Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/25/2007US20070246755 Method for fabricating recessed gate mos transistor device
10/25/2007US20070246754 Semiconductor Device and Method for Manufacture
10/25/2007US20070246742 Method of Manufacturing a Strained Semiconductor Layer, Method of Manufacturing a Semiconductor Device and Semiconductor Substrate Suitable for Use in Such a Method
10/25/2007US20070246725 Semiconductor display device
10/25/2007US20070246724 Package base structure and associated manufacturing method
10/25/2007US20070246723 Method for forming film pattern, method for manufacturing active matrix substrate, device, electro-optical device and electronic apparatus
10/25/2007US20070246722 Sealed LED having improved optical transmissibility
10/25/2007US20070246710 Semiconductor Device and Method of Manufacturing Same
10/25/2007US20070246709 Thin film semiconductor device
10/25/2007US20070246706 Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element
10/25/2007US20070246705 High Performance Light-Emitting Devices
10/25/2007US20070246702 Fabrication of Active Areas of Different Natures Directly Onto an Insulator: Application to the Single or Double Gate Mos Transistor
10/25/2007US20070246701 Generating Multiple Bandgaps Using Multiple Epitaxial Layers
10/25/2007US20070246664 Laser apparatus, laser irradiation method, semiconductor manufacturing method, semiconductor device, and electronic equipment
10/25/2007US20070246455 Method for trimming resistors
10/25/2007US20070246447 Method for laser annealing to form an epitaxial growth layer
10/25/2007US20070246355 Batch-Type Remote Plasma Processing Apparatus
10/25/2007US20070246165 Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film
10/25/2007US20070246133 Method for Electroplating and Contact Projection Arrangement
10/25/2007US20070246080 Microelectronic device drying devices and techniques
10/25/2007US20070246074 Load lock system for supercritical fluid cleaning
10/25/2007US20070246065 Ion sampling method for wafer
10/25/2007US20070246064 Method of treating a substrate
10/25/2007US20070245957 High density plasma oxidation
10/25/2007US20070245909 Composite stamper for imprint lithography
10/25/2007US20070245836 Three-dimensional force input control device and fabrication
10/25/2007US20070245552 Probe interposers and methods of fabricating probe interposers
10/25/2007DE112005002970T5 Ausrichtungsvorrichtung Alignment device
10/25/2007DE112004003008T5 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
10/25/2007DE112004003004T5 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
10/25/2007DE112004002236T5 Herstellungsverfahren einer elektronischen Komponente Manufacturing process of an electronic component
10/25/2007DE10345186B4 Verfahren zur Herstellung eines Metall-Oxid-Halbleiter Feldeffekttransistors und Metall-Oxid-Halbleiter Feldeffekttransistor A method for producing a metal-oxide-semiconductor field-effect transistor and metal oxide semiconductor field effect transistor
10/25/2007DE10302117B4 Verfahren zum Herstellen einer Halbleiteranordnung mit Vorsprung und Halbleiteranordnungen mit Vorsprung A method of manufacturing a semiconductor device with lead and semiconductor devices with projection
10/25/2007DE10241344B4 Waferebenengehäuse mit Siliziumdichtung Wafer-level housing with silicon seal
10/25/2007DE102007017833A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
10/25/2007DE102007015942A1 Siliziumcarbid-Halbleitervorrichtung und Herstellungsverfahren derselben Silicon carbide semiconductor device and manufacturing method thereof
10/25/2007DE102007013737A1 Direkte Stromabgabe in eine elektronische Baugruppe Direct current output into an electronic module
10/25/2007DE102007011346A1 Electron beam-pattern writing method, involves writing re-dimensioned design pattern on target-workpiece with iso-focal dose in accordance to pattern thickness in each of multiple small regions
10/25/2007DE102006019244A1 Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung desselben The same benefits and semiconductor component of a composite plate with semiconductor chips and plastic housing composition and methods of making
10/25/2007DE102006018801A1 Vorrichtung sowie Verfahren zum Erhitzen eines Substrats The apparatus and method of heating a substrate
10/25/2007DE102006018765A1 Leistungshalbleiterbauelement, Leistungshalbleiterbauteil sowie Verfahren zu deren Herstellung Power semiconductor device, power semiconductor device and process for their preparation
10/25/2007DE102006018474A1 Testvorrichtung für Halbleiterelemente auf einem Halbleiterwafer sowie ein Testverfahren unter Verwendung der Testvorrichtung Test device for semiconductor elements on a semiconductor wafer and a test method using the test device
10/25/2007DE102006018027A1 Mikromechanisches Bauelement mit Waferdurchkontaktierung sowie entsprechendes Herstellungsverfahren Micromechanical component with through-wafer via and corresponding production method
10/25/2007DE102006013516A1 Verfahren und Vorrichtung zur elektrostatischen Fixierung von Substraten mit leitfähiger Schicht Method and apparatus for electrostatic fixation of substrates with conductive layer
10/25/2007DE102006009226A1 Transistor mit einer erhöhten Schwellwertstabilität ohne Durchlassstrombeeinträchtigung Transistor with an increased Schwellwertstabilität without let-through current impairment
10/25/2007DE102005048036B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit tiefen Grabenstrukturen A process for producing a semiconductor device with deep structures grave
10/25/2007DE102005030602B4 Gerät zum Trocknen von Substraten Device for drying substrates
10/25/2007DE102005022575B4 Nichtflüchtiges Halbleiterspeicherbauelement mit floatender Gateelektrode Nonvolatile semiconductor memory device having a floating gate electrode
10/25/2007CA2649039A1 Transfer tape strap process
10/25/2007CA2641471A1 Gate-coupled eprom cell for printhead
10/24/2007EP1848041A1 Amorphous silicon thin film transistor and organic light-emitting display having the same
10/24/2007EP1848040A1 Semiconductor element
10/24/2007EP1848039A2 Complementary mis device
10/24/2007EP1848033A2 Semiconductor Device and Fabrication Method Therefor
10/24/2007EP1848032A2 Materials and methods of forming controlled voids in dielectric layers
10/24/2007EP1848031A1 Semiconductor device and method of manufacturing the same
10/24/2007EP1848030A2 Method of manufacturing semiconductor apparatus
10/24/2007EP1848029A1 Carrying structure of electronic components
10/24/2007EP1848028A1 Substrate processing method, substrate processing apparatus and control program
10/24/2007EP1848027A2 Nest for dicing, and method and apparatus for cutting tapeless substrate using the same
10/24/2007EP1848026A1 LED having vertical structure and method for fabricating the same
10/24/2007EP1848025A1 Liquid processing apparatus
10/24/2007EP1848024A1 Liquid processing apparatus
10/24/2007EP1848023A1 Substrate cleaning method, substrate cleaning system and program storage medium
10/24/2007EP1847880A2 Composition for cleaning microelectronic substrates containing halogen oxygen acids and derivatives thereof
10/24/2007EP1847876A1 Photosensitive composition removing liquid
10/24/2007EP1847850A2 Hydrophone assembly
10/24/2007EP1847835A2 Method and system for compensating thermally induced motion of probe cards
10/24/2007EP1847834A1 Interposer, probe card and method for manufacturing interposer
10/24/2007EP1847328A1 Photoresist coating process control with solvent vapor sensor
10/24/2007EP1846956A1 Method for producing metal/semiconductor contacts through a dielectric
10/24/2007EP1846947A1 Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
10/24/2007EP1846946A1 Relaxation of a strained layer using a molten layer
10/24/2007EP1846945A2 Method of making a planar double-gated transistor
10/24/2007EP1846944A1 Electromagnetic switch device in particular a contactor
10/24/2007EP1846788A1 Optical data transceivers
10/24/2007EP1846596A2 Method of making substitutionally carbon-highly doped crystalline si-layers by cvd
10/24/2007EP1846595A1 Selective deposition of silicon-containing films
10/24/2007EP1846321A1 Method of fabricating a silicon-on-insulator structure
10/24/2007EP1779435A4 Monolithic vertical junction field effect transistor and schottky barrier diode fabricated from silicon carbide and method for fabricating the same
10/24/2007EP1649557A4 Method of forming a scribe line on a passive electronic component substrate
10/24/2007EP1551730A4 Carrier with tacky surfaces
10/24/2007EP1536919B1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
10/24/2007EP1535334B1 Word and bit line arrangement for a finfet semiconductor memory
10/24/2007EP1525137A4 Automatic refill system for ultra pure or contamination sensitive chemicals
10/24/2007EP1481117B1 Method and device for depositing semi-conductor layers
10/24/2007EP1433181B1 Current source and drain arrangement for magnetoresistive memories (mrams)
10/24/2007EP1421613A4 Method and apparatus for fabricating mercuric iodide polycrystalline films for digital radiography
10/24/2007EP1371090A4 HYBRID LOW-k INTERCONNECT STRUCTURE COMPRISED OF 2 SPIN-ON DIELECTRIC MATERIALS
10/24/2007EP1198832B1 Method of making a buried strap for a trench capacitor
10/24/2007EP1192666B1 Memory cell arrangement
10/24/2007EP1166349B1 Method of producing a trench isolation for electrically active components
10/24/2007EP1144155B1 Ultrasonic transducer slurry dispenser
10/24/2007EP1119878B1 Encapsulation of a device
10/24/2007EP0795200B1 Mounting electronic components to a circuit board
10/24/2007CN200965868Y A device for holding the wafer
10/24/2007CN200965867Y Bench for semiconductor wafer package
10/24/2007CN200965866Y 晶圆测试加热器 Wafer testing heater
10/24/2007CN200964445Y Steel belt clamping mechanism for integrate circuit plating production line
10/24/2007CN200964436Y Ion source leading seam adjustment control system
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