Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/30/2007US7288438 Solder deposition on wafer backside for thin-die thermal interface material
10/30/2007US7288437 Conductive pattern producing method and its applications
10/30/2007US7288436 Semiconductor chip package manufacturing method including screen printing process
10/30/2007US7288435 Method for producing a cover, method for producing a packaged device
10/30/2007US7288434 Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
10/30/2007US7288433 Method of making assemblies having stacked semiconductor chips
10/30/2007US7288432 Electronic devices with small functional elements supported on a carrier
10/30/2007US7288431 Molded stiffener for thin substrates
10/30/2007US7288430 Method of fabricating heteroepitaxial microstructures
10/30/2007US7288429 Image sensor with vertically integrated thin-film photodiode
10/30/2007US7288428 Solid state image pickup device and manufacturing method thereof and semiconductor integrated circuit device and manufacturing method thereof
10/30/2007US7288427 Method for reducing defects after a metal etching in semiconductor devices
10/30/2007US7288426 Automatically adjusting serial connections of thick and thin layers and method for the production thereof
10/30/2007US7288425 Hybrid cantilever and tip
10/30/2007US7288424 Integrated driver process flow
10/30/2007US7288423 In-situ mask removal in selective area epitaxy using metal organic chemical vapor deposition
10/30/2007US7288422 Photonic integrated device using reverse-mesa structure and method for fabricating the same
10/30/2007US7288421 Method for forming an optoelectronic device having an isolation layer
10/30/2007US7288420 Method for manufacturing an electro-optical device
10/30/2007US7288419 Microstructure for use in Raman spectrometry and production process for the microstructure
10/30/2007US7288418 Process for treating substrates for the microelectronics industry, and substrates obtained by this process
10/30/2007US7288417 On-chip signal transformer for ground noise isolation
10/30/2007US7288363 2,4,6-Triisopropylbenzenesulfonate compound capable of generating an acid upon exposure to radiation or electron beams, polymer which changes solubility in alkaline developer under action of acid, and basic compound having high sensitivity, contrast, resolution, storage stability
10/30/2007US7288359 Radiation-sensitive resin composition
10/30/2007US7288294 Method of crystallizing amorphous silicon using nanoparticles
10/30/2007US7288292 PECVD of a cyclic siloxane, organic molecules, tetramethylorthosilicate (TMOS), tetraethylorthosilicate (TEOS), vinyltriethoxysilane, allyltrimethoxysilane, vinyltrimethoxysilane, allyltriethoxysilane, phenyltriethoxysilane orphenyltrimethoxysilane; improved elastic modulus and hardness.
10/30/2007US7288212 Comprises acrylic acid-maleic acid copolymer and sodium hydroxide; for chemical mechanical polishing of semiconductors
10/30/2007US7288206 High-purity alkali etching solution for silicon wafers and use thereof
10/30/2007US7288204 Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG)
10/30/2007US7288179 comprises plenum surrounding rotatable shaft and internal channel
10/30/2007US7288178 Electrochemistry extrusion; three-dimensional structure; conformable contact masking
10/30/2007US7288173 Ion beam processing system and ion beam processing method
10/30/2007US7288172 Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
10/30/2007US7288166 Plasma processing apparatus
10/30/2007US7288165 Pad conditioning head for CMP process
10/30/2007US7288156 Methods for cleaning a substrate
10/30/2007US7288155 Method for the rapid thermal control of a work piece in liquid or supercritical fluid
10/30/2007US7288152 Method of manufacturing GaN crystals and GaN crystal substrate, GaN crystals and GaN crystal substrate obtained by the method, and semiconductor device including the same
10/30/2007US7288151 Method of manufacturing group-III nitride crystal
10/30/2007US7288145 Silicon oxynitride, silicon nitride, silicon oxide, a substituted hydrazinosilane, ammonia, nitrogen, hydrazine; silicon-containing dielectric films grown at low thermal conditions, reduced carbon contamination, low hydrogen contamination
10/30/2007US7288021 Chemical-mechanical polishing of metals in an oxidized form
10/30/2007US7288008 Nonlithographic method of defining geometries for plasma and/or ion implantation treatments on a semiconductor wafer
10/30/2007US7287951 Device and method for the harmonized positioning of wafer disks
10/30/2007US7287537 Megasonic probe energy director
10/30/2007US7287328 Methods for distributed electrode injection
10/30/2007US7287326 Methods of forming a contact pin assembly
10/30/2007US7287317 Apparatus for mounting semiconductor chips
10/30/2007US7287314 One step copper damascene CMP process and slurry
10/25/2007WO2007121383A2 Method and apparatus to form thin layers of materials on a base
10/25/2007WO2007121343A2 Methods of making flash memory cell arrays having dual control gates per memory cell charge storage element
10/25/2007WO2007121270A1 Epitaxial growth of iii-nitride compound semiconductors structures
10/25/2007WO2007121177A2 Planarization of substrates at a high polishing rate using electrochemical mechanical polishing
10/25/2007WO2007121114A2 Transfer tape strap process
10/25/2007WO2007121007A2 Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
10/25/2007WO2007120959A2 Method for planarizing vias formed in a substrate
10/25/2007WO2007120866A2 Self-aligned method based on low-temperature selective epitaxial growth for fabricating silicon carbide devices
10/25/2007WO2007120697A2 Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
10/25/2007WO2007120654A2 Process for making contained layers and devices made with same
10/25/2007WO2007120640A2 Thermally induced single-use valves and method of use
10/25/2007WO2007120573A2 Plasma dielectric etch process including ex-situ backside polumer removal for low-dielectric constant material
10/25/2007WO2007120552A2 Monitoring the laydown of a reagent like potassium ferricyanide using xrf spectrometry
10/25/2007WO2007120537A2 Patterning a plurality of fields on a substrate
10/25/2007WO2007120493A1 Nanofin tunneling transistors
10/25/2007WO2007120492A1 Nanowire transistor with surrounding gate
10/25/2007WO2007120354A2 Thin-film capacitor with a field modification layer and methods for forming the same
10/25/2007WO2007120344A2 Magnetic tunnel junction device with improved barrier layer
10/25/2007WO2007120324A2 A dual metal silicide scheme using a dual spacer process
10/25/2007WO2007120296A2 Electronic device and a process for forming the electronic device
10/25/2007WO2007120293A2 Process for forming an electronic device including a fin-type structure
10/25/2007WO2007120291A2 Semiconductor device comprising a transistor having a counter-doped channel region and method for forming the same
10/25/2007WO2007120283A2 Transistor with immersed contacts and methods of forming thereof
10/25/2007WO2007120282A2 Stackable molded packages and methods of making the same
10/25/2007WO2007120232A2 Self-aligning optical sensor package
10/25/2007WO2007120228A2 Carbon nanotubes solder composite for high performance interconnect
10/25/2007WO2007120159A2 Magnetic tunnel junction antifuse circuit comprising parallel connected reference magnetic tunnel junctions to provide an optimum reference resistance
10/25/2007WO2007120115A1 Automated manufacturing systems and methods
10/25/2007WO2007119949A1 Composition for positive type photoresist and positive type photoresist film manufactured thereby
10/25/2007WO2007119930A1 Method of bonding probes and method of manufacturing a probe card using the same
10/25/2007WO2007119875A1 Method for manufacturing polishing pad
10/25/2007WO2007119866A1 Film forming apparatus and film forming method
10/25/2007WO2007119860A1 Processing method of glass substrate, and highly flat and highly smooth glass substrate
10/25/2007WO2007119845A1 Device wafer polishing pad
10/25/2007WO2007119840A1 Diffraction optical element, and aligner equipped with that element
10/25/2007WO2007119822A1 Method for manufacturing semiconductor light emitting element, semiconductor light emitting element and lamp provided with the semiconductor light emitting element
10/25/2007WO2007119821A1 Exposure method, exposure apparatus and device manufacturing method
10/25/2007WO2007119804A1 Resist composition for liquid immersion exposure
10/25/2007WO2007119803A1 Resist material for immersion lithography
10/25/2007WO2007119795A1 Electronic device, electronic device manufacturing method and organic el display apparatus
10/25/2007WO2007119748A1 Magnetic random access memory and method for manufacturing the same
10/25/2007WO2007119745A1 Feeder for drug solution or ultrapurified water, board treating system, board treating device or board treating method
10/25/2007WO2007119727A1 Electro-optic device, and tft substrate for current control and method for manufacturing the same
10/25/2007WO2007119708A1 Magnetic random access memory
10/25/2007WO2007119703A1 Method for producing crystalline organic semiconductor thin film, organic semiconductor thin film, electronic device, and thin film transistor
10/25/2007WO2007119700A1 Catalyst body chemical vapor phase growing apparatus
10/25/2007WO2007119648A1 Gas purifying apparatus and semiconductor manufacturing apparatus
10/25/2007WO2007119644A1 Method of resin encapsulation molding for electronic part and resin encapsulation molding apparatus for electronic part
10/25/2007WO2007119613A1 Conveyance apparatus, conveyance method, and device production method
10/25/2007WO2007119612A1 Substrate treating apparatus and treating gas emitting mechanism
10/25/2007WO2007119571A1 Solder layer, substrate for device junction utilizing the same, and process for manufacturing the substrate
10/25/2007WO2007119555A1 Plotting position measuring method and device, and plotting method and device
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