Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/31/2007CN101064354A Method and apparatus for forming evaporated film pattern of luminous diode
10/31/2007CN101064352A Method for producing multi-layer metal one-time electrode of luminous diode and its production apparatus
10/31/2007CN101064351A Photoelectric diode structure and method for making the same
10/31/2007CN101064349A Flash memory device with stacked dielectric structure including zirconium oxide and method for fabricating the same
10/31/2007CN101064348A Semiconductor device and method for manufacturing the same
10/31/2007CN101064347A Semiconductor device and manufacturing method thereof
10/31/2007CN101064346A Semiconductor device and manufacturing method of the same
10/31/2007CN101064345A Thin film transistor and method of fabricating the same
10/31/2007CN101064344A Semiconductor device and manufacturing method thereof
10/31/2007CN101064343A Semiconductor structure and a method for forming the same
10/31/2007CN101064342A Semiconductor device and method for fabricating the same
10/31/2007CN101064341A Wafer having unsymmetrical crystal edge profile and method for making the same
10/31/2007CN101064340A Display device and manufacturing method of the same
10/31/2007CN101064339A Electro-optical device, method of manufacturing the same, and electronic instrument
10/31/2007CN101064335A Organic electroluminescent device and its method of manufacture
10/31/2007CN101064332A Organic thin film transistor array substrate and fabricating method thereof
10/31/2007CN101064331A Phase change memory fabricated using self-aligned processing
10/31/2007CN101064329A Optical apparatus and optical module using the same
10/31/2007CN101064328A Video sensing element and method for making the same
10/31/2007CN101064327A Image sensing element and method for making the same
10/31/2007CN101064326A Image sensing element and method of manufacture
10/31/2007CN101064323A Electro-optical device, electronic apparatus, and method of manufacturing electro-optical device
10/31/2007CN101064321A Semiconductor device and method for manufacturing the same
10/31/2007CN101064320A Semiconductor device and method for manufacturing the semiconductor device
10/31/2007CN101064319A Substrates, semiconductor member and method for forming the same
10/31/2007CN101064318A Thin film transistor array panel for display and manufacturing method of the same
10/31/2007CN101064317A Active driving TFT matrix structure and method of manufacture
10/31/2007CN101064316A Flattening active driving TFT matrix structure and method of manufacture
10/31/2007CN101064315A Single programmable memory and its making method
10/31/2007CN101064314A Nonvolatile memory and its making method
10/31/2007CN101064313A Method for erasing nonvolatile memory
10/31/2007CN101064312A Semiconductor device having a fin channel transistor
10/31/2007CN101064310A CMOS structures and methods using self-aligned dual stressed layers
10/31/2007CN101064309A Semiconductor device and manufacturing method thereof
10/31/2007CN101064308A Method for forming and designing combined component
10/31/2007CN101064305A Semiconductor device and method for manufacturing the same
10/31/2007CN101064304A Semiconductor device and method for manufacturing the same
10/31/2007CN101064303A Semiconductor component and its making method
10/31/2007CN101064302A Semiconductor device and semiconductor device layout designing method
10/31/2007CN101064298A Tungstein plug as fuse for ic device
10/31/2007CN101064296A Semiconductor devices and fabrication method thereof
10/31/2007CN101064295A Semiconductor device and its making method
10/31/2007CN101064294A Circuit device and method for manufacturing circuit device
10/31/2007CN101064293A Package for optical device and method of manufacturing the same
10/31/2007CN101064292A Optical display packaging structure and its method
10/31/2007CN101064291A Semiconductor chip package and its packaging method
10/31/2007CN101064287A Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
10/31/2007CN101064286A High performance stress-enhance mosfet and method of manufacture
10/31/2007CN101064285A High performance stress-enhance mosfet and method of manufacture
10/31/2007CN101064284A Method for producing nonvolatile memory
10/31/2007CN101064283A Method for fabricating semiconductor device
10/31/2007CN101064282A Groove capacitance dynamic random access memory and its method for making the same
10/31/2007CN101064281A Method of manufacturing cmos image sensor with prlasma damage free photodiode
10/31/2007CN101064280A Method of manufacturing semiconductor device
10/31/2007CN101064279A Image sensing element and method for making the same
10/31/2007CN101064278A Method for manufacturing integrated circuit
10/31/2007CN101064277A Display device module and method for manufacturing the same
10/31/2007CN101064276A Method for regulating integrate circuit parameter
10/31/2007CN101064275A Method for realizing RTD and HEMT single chip integration using dry etching technology
10/31/2007CN101064274A Method of dividing an adhesive film bonded to a wafer
10/31/2007CN101064273A Wiring substrate, display device and manufacturing method thereof
10/31/2007CN101064272A Plasma etch process using polymerizing etch gases
10/31/2007CN101064271A Screw inductive element having multiplex conductor structure
10/31/2007CN101064270A Manufacturing method of semiconductor device
10/31/2007CN101064269A Method for fabricating semiconductor
10/31/2007CN101064268A Chip holder
10/31/2007CN101064267A Improper shift wafer detecting system
10/31/2007CN101064266A Method for detecting package carrier and its apparatus
10/31/2007CN101064265A Measuring device for ion beam
10/31/2007CN101064264A Conductive ball arraying apparatus
10/31/2007CN101064263A Reduced oxidation system for wire bonding
10/31/2007CN101064262A Rectilinear motion buffer gear of welded head flexible joint
10/31/2007CN101064261A Semiconductor package and its array arranged substrate structure and production method
10/31/2007CN101064260A Package manufacture process for power chip
10/31/2007CN101064259A Semiconductor package and its chip bearing structure and production method
10/31/2007CN101064258A Method of forming highly orientated silicon film, method of manufacturing three-dimensional semiconductor device, and three-dimensional semiconductor device
10/31/2007CN101064257A Method of manufacturing semiconductor device, and semiconductor device
10/31/2007CN101064256A Low temperature direct deposited polycrystalline silicon thin film transistor structure and method for manufacturing the same
10/31/2007CN101064255A Semiconductor device with fixed channel ions
10/31/2007CN101064254A Method for producing compressive nitrifier layer and method for forming transistor
10/31/2007CN101064253A Method for removing masking materials with reduced low-k dielectric material damage
10/31/2007CN101064252A Semiconductor device and method for manufacturing the same
10/31/2007CN101064251A Method for forming semiconductor structure and semiconductor structure
10/31/2007CN101064250A Method of fabricating recess channel in semiconductor device
10/31/2007CN101064249A Method for improving shallow groove isolating space stuffing techniques
10/31/2007CN101064248A Method for producing active layer film using precursor solution of metal-sulfur series compound
10/31/2007CN101064247A Method for manufacturing semiconductor device
10/31/2007CN101064246A Metal-induced crystallization of amorphous silicon and metal removal techniques
10/31/2007CN101064245A Method for producing semiconductor elements and hard mask layer
10/31/2007CN101064244A Etch methods to form anisotropic features for high aspect ratio applications
10/31/2007CN101064243A Semiconductor processing apparatus including complex-shaped friction welded aluminum structures
10/31/2007CN101064242A Fabrication method of semiconductor circuit device
10/31/2007CN101064241A Method of forming selectively a catalyst for nanoscale conductive structure and method of forming the nanoscale conductive structure
10/31/2007CN101064240A Substrate processing method, substrate processing system and substrate processing apparatus
10/31/2007CN101064239A Sheet material cutting method
10/31/2007CN101064238A Plasma reactor apparatus with independent capacitive and toroidal plasma sources
10/31/2007CN101064237A Substrate processing apparatus
10/31/2007CN101064234A Apparatus and method for ion implanatation leading to partial ion implant energy
10/31/2007CN101063830A Methods to clean a surface, a device manufacturing method, a cleaning assembly, cleaning apparatus, and lithographic apparatus
10/31/2007CN101063829A Overlay measuring method and overlay measuring apparatus using the same