| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/17/2008 | US20080011422 Plasma Processing System And Apparatus And A Sample Processing Method |
| 01/17/2008 | US20080011412 Sheet Peeling Apparatus and Peeling Method |
| 01/17/2008 | US20080011403 Tape Bonder, Tape Bonding Method, And Process For Manufacturing Electronic Component |
| 01/17/2008 | US20080011349 Nanostructured quantum dots or dashes in photovoltaic devices and methods thereof |
| 01/17/2008 | US20080011228 Semiconductor device, method for manufacturing the same, and plating solution |
| 01/17/2008 | US20080010845 Apparatus for cleaning a wafer substrate |
| 01/17/2008 | US20080010818 Wafer Expanding Device, Component Feeder, and Expanding Method for Wafer Sheet |
| 01/17/2008 | US20080010798 Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof |
| 01/17/2008 | DE4426899B4 Verfahren zur Herstellung eines Polyimid-Epoxidharz-Verbundes A process for the preparation of a polyimide-epoxy composite |
| 01/17/2008 | DE19613642B4 Halbleitereinrichtung zum Verkleinern von Wirkungen eines Rauschens auf eine interne Schaltung Semiconductor device to Shrink effects of noise on an internal circuit |
| 01/17/2008 | DE112006000505T5 Halbleiterbausteinherstellung Semiconductor device fabrication |
| 01/17/2008 | DE112005003421T5 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 01/17/2008 | DE112004000956T5 Verfahren zur Ausbildung einer Verbindung A process for preparing a compound |
| 01/17/2008 | DE10319538B4 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitereinrichtung A semiconductor device and method of manufacturing a semiconductor device |
| 01/17/2008 | DE10259728B4 Verfahren zur Herstellung einer Grabenisolationsstruktur und Verfahren zum Steuern eines Grades an Kantenrundung einer Grabenisolationsstruktur in einem Halbleiterbauelement A process for the preparation of a grave isolation structure and method for controlling a degree of edge rounding a grave isolation structure in a semiconductor device |
| 01/17/2008 | DE10255427B4 Verfahren zur Herstellung einer Antifuse in einem Substrat und Antifuse-Struktur zur Integration in einem Substrat A process for producing an antifuse in a substrate and antifuse structure to be integrated into a substrate |
| 01/17/2008 | DE10241158B4 Verfahren zum Herstellen einer SRAM-Halbleitervorrichtung mit rechteckigen Gateverdrahtungselementen A method of manufacturing a semiconductor device having SRAM rectangular gate wiring elements |
| 01/17/2008 | DE102007032636A1 Verfahren zur Herstellung einer dielektrischen Schicht für ein elektronisches Bauelement A process for producing a dielectric layer for an electronic component |
| 01/17/2008 | DE102007023885A1 Siliziumcarbid-Halbleitervorrichtung vom Graben-MOS-Typ und Verfahren zur Herstellung derselben Silicon carbide semiconductor device of the trench MOS type and method of making same |
| 01/17/2008 | DE102006055329A1 Dünnfilmtransistor, Verfahren zu deren Herstellung, und Anzeigevorrichtung A thin film transistor, to processes for their preparation, and display device |
| 01/17/2008 | DE102006032958A1 Vergrabene Bitleitung mit reduziertem Widerstand Buried bit line with reduced resistance |
| 01/17/2008 | DE102006032796A1 Semiconductor component chip, particularly chip with electrically insulated rear side, for integrated computing circuits, has insulation layer at rear end, which is formed to electrically insulate semiconductor component chip from base body |
| 01/17/2008 | DE102006032738A1 Method for manufacturing structural body by etching process, involves measuring etching progress during process, where etching progress is locally determined at measuring point by optical measurement particularly by polarimetric inferometer |
| 01/17/2008 | DE102006032636A1 Verfahren zum Herstellen eines Keramiksubstrats sowie Keramiksubstrat A method of manufacturing a ceramic substrate and the ceramic substrate |
| 01/17/2008 | DE102006032488A1 Vorrichtung und Verfahren zur Bearbeitung von Wafern Apparatus and method for processing of wafers |
| 01/17/2008 | DE102006032251A1 Verfahren zum Herstellen von Chip-Packages sowie derartig hergestelltes Chip-Package A method for producing chip package and chip package produced in this way |
| 01/17/2008 | DE102006031434A1 Handhabungsvorrichtung sowie Handhabungsverfahren für Wafer Handling apparatus and method for wafer handling |
| 01/17/2008 | DE102006031358A1 Verfahren zur Gehäusung optischer oder optoelektronischer Bauteile, sowie verfahrensgemäß herstellbares optisches oder optoelektronisches Gehäuseelement Method for Gehäusung optical or optoelectronic devices, as well as process according producible optical or optoelectronic housing element |
| 01/17/2008 | DE102006030257A1 Teststruktur zum Bestimmen der Eigenschaften von Halbleiterlegierungen in SOI-Transistoren mittels Röntgenbeugung Test structure for determining the properties of semiconductor alloys in SOI-transistors by means of X-ray diffraction |
| 01/17/2008 | DE102006028543A1 Integrated bipolar complementary metal oxide semiconductor circuit fabrication comprises forming epitaxial layer including lower silicon-germanium sublayer having higher germanium concentration than upper silicon-germanium sublayer |
| 01/17/2008 | DE102006025961A1 Halbleiterschaltungsanordnung, Systemträger und Verfahren zur Herstellung eines Systemträgers und einer Halbleiterschaltungsanordnung A semiconductor circuit arrangement, system unit and method of manufacturing a lead frame and a semiconductor circuit arrangement |
| 01/17/2008 | DE102006025960A1 Verfahren zur Herstellung einer integrierten Halbleitereinrichtung A method of manufacturing an integrated semiconductor device |
| 01/17/2008 | DE102006020243B3 Leistungshalbleitermodul als H-Brückenschaltung und Verfahren zur Herstellung desselben The power semiconductor module of the same as an H-bridge circuit and methods for making |
| 01/17/2008 | DE102006016173B4 Spritzgieß- oder Spritzpresswerkzeug Injection molding or molding tool |
| 01/17/2008 | DE102004063066B4 Vorrichtung und Verfahren zur Waferplanierung Apparatus and method for Waferplanierung |
| 01/17/2008 | DE102004029945B4 Verfahren zur Herstellung einer oberflächennahen dotierten Zone in einem Halbleiterkörper A process for producing a subsurface doped region in a semiconductor body |
| 01/17/2008 | DE102004005361B4 Verfahren zur Herstellung von metallischen Leitbahnen und Kontaktflächen auf elektronischen Bauelementen A process for the production of metallic interconnects and contact surfaces on electronic components |
| 01/17/2008 | DE10130129B4 Zerstäubungsvorrichtung Sputtering |
| 01/16/2008 | EP1879235A2 Vertical gate semiconductor device and method for manufacturing the same |
| 01/16/2008 | EP1879234A2 Low temperature sol-gel silicates as dielectrics or planarization layers for thin film transistors |
| 01/16/2008 | EP1879225A1 Heat treatment for stabilising a gluing interface |
| 01/16/2008 | EP1879224A2 Process for controlling denuded zone depth in an ideal oxygen precipitating silicon wafer |
| 01/16/2008 | EP1879223A1 Composition for copper wiring polishing and method of polishing surface of semiconductor integrated circuit |
| 01/16/2008 | EP1879222A2 Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers |
| 01/16/2008 | EP1879221A1 Method of mask forming and method of three-dimensional microfabrication |
| 01/16/2008 | EP1879220A2 Direct water-repellent gluing method of two substrates used in electronics, optics or optoelectronics |
| 01/16/2008 | EP1879219A1 Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method |
| 01/16/2008 | EP1879218A1 Optical element driving apparatus, projection optical system, exposure apparatus and device manufacturing method |
| 01/16/2008 | EP1879217A1 Exposure method, exposure apparatus, device manufacturing method and exposure apparatus evaluating method |
| 01/16/2008 | EP1879216A1 Liquid processing apparatus and method |
| 01/16/2008 | EP1879070A1 Composition for resist underlayer film formation for forming photocrosslinking cured resist underlayer film |
| 01/16/2008 | EP1878809A1 Al-Ni-B ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME |
| 01/16/2008 | EP1878694A2 Method of nanostructuring the surface of a substrate |
| 01/16/2008 | EP1878059A1 Semiconductor arrangement of mosfets |
| 01/16/2008 | EP1878056A2 Bipolar semiconductor device and manufacturing method thereof |
| 01/16/2008 | EP1878049A2 Multi-chip module and method of manufacture |
| 01/16/2008 | EP1878048A2 Multi-chip module and method of manufacture |
| 01/16/2008 | EP1878047A1 Improvements in transistor manufacture |
| 01/16/2008 | EP1878046A1 Method of fabricating a bipolar transistor |
| 01/16/2008 | EP1878045A2 Bipolar transistor and method of fabricating the same |
| 01/16/2008 | EP1878043A2 Low-dielectric constant cryptocrystal layers and nanostructures |
| 01/16/2008 | EP1878042A2 Silicon wafer having through-wafer vias |
| 01/16/2008 | EP1878041A1 Transporting device, in particular for transporting sheet-like substrates through a coating installation |
| 01/16/2008 | EP1877878A1 Method of generating and using a plasma processing control program |
| 01/16/2008 | EP1877758A2 Wafer edge inspection |
| 01/16/2008 | EP1877530A2 Removal of high-dose ion-implanted photoresist using self-assembled monolayers in solvent systems |
| 01/16/2008 | EP1642332B1 Die bonding |
| 01/16/2008 | EP1590498A4 Methods of making carbon nanotube films, layers, fabrics, ribbons, elements and articles |
| 01/16/2008 | EP1476875B1 Mram without isolation devices |
| 01/16/2008 | EP1451860B1 Cmos process with an integrated, high performance, silicide agglomeration fuse |
| 01/16/2008 | EP1451759B1 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof |
| 01/16/2008 | EP1449126A4 Integrated circuit chip design |
| 01/16/2008 | EP1266405B1 Planarised semiconductor structure including a conductive fuse and process for fabrication thereof |
| 01/16/2008 | EP1186007B1 Process chamber assembly with reflective hot plate |
| 01/16/2008 | EP1186004B1 Processing chamber with optical window cleaned using process gas |
| 01/16/2008 | CN201007988Y Accurate vibration positioning platform |
| 01/16/2008 | CN201007987Y Wafer putting device for wafer transplanter |
| 01/16/2008 | CN201007986Y 300mm silicon slice rewinding device |
| 01/16/2008 | CN201007781Y System for preventing wafer inclination during baking process after exposure |
| 01/16/2008 | CN201007722Y Semiconductor component testing table with flexible buffering heat conduction foundation |
| 01/16/2008 | CN201007721Y Semiconductor component testing table with ventiduct cooling device |
| 01/16/2008 | CN101107715A 半导体装置 Semiconductor device |
| 01/16/2008 | CN101107713A Cap layers and/or passivation layers for nitride-based transistors, transistor structures and methods of fabricating same |
| 01/16/2008 | CN101107704A Thin film transistor array devices |
| 01/16/2008 | CN101107703A Manufacturing method for semiconductor chips, and semiconductor chip |
| 01/16/2008 | CN101107702A Processing system and its operation method |
| 01/16/2008 | CN101107701A Substrate convey processing device, trouble countermeasure method in substrate convey processing device, and trouble countermeasures program in substrate convey processing device |
| 01/16/2008 | CN101107700A Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line |
| 01/16/2008 | CN101107699A Copper interconnect wiring and method of forming thereof |
| 01/16/2008 | CN101107698A Method for manufacturing semiconductor device |
| 01/16/2008 | CN101107697A CMP polishing method, CMP polishing apparatus, and process for producing semiconductor device |
| 01/16/2008 | CN101107696A Pre-etch implantation damage for the removal of thin film layers |
| 01/16/2008 | CN101107695A Transparent conductive film forming apparatus, multilayer transparent conductive film continuously forming apparatus and method of film forming therewith |
| 01/16/2008 | CN101107693A Magnetron control method, magnetron service life judgment method, microwave generation device, magnetron service life judgment device, processing device, computer program, and storage medium |
| 01/16/2008 | CN101107573A Exposure system and device |
| 01/16/2008 | CN101107569A Composition for forming of underlayer film for lithography that contains compound having protected carboxyl |
| 01/16/2008 | CN101107567A Positive-working resist composition and method for resist pattern formation |
| 01/16/2008 | CN101107467A Valve element, valve, selector valve, and trap device |
| 01/16/2008 | CN101107186A Stage apparatus and application processing apparatus |
| 01/16/2008 | CN101107093A High-speed, precise, laser-based material processing method and system |