Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2007
05/30/2007EP1791162A1 Dicing tape attaching apparatus and dicing tape attaching method
05/30/2007EP1791161A2 Liquid processing method and liquid processing apparatus
05/30/2007EP1791160A2 Substrate treatment apparatus and substrate treatment method
05/30/2007EP1791028A1 Micro pattern forming material, method of forming micro resist pattern and electronic device
05/30/2007EP1791018A1 Printing system and method for manufacturing a liquid crystal display device using the same
05/30/2007EP1790757A1 Susceptor
05/30/2007EP1790756A1 Thin-film forming apparatus
05/30/2007EP1790704A1 micro system component and method for bonding micro components to a substrate
05/30/2007EP1790645A1 Lactone compound, lactone-containing monomer, polymer of those, resist composition using same, method for forming pattern using same
05/30/2007EP1790014A2 Vertical semiconductor devices and methods of manufacturing such devices
05/30/2007EP1790010A2 Integrated semiconductor cascode circuit for high-frequency applications
05/30/2007EP1790006A1 A semiconductor device with a high-k gate dielectric and a metal gate electrode
05/30/2007EP1790005A1 Contacting and filling deep-trench-isolation with tungsten
05/30/2007EP1790004A1 Method of manufacturing a semiconductor device and such a semiconductor device
05/30/2007EP1790003A1 Method of forming strained silicon materials with improved thermal conductivity
05/30/2007EP1790002A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
05/30/2007EP1790001A1 Method for producing a multi-stage recess in a layer structure and a field effect transistor with a multi-recessed gate
05/30/2007EP1790000A1 Self-aligned epitaxially grown bipolar transistor
05/30/2007EP1789999A1 Method of manufacturing a silicon dioxide layer
05/30/2007EP1789998A2 Supply mechanism for the chuck of an integrated circuit dicing device
05/30/2007EP1789997A2 Method for integrated circuit fabrication using pitch multiplication
05/30/2007EP1789996A1 In-line process for making thin film electronic devices
05/30/2007EP1789995A1 Hot source cleaning system
05/30/2007EP1789994A1 Layer arrangement for a light-emitting component
05/30/2007EP1723668B1 Method of fabricating a strained finfet channel
05/30/2007EP1639648A4 Integrated circuit having pairs of parallel complementary finfets
05/30/2007EP1593147B1 Purged heater-susceptor for an ald/cvd reactor
05/30/2007EP1553622B1 Anisotropic conductivity testconnector
05/30/2007EP1500116B1 Method of forming mram devices
05/30/2007EP1440459B8 Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
05/30/2007EP1410552A4 Hybrid circuit having nanotube electromechanical memory
05/30/2007EP1380053B1 Nanoelectronic devices and circuits
05/30/2007EP1341991A4 Laser separated die with tapered sidewalls for improved light extraction
05/30/2007EP1287549A4 An apparatus and a method for forming a pattern using a crystal structure of material
05/30/2007EP1285310A4 Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching process based on near infrared spectrometer
05/30/2007EP1279176B1 Magnetic element with insulating veils and fabricating method thereof
05/30/2007EP1263048B1 Ferroelectric memory device and its manufacturing method, and hybrid device
05/30/2007EP1261752B1 Method for repairing lithography masks using a charged particle beam system
05/30/2007EP1259103B1 Multilayer printed wiring board and method for producing multilayer printed wiring board
05/30/2007EP1220320B1 Sigec semiconductor crystal and production method thereof
05/30/2007EP1214732B1 Semiconductor processing equipment having radiant heated ceramic liner
05/30/2007EP1163550B1 Hydroxy-amino thermally cured undercoat for 193 nm lithography
05/30/2007EP1144310B1 Mesoporous silica film from a solution containing a surfactant and methods of making same
05/30/2007EP1073779A4 Reduced impedance chamber
05/30/2007EP1060645B1 Electric conductor with a surface structure in the form of flanges and etched grooves
05/30/2007CN2907173Y Large-area parallel connected high density inductively coupled plasma source
05/30/2007CN2906920Y Electrostatic holding chuck for holding wafer
05/30/2007CN2906919Y Quick directional wafer sensor device
05/30/2007CN2906918Y Flash-free plastic capsulation mold for semiconductor device
05/30/2007CN2906917Y Fixed crystal structure of wiring frame
05/30/2007CN2906916Y Faraday device
05/30/2007CN2906915Y Fixed Faraday cage device for beam sampling and measurement
05/30/2007CN2906907Y Non-uniform magnetic field edge characteristic corrector for ion implantation machine
05/30/2007CN2906906Y Ion source lead-out electrode system
05/30/2007CN2906629Y Probe structure of test card
05/30/2007CN1973379A Reflective positive electrode and gallium nitride-based compound semiconductor light-emitting device using the same
05/30/2007CN1973375A Method of separating layers of material using laser beam
05/30/2007CN1973374A Semiconductor device with multiple semiconductor layers
05/30/2007CN1973371A Elongated features for improved alignment process integration
05/30/2007CN1973370A Angled elongated features for improved alignment process integration
05/30/2007CN1973368A Using different gate dielectrics with NMOS and PMOS transistors of a complementary metal oxide semiconductor integrated circuit
05/30/2007CN1973367A Semiconductor device and method for manufacturing same
05/30/2007CN1973366A Apparatus for producing ic chip package
05/30/2007CN1973365A System for heat treatment of semiconductor device
05/30/2007CN1973364A 多频等离子体刻蚀反应器 Multi-frequency plasma etch reactor
05/30/2007CN1973363A Plasma processing apparatus and method
05/30/2007CN1973362A Ultra-thin die and method of fabricating same
05/30/2007CN1973361A Semiconductor processing methods for forming electrical contacts, and semiconductor structures
05/30/2007CN1973360A 氮化物半导体装置 The nitride semiconductor device
05/30/2007CN1973359A Gallium oxide single crystal composite, process for producing the same, and process for producing nitride semiconductor film utilizing gallium oxide single crystal composite
05/30/2007CN1973358A Processing system and method for chemically treating a TERA layer
05/30/2007CN1973357A EUV light source, EUV exposure system, and production method for semiconductor device
05/30/2007CN1973356A Use of an active wafer temperature control independent from wafer emissivity
05/30/2007CN1973355A Integrated getter for vacuum or inert gas packaged LEDs
05/30/2007CN1973332A Organic electronic circuit with functional interlayer, and method for making the same
05/30/2007CN1973245A Organic film composition and method for forming resist pattern
05/30/2007CN1973244A Levenson type phase shift mask and production method therefor
05/30/2007CN1973235A Micromirror having reduced space between hinge and mirror plate of the micromirror
05/30/2007CN1973207A Sheetlike probe, its manufacturing method and its application
05/30/2007CN1973174A Method of assembling a semiconductor component and apparatus therefor
05/30/2007CN1973157A Locking device
05/30/2007CN1973064A One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer
05/30/2007CN1973061A Improvement of water-barrier performance of an encapsulating film
05/30/2007CN1972552A Plasma processing apparatus
05/30/2007CN1972044A Semiconductor device and method of fabricating the same
05/30/2007CN1971972A Encapsulation gumming technique of organic electroluminescent display device
05/30/2007CN1971970A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/30/2007CN1971967A Display device and manufacturing method
05/30/2007CN1971965A Film forming method, method for manufacturing organic electroluminescent device, organic electroluminescent device, and electronic apparatus
05/30/2007CN1971964A Vacuum cell thermal isolation for a phase change memory device
05/30/2007CN1971963A Memory cell device and manufacturing method
05/30/2007CN1971962A Phase change memory device and manufacturing method
05/30/2007CN1971957A Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
05/30/2007CN1971952A Converse welding method of high power LED chip
05/30/2007CN1971950A Anti-reflecting layer base plate and its manufacturing method
05/30/2007CN1971947A Flat capacitor structure and flat capacitor, grid and resistance forming technique method
05/30/2007CN1971946A Field effect transistor and method of manufacturing the same
05/30/2007CN1971945A Fet apparatus and its manufacturing method
05/30/2007CN1971944A A MOS FET tube and its manufacturing method
05/30/2007CN1971943A Self-supporting SiC based GaN apparatus and its manufacturing method
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