Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/30/2008CN101114619A Thin-film transistor and method for producing display element using the same
01/30/2008CN101114618A Photomask, active device array substrates and manufacturing method therefor
01/30/2008CN101114617A Flash memory and method for manufacturing the same
01/30/2008CN101114616A Capacitor contact structure and technique for dynamic random access memory
01/30/2008CN101114615A Structure and method to implement dual stressor layers with improved silicide control
01/30/2008CN101114614A Method of forming integrated circuit
01/30/2008CN101114613A Method of producing active matrix substrate
01/30/2008CN101114612A Method for manufacturing dispaly device
01/30/2008CN101114611A Method for manufacturing dispaly device
01/30/2008CN101114610A Methods of trench and contact formation in memory cells
01/30/2008CN101114609A Method for manufacturing fuse box having vertically formed protective film
01/30/2008CN101114608A Method of forming a metal line of a semiconductor memory device
01/30/2008CN101114607A Method for preventing copper dual-mosaic structure from producing defect in flattening technique
01/30/2008CN101114606A Device for fixing heating component
01/30/2008CN101114605A Substrate stage and heat treatment apparatus
01/30/2008CN101114604A Apparatus and method for transferring substrate
01/30/2008CN101114603A Probe card for semiconductor integrated circuit detection and manufacturing method thereof
01/30/2008CN101114602A Device and method for detecting metal etching defect
01/30/2008CN101114601A Automatic level adjustment for die bonder
01/30/2008CN101114600A Method and structure for preventing soldering pad stripping
01/30/2008CN101114599A Method for making embedded resistor in semiconductor wafer
01/30/2008CN101114598A Electronic packages with roughened wetting and non-wetting zones
01/30/2008CN101114597A Micromodule contraposition assembled method and apparatus
01/30/2008CN101114596A MOSFET and manufacturing method thereof
01/30/2008CN101114595A Polysilicon thin-film transistor and method for producing the same
01/30/2008CN101114594A Method for improving gallium nitride based transistor material and device performance using indium doping
01/30/2008CN101114593A Method for improving the quality of an SiC crystal and SiC semiconductor device
01/30/2008CN101114592A Semiconductor device and method of manufacturing the same
01/30/2008CN101114591A Pressure capacitance type sensor substrate cavity-forming method
01/30/2008CN101114590A Method of fabricating semiconductor device, and plating apparatus
01/30/2008CN101114589A Method and apparatus for manufacturing semiconductor device, computer storage medium, and storage medium for storing the processing recipe
01/30/2008CN101114588A Manufacturing method of semiconductor device
01/30/2008CN101114587A An apparatus and associated method for making a floating gate memory device with increased gate coupling ratio
01/30/2008CN101114586A Method for fabricating semiconductor device
01/30/2008CN101114585A Method of forming poly-si pattern, diode having poly-si pattern, multi-layer cross point resistive memory device having poly-si pattern, and method of manufacturing the diode and the memory device
01/30/2008CN101114584A Method for epitaxy InAlGaN monocrystal film using MBE
01/30/2008CN101114583A Semiconductor power device and manufacturing method thereof
01/30/2008CN101114582A Non-lead ferro-electric film compatible with semiconductor technology and method for making same
01/30/2008CN101114581A Apparatus for treating substrates
01/30/2008CN101114580A Semiconductor device and method for manufacturing thereof
01/30/2008CN101114579A Liquid processing system
01/30/2008CN101114578A Substrate processing method and substrate processing apparatus
01/30/2008CN101114577A Substrate processing apparatus
01/30/2008CN101114576A Apparatus for treating substrates
01/30/2008CN101114575A Apparatus for treating substrates
01/30/2008CN101114574A Method for manufacturing bonded soi wafer and bonded soi wafer manufactured thereby
01/30/2008CN101114573A Apparatus for treating substrates
01/30/2008CN101114572A Substrate processing apparatus and substrate processing method
01/30/2008CN101114571A Semiconductor device and method of manufacturing the same
01/30/2008CN101114570A Microlens, an image sensor including a microlens, method of forming a microlens and method for manufacturing an image sensor
01/30/2008CN101114569A Method and apparatus for removing contamination from substrate
01/30/2008CN101114454A Magnetic head separation auxiliary device and magnetic head separation method
01/30/2008CN101114134A Alignment method and micro-device manufacturing method used for shadow cast scan photo-etching machine
01/30/2008CN101114133A Lithographic apparatus and device manufacturing method
01/30/2008CN101114132A Projection exposure apparatus
01/30/2008CN101114128A System and method for measuring power of lithographic system
01/30/2008CN101114127A Pixel structure and manufacturing method therefor
01/30/2008CN101114126A Method for forming ITO pattern
01/30/2008CN101114122A Etching apparatus and method
01/30/2008CN101114119A Multi-tone optical mask, method of manufacturing the same and method of manufacturing thin-film transistor substrate by using the same
01/30/2008CN101114099A Liquid crystal display and mfg. method therefor
01/30/2008CN101114098A Display device and a method for manufacturing the same
01/30/2008CN101114008A A system for acquiring device parameters
01/30/2008CN101113990A Method for manufacturing probe card
01/30/2008CN101113958A Image checking apparatus
01/30/2008CN101113957A Substrate inspection device and lamp unit used therein
01/30/2008CN101113517A Substrate processing apparatus
01/30/2008CN101112940A Container conversion device for semi-conductor packaging element
01/30/2008CN101112789A Process of production of patterned structure
01/30/2008CN101112751A Chemical mechanical lapping system and chemical mechanical lapping method
01/30/2008CN101112750A Collocation method of pipes for transferring the grinding fluid and the de-ionized water in the chemical and mechanical grinder
01/30/2008CN101112749A Configurable polishing apparatus
01/30/2008CN100366137C Electronic part mounting apparatus and method therefor
01/30/2008CN100366132C A method of forming an opening or cavity in a substrate for receiving an electronic component
01/30/2008CN100366129C Method and arrangement for producing radiation
01/30/2008CN100365936C Semiconductor integrated circuit
01/30/2008CN100365891C Semiconductor light-emitting device and method for manufacturing same
01/30/2008CN100365890C Providing an organic vertical cavity laser array device with etched region in dielectric stack
01/30/2008CN100365889C Method for preventing vertical-cavity-face emitting semiconductor laser from cracking while wet oxidation
01/30/2008CN100365882C Negative high-voltage electronic striking sparks balling apparatus
01/30/2008CN100365843C Spin switch and magnetic storage element using it
01/30/2008CN100365827C Thin film transistor, circuit device and liquid crystal display
01/30/2008CN100365826C Trench FET with self aligned source and contact
01/30/2008CN100365825C Bipolar transistor
01/30/2008CN100365819C Flash memory structure and its preparation method
01/30/2008CN100365818C 3D polysilicon read only memory and preparation method
01/30/2008CN100365816C Capacitor element and method for fabricating the same
01/30/2008CN100365814C Back-to-back packaging integrated circuit and its producing method
01/30/2008CN100365811C Interconnect for a semiconductor device
01/30/2008CN100365809C Semiconductor device
01/30/2008CN100365808C Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head
01/30/2008CN100365807C Plural semiconductor devices in monolithic flip chip
01/30/2008CN100365806C Semiconductor package with non-oxide copper-wire
01/30/2008CN100365804C Encapsulated integrated circuit component and its producing method
01/30/2008CN100365803C Hermetic sealing cap and method for producing same
01/30/2008CN100365802C Method for manufacturing a flash memory device
01/30/2008CN100365801C Method for manufacturing semiconductor device
01/30/2008CN100365800C Circuit layout structure
01/30/2008CN100365799C Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
01/30/2008CN100365798C Electronic device, assembly and methods of manufacturing an electronic device