Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/17/2008US20080014071 Safety interlock system for mechanical manipulators
01/17/2008US20080014057 Loading and Unloading Apparatus For A Coating Device
01/17/2008US20080013824 Defect inspection method, defect inspection apparatus, and semiconductor device manufacturing method
01/17/2008US20080013680 Collector configured of mirror shells
01/17/2008US20080013580 Surface-emitting type semiconductor laser and its manufacturing method
01/17/2008US20080013364 Method of making non-volatile memory cell with embedded antifuse
01/17/2008US20080013355 Selective oxidation of silicon in diode, tft and monolithic three dimensional memory arrays
01/17/2008US20080013354 Low Cost High Density Rectifier Matrix Memory
01/17/2008US20080013339 Red fluorescent material, white light emitting diode using red fluorescent material, and lighting device using white light emitting diode
01/17/2008US20080013309 Elongated Electro-Optic Device
01/17/2008US20080013232 Electrostatic discharge protective circuit and semiconductor integrated circuit using the same
01/17/2008US20080013097 Resonant scanning mirror
01/17/2008US20080013091 Position detecting method and apparatus
01/17/2008US20080013073 Measurement Method, Measurement Apparatus, Exposure Method, and Exposure Apparatus
01/17/2008US20080013072 Pattern inspection apparatus
01/17/2008US20080013058 Pneumatic Spring Apparatus, Vibration-Proof Apparatus, Stage Apparatus and Exposure Apparatus
01/17/2008US20080013026 In-plane switching mode liquid crystal display device and method of fabricating the same
01/17/2008US20080013007 Liquid crystal display device, method of driving the same, and method of manufacturing the same
01/17/2008US20080013002 Lenticular lens and method of fabricating thereof
01/17/2008US20080012588 Silicon Wafer for Probe Bonding and Probe Bonding Method Using Thereof
01/17/2008US20080012304 Vacuum feeding joint
01/17/2008US20080012156 Reacted with a polyarylene ether flexibilizer; thermoplastic poly(2,3-epoxy-2-methyl ether) thermoplastic; spheriodal particle filler; higher fracture toughness, lower viscosity or increased thermal shock resistance at below -40 degrees C.; encapsulated semiconductor chips
01/17/2008US20080012154 Molded circuit board and method for the same
01/17/2008US20080012152 Component and method for producing a component
01/17/2008US20080012150 Chip structure
01/17/2008US20080012148 Semiconductor chip package and method manufacturing method thereof
01/17/2008US20080012147 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film
01/17/2008US20080012146 Semiconductor device and method of fabricating the same
01/17/2008US20080012145 Semiconductor Device and Method for Manufacturing the Same
01/17/2008US20080012144 Method for producing chip packages, and chip package produced in this way
01/17/2008US20080012143 Semiconductor Device and Method of Fabricating the Same
01/17/2008US20080012142 Structure and method of chemically formed anchored metallic vias
01/17/2008US20080012140 Wiring substrate, semiconductor device, and method of manufacturing the same
01/17/2008US20080012139 Thin film transistor array panel and manufacturing method thereof
01/17/2008US20080012137 Semiconductor device having trench structures and method
01/17/2008US20080012136 Metal Interconnection Structure of Semiconductor Device and Method for Manufacturing the Same
01/17/2008US20080012135 Semiconductor Device and Method for Manufacturing the Same
01/17/2008US20080012134 Metal interconnection structures and methods of forming the same
01/17/2008US20080012130 Semiconductor device, circuit substrate, electro-optic device and electronic appliance
01/17/2008US20080012129 Semiconductor device and method of producing the same
01/17/2008US20080012128 Semiconductor device and manufacturing method of the same
01/17/2008US20080012124 Curable protectant for electronic assemblies
01/17/2008US20080012121 Semiconductor device, electro-optical device, and method for manufacturing semiconductor device
01/17/2008US20080012120 Multilayer wiring substrate and manufacturing method thereof
01/17/2008US20080012117 Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same
01/17/2008US20080012116 Semiconductor device and method of forming the same
01/17/2008US20080012115 Methods and apparatus for packaging integrated circuit devices
01/17/2008US20080012114 System for contacting electronic devices and production processes thereof
01/17/2008US20080012111 Semiconductor package and fabrication method thereof
01/17/2008US20080012096 Semiconductor chip and method of forming the same
01/17/2008US20080012095 Integrated circuit package system including wafer level spacer
01/17/2008US20080012093 Capacitor constructions
01/17/2008US20080012087 Bonded wafer avalanche photodiode and method for manufacturing same
01/17/2008US20080012082 Large area flat image sensor assembly
01/17/2008US20080012080 Non-volatile semiconductor memory device and method of manufacturing the same
01/17/2008US20080012079 Memory cell having active region sized for low reset current and method of fabricating such memory cells
01/17/2008US20080012078 Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layer
01/17/2008US20080012076 Display device, method for manufacturing thereof, and television device
01/17/2008US20080012069 Vertical gate semiconductor device and method for manufacturing the same
01/17/2008US20080012068 Process for forming a short channel trench MOSFET and device formed thereby
01/17/2008US20080012067 Transistor and memory cell array and methods of making the same
01/17/2008US20080012066 Method for making a raised vertical channel transistor device
01/17/2008US20080012063 Flash Memory and Method for Manufacturing the Same
01/17/2008US20080012062 Eeprom device and method of fabricating the same
01/17/2008US20080012059 Semiconductor device and manufacturing method thereof
01/17/2008US20080012058 Semiconductor device and method of manufacturing same
01/17/2008US20080012057 Semiconductor Device Using Fuse/Anti-Fuse System and Method of Manufacturing the Same
01/17/2008US20080012056 Capacitorless one transistor dram cell, integrated circuitry comprising an array of capacitorless one transistor dram cells, and method of forming lines of capacitorless one transistor dram cells
01/17/2008US20080012053 Method of manufacturing semiconductor device having trench-gate transistor
01/17/2008US20080012052 Semiconductor device and method for implantation of doping agents in a channel
01/17/2008US20080012048 Semiconductor Device And Method For Manufacturing Same
01/17/2008US20080012045 Semiconductor device and method of manufacturing the same
01/17/2008US20080012038 Blue-light emitting aluminum nitride material and method of manufacturing the same
01/17/2008US20080012036 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
01/17/2008US20080012033 Optoelectronic Semiconductor Component and Housing Base for Such a Component
01/17/2008US20080012031 White light-emitting diode using semiconductor nanocrystals and preparation method thereof
01/17/2008US20080012026 Trench mos type silicon carbide semiconductor device and method for manufacturing the same
01/17/2008US20080012024 Organic thin film transistor substrate and fabrication thereof
01/17/2008US20080012022 Electro-optic device substrate, electro-optic device, electronic apparatus and method for manufacturing electro-optic device substrate
01/17/2008US20080012019 Method and structure for forming self-aligned, dual stress liner for cmos devices
01/17/2008US20080012016 Transparent conductive film, semiconductor device and active matrix display unit
01/17/2008US20080012015 METHOD FOR FABRICATING CuInS2 THIN FILM BY METAL ORGANIC CHEMICAL VAPOR DEPOSITION, CuInS2 THIN FILM FABRICATED BY THE SAME AND METHOD FOR FABRICATING In2S3 THIN FILM THEREFROM
01/17/2008US20080012013 Pattern manufacturing equipments, organic thin-film transistors and manufacturing methods for organic thin-film transistor
01/17/2008US20080012011 Thin film transistor array panel and method of manufacture
01/17/2008US20080012008 Making organic thin film transistor array panels
01/17/2008US20080012005 Controlled growth of larger heterojunction interface area for organic photosensitive devices
01/17/2008US20080012000 Method and apparatus for forming an integrated circuit electrode having a reduced contact area
01/17/2008US20080011999 Microelectronic Devices Using Sacrificial Layers and Structures Fabricated by Same
01/17/2008US20080011968 Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
01/17/2008US20080011947 Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus
01/17/2008US20080011811 Zirconia toughened alumina esd safe ceramic composition, component, and methods for making same
01/17/2008US20080011734 Heat-treating apparatus
01/17/2008US20080011726 Method of deciding focal plane and method of crystallization using thereof
01/17/2008US20080011718 Procedure for etching of materials at the surface with focussed electron beam induced chemical reactions at said surface
01/17/2008US20080011716 Plasma Processing Apparatus And Method
01/17/2008US20080011714 Photoresist stripping solution and a method of stripping photoresists using the same
01/17/2008US20080011713 Substrate processing apparatus, substrate processing method and substrate manufacturing method
01/17/2008US20080011508 Electronic parts packaging structure and method of manufacturing the same
01/17/2008US20080011450 Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces
01/17/2008US20080011425 Plasma Processing Apparatus And Method