007US7223297 Slurrying an atomized mixture of a matrix polymer with embedded abraisive particles for a chemical mechanical polishing system
05/29/2007US7223162 Holder for wafers
05/29/2007US7223158 Method for polishing a semiconductor wafer
05/29/2007US7223156 Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces
05/29/2007US7223154 Method for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
05/29/2007US7222773 Semiconductor bonding apparatus
05/29/2007US7222772 Flip chip bonder
05/29/2007US7222737 Die sorter with reduced mean time to convert
05/29/2007US7222721 Transferring apparatus, carrying apparatus, and transferring method
05/29/2007US7222420 Method for making a front and back conductive substrate
05/29/2007US7222419 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
05/29/2007CA2392041C Pendeoepitaxial growth of gallium nitride layers on sapphire substrates
05/29/2007CA2310155C A process for etching gallium nitride compound based semiconductors
05/29/2007CA2261856C Programmable switch, adjustable capacitance and resonant circuit effected by means of such a switch
05/24/2007WO2007059480A2 Polycide fuse with reduced programming time
05/24/2007WO2007059465A2 Server side application integration framework
05/24/2007WO2007059239A1 Method of forming non-volatile memory cell using sacrificial pillar spacers and non-volatile memory cell formed according to the method
05/24/2007WO2007059193A2 Low profile image sensor package
05/24/2007WO2007059191A1 Enhancing shock resistance in semiconductor packages
05/24/2007WO2007059035A2 SECOND SCHOTTKY CONTACT METAL LAYER TO IMPROVE GaN SCHOTTKY DIODE PERFORMANCE
05/24/2007WO2007059027A2 Thermal processing system, components, and methods
05/24/2007WO2007058909A2 Method of controlling nanowire growth and device with controlled-growth nanowire
05/24/2007WO2007058845A2 Vertical diode doped with antimony to avoid or limit dopant diffusion