Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/29/2008US7323245 Electric connecting part
01/29/2008US7323231 Apparatus and methods for plasma vapor deposition processes
01/29/2008US7323227 Process for precise arrangement of micro-bodies
01/29/2008US7323220 Gas phase growth system, method of operating the system, and vaporizer for the system
01/29/2008US7323212 Method and system of controlling dummy dispense
01/29/2008US7323097 Electroplating method for a semiconductor device
01/29/2008US7323096 Electrochemical treatment on an object to be treated, capable of avoiding contact between the object and the atmosphere, uniformly activating the surface of the object with precision, obtaining a good precipitation of metal ion Oon surface
01/29/2008US7323095 Integrated multi-step gap fill and all feature planarization for conductive materials
01/29/2008US7323094 For electroplating metal-containing layers on semiconductor substrates
01/29/2008US7323081 High-frequency plasma processing apparatus
01/29/2008US7323080 Apparatus for treating substrate
01/29/2008US7323063 Apparatus for changing concentration of treatment solution and treatment solution supply apparatus
01/29/2008US7323060 Substrate treating apparatus
01/29/2008US7323058 Apparatus for electroless deposition of metals onto semiconductor substrates
01/29/2008US7323051 One hundred millimeter single crystal silicon carbide wafer
01/29/2008US7322787 Devices and methods for reversing, transporting, and processing substrates
01/29/2008US7322680 Printer assembly and nozzle arrangement
01/29/2008US7322385 Apparatus for drying substrate and method thereof
01/29/2008US7322368 Plasma cleaning gas and plasma cleaning method
01/29/2008US7322313 Plasma processing system
01/29/2008US7322287 Apparatus for fluid pressure imprint lithography
01/29/2008CA2390750C Ink-jet printhead board, ink-jet printhead, and ink-jet printing apparatus
01/29/2008CA2210833C Method of wire bonding an integrated circuit to an ultraflexible substrate
01/24/2008WO2008011403A2 New scheme for copper filling in vias and trenches
01/24/2008WO2008011306A2 Substrate support with adjustable lift and rotation mount
01/24/2008WO2008011255A2 Systems and methods for laser processing during periods having non-constant velocities
01/24/2008WO2008011235A2 Ald of metal silicate films
01/24/2008WO2008011210A1 Semiconductor device with under-filled heat extractor
01/24/2008WO2008011053A1 Memory cell system with charge trap
01/24/2008WO2008011043A2 Algainn-based lasers with dovetailed ridge
01/24/2008WO2008010995A1 System and method for delivering chemicals
01/24/2008WO2008010982A2 Thermally imageable dielectric layers, thermal transfer donors and receivers
01/24/2008WO2008010959A2 Beam ablation lithography
01/24/2008WO2008010943A2 Hybrid rf capacitively and inductively coupled plasma source using multifrequency rf powers and methods of use thereof
01/24/2008WO2008010941A2 Improved methods for atomic layer deposition
01/24/2008WO2008010771A1 Method for straining a semiconductor wafer and a wafer substrate unit used therein
01/24/2008WO2008010648A1 Matching method for multiple stuck-at faults diagnosis
01/24/2008WO2008010632A1 Electrostatic chuck with high-resistivity ceramic coating materials
01/24/2008WO2008010616A1 Air pressure pivoting picker for transferring semiconductor devices
01/24/2008WO2008010591A1 Method for forming porous insulating film
01/24/2008WO2008010555A1 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device
01/24/2008WO2008010548A1 Photo mask
01/24/2008WO2008010547A1 Dicing/die-bonding tape and method for manufacturing semiconductor chip
01/24/2008WO2008010546A1 Method for manufacturing semiconductor device and substrate processing apparatus
01/24/2008WO2008010541A1 Method for reducing dislocation in group iii nitride crystal and substrate for epitaxial growth
01/24/2008WO2008010520A1 Shower plate, method for producing the same, plasma processing apparatus using the shower plate, plasma processing method, and method for manufacturing electronic device
01/24/2008WO2008010516A1 Mounting method using thermocompression head
01/24/2008WO2008010499A1 Aqueous dispersion for chemical mechanical polishing, method for producing the same, and chemical mechanical polishing method
01/24/2008WO2008010489A1 Film forming method and film forming apparatus
01/24/2008WO2008010417A1 Optical fiber amplifier, light source device, exposure device, object inspection device, and treatment device
01/24/2008WO2008010411A1 Wafer container with cushion sheet
01/24/2008WO2008010409A1 Polyimide film
01/24/2008WO2008010385A1 Analyzing method and analyzing apparatus
01/24/2008WO2008010371A1 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, computer program and storage medium
01/24/2008WO2008010370A1 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, semiconductor device, computer program and storage medium
01/24/2008WO2008010358A1 Method and apparatus for storing board-shaped body
01/24/2008WO2008010357A1 Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier
01/24/2008WO2008010310A1 Retainer ring of double-layer structure
01/24/2008WO2008010148A1 Trench field effect transistors
01/24/2008WO2008010028A1 Mim capacitor integration
01/24/2008WO2008009998A1 A semiconductor device
01/24/2008WO2008009961A2 Improvements in hydrogen trapping
01/24/2008WO2008009452A2 Device for cleaning a flat object
01/24/2008WO2008009262A2 Module having a flat structure, and equipment method
01/24/2008WO2008009105A1 Thin film transistor array having test circuitry
01/24/2008WO2007140376A3 A method for depositing and curing low-k films for gapfill and conformal film applications
01/24/2008WO2007140144A3 Back side wafer dicing
01/24/2008WO2007133306A3 Method of forming a body-tie
01/24/2008WO2007130925A3 Body-tied mosfet device with strained active area
01/24/2008WO2007127294A3 Exhaust system
01/24/2008WO2007124197A3 Method for forming silicon oxynitride materials
01/24/2008WO2007114984A3 Programmable structure including control gate overlying select gate formed in a trench
01/24/2008WO2007111991A3 Ion implanter with variable scan frequency
01/24/2008WO2007103539A3 Fabrication of inorganic materials using templates with labile linkage
01/24/2008WO2007078802A3 Epitaxial deposition of doped semiconductor materials
01/24/2008WO2007075586A3 Flexible circuit
01/24/2008WO2007038030B1 Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
01/24/2008WO2007027762A3 Metal interconnect structure for integrated ciruits and a design rule therefor
01/24/2008WO2007025675A8 Aqueous solution and method for removing ionic contaminants from the surface of a workpiece
01/24/2008WO2006071885A3 Process for high voltage superjunction termination
01/24/2008WO2006036315A3 Method and apparatus for high temperature operation of electronics
01/24/2008US20080022255 Method for interlayer and yield based optical proximity correction
01/24/2008US20080022244 Semiconductor integrated circuit pattern verification method, photomask manufacturing method, semiconductor integrated circuit device manufacturing method, and program for implementing semiconductor integrated circuit pattern verification method
01/24/2008US20080022240 Pattern data verification method for semiconductor device, computer-readable recording medium having pattern data verification program for semiconductor device recorded, and semiconductor device manufacturing method
01/24/2008US20080020683 Polishing method and polishing pad
01/24/2008US20080020676 Run-To-Run Control Of Backside Pressure For CMP Radial Uniformity Optimization Based On Center-To-Edge Model
01/24/2008US20080020594 Methods of manufacturing a phase-changeable memory device
01/24/2008US20080020593 ALD of metal silicate films
01/24/2008US20080020592 Coating with an organic antireflective coating comprising a light absorbing maleic anhydride-1,4-dioxo-5-hydroxynaphthalene copolymer, a crosslinking styrene-allylic diether copolymer, a thermal acid generator, and solvent; baking, applying photoresist, etching; ultra-fine patterns; photolithography
01/24/2008US20080020591 Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ uv cure
01/24/2008US20080020590 Controlling carbon nanotubes using optical traps
01/24/2008US20080020589 Method and system for isolated and discretized process sequence integration
01/24/2008US20080020588 Method for forming semiconductor device
01/24/2008US20080020587 Method of stripping remnant metal
01/24/2008US20080020586 Photoresist trimming process
01/24/2008US20080020585 Semiconductor device fabricating method, plasma processing system and storage medium
01/24/2008US20080020584 Method of manufacturing semiconductor device and plasma processing apparatus
01/24/2008US20080020583 Plasma etching method and computer-readable storage medium
01/24/2008US20080020582 Method of forming an opening in a semiconductor device and method of manufacturing a semiconductor device using the same
01/24/2008US20080020581 Method of fabricating dual damascene structure