| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/31/2008 | US20080023787 Semiconductor device |
| 01/31/2008 | US20080023785 Bottom source LDMOSFET structure and method |
| 01/31/2008 | US20080023781 Photodiode and manufacturing method of the same |
| 01/31/2008 | US20080023780 Image pickup device and method of manufacturing the same |
| 01/31/2008 | US20080023776 Metal oxide semiconductor device with improved threshold voltage and drain junction breakdown voltage and method for fabricating same |
| 01/31/2008 | US20080023775 ASYMMETRIC FIELD EFFECT TRANSISTORS (FETs) |
| 01/31/2008 | US20080023774 Semiconductor device and method for fabricating the same |
| 01/31/2008 | US20080023773 Semiconductor device and method of manufacturing the same |
| 01/31/2008 | US20080023772 Semiconductor device including a germanium silicide film on a selective epitaxial layer |
| 01/31/2008 | US20080023771 Semiconductor structure comprising field effect transistors with stressed channel regions and method of forming the same |
| 01/31/2008 | US20080023770 Stacked semiconductor devices and methods of manufacturing the same |
| 01/31/2008 | US20080023769 Semiconductor Devices Having Selectively Tensile Stressed Gate Electrodes and Methods of Fabricating the Same |
| 01/31/2008 | US20080023765 Semiconductor Devices and Methods of Fabricating the Same |
| 01/31/2008 | US20080023764 Semiconductor memory device and manufacturing method of the same |
| 01/31/2008 | US20080023763 Threshold-voltage trimming of insulated-gate power devices |
| 01/31/2008 | US20080023762 Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology |
| 01/31/2008 | US20080023761 Semiconductor devices and methods of fabricating the same |
| 01/31/2008 | US20080023759 Low voltage high density trench-gated power device with uniformly doped channel and its edge termination |
| 01/31/2008 | US20080023757 Semiconductor device having fin-field effect transistor and manufacturing method thereof |
| 01/31/2008 | US20080023756 Semiconductor device and fabricating method thereof |
| 01/31/2008 | US20080023755 Semiconductor device and method for fabricating the same |
| 01/31/2008 | US20080023754 Semiconductor device with a wave-shaped trench or gate and method for manufacturing the same |
| 01/31/2008 | US20080023753 Semiconductor device and method for fabricating the same |
| 01/31/2008 | US20080023752 BORON DOPED SiGe HALO FOR NFET TO CONTROL SHORT CHANNEL EFFECT |
| 01/31/2008 | US20080023749 Non-volatile memory device and methods of operating and fabricating the same |
| 01/31/2008 | US20080023746 Semiconductor devices having dielectric layers and methods of forming the same |
| 01/31/2008 | US20080023743 Semiconductor memory device and manufacturing method of the same |
| 01/31/2008 | US20080023741 Nonvolatile ferroelectric memory device using silicon substrate, method for manufacturing the same, and refresh method thereof |
| 01/31/2008 | US20080023739 Method of manufacturing a semiconductor wafer comprising an integrated optical filter |
| 01/31/2008 | US20080023737 Image sensor and method for manufacturing the same |
| 01/31/2008 | US20080023736 Semiconductor Device and Method for Manufacturing the Same |
| 01/31/2008 | US20080023735 Light sensing element, array substrate having the same and liquid crystal display apparatus having the same |
| 01/31/2008 | US20080023733 Fabrication methods for compressive strained-silicon and transistors using the same |
| 01/31/2008 | US20080023732 Use of carbon co-implantation with millisecond anneal to produce ultra-shallow junctions |
| 01/31/2008 | US20080023730 Imaging apparatus and a device for use therewith |
| 01/31/2008 | US20080023728 Semiconductor Integrated Circuits With Stacked Node Contact Structures |
| 01/31/2008 | US20080023726 Schottky gate metallization for semiconductor devices |
| 01/31/2008 | US20080023722 Light-emitting heat-dissipating device and packaging method thereof |
| 01/31/2008 | US20080023717 Display substrate, method of manufacturing the same and display device having the same |
| 01/31/2008 | US20080023713 Package for Housing Light-Emitting Element and Method for Manufacturing Package for Housing Light-Emitting Element |
| 01/31/2008 | US20080023710 Method of growing a nitride single crystal on silicon wafer, nitride semiconductor light emitting diode manufactured using the same and the manufacturing method |
| 01/31/2008 | US20080023709 Semiconductor light-emitting device and method of fabricating the same |
| 01/31/2008 | US20080023707 Semiconductor device and method of producing the semiconductor device |
| 01/31/2008 | US20080023705 Thin-film transistor substrate, method of manufacturing the same and display panel having the same |
| 01/31/2008 | US20080023704 Display Device and Fabrication Method Thereof |
| 01/31/2008 | US20080023702 Integrated circuit module and method of forming the same |
| 01/31/2008 | US20080023701 Test module for semiconductor device |
| 01/31/2008 | US20080023698 Device having zinc oxide semiconductor and indium/zinc electrode |
| 01/31/2008 | US20080023693 Methods, devices and compositions for depositing and orienting nanostructures |
| 01/31/2008 | US20080023686 Storage nodes, phase change memories including a doped phase change layer, and methods of operating and fabricating the same |
| 01/31/2008 | US20080023657 Extreme ultraviolet light source |
| 01/31/2008 | US20080023651 TDI detecting device, a feed-through equipment, an electron beam apparatus using these device and equipment, and a semiconductor device manufacturing method using the same electron beam apparatus |
| 01/31/2008 | US20080023528 Fabrication method and structure of pcb assembly, and tool for assembly thereof |
| 01/31/2008 | US20080023501 Tap Unit for a Beverage Dispenser |
| 01/31/2008 | US20080023443 Alternating asymmetrical plasma generation in a process chamber |
| 01/31/2008 | US20080023417 Clean stocker and method of storing articles |
| 01/31/2008 | US20080023147 Plasma processing apparatus |
| 01/31/2008 | US20080023145 Plasma processing apparatus and method |
| 01/31/2008 | US20080023144 Dielectric etch tool configured for high density and low bombardment energy plasma providing high etch rates |
| 01/31/2008 | US20080023143 Capacitively coupled plasma reactor with magnetic plasma control |
| 01/31/2008 | US20080023139 Plasma processing apparatus and plasma processing method |
| 01/31/2008 | US20080023134 Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods |
| 01/31/2008 | US20080023029 Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon |
| 01/31/2008 | US20080022519 Electronic package with optimized lamination process |
| 01/31/2008 | DE19904065B4 Verfahren zum Herstellen thermisch stabilen Silizids A method for producing thermally stable silicide |
| 01/31/2008 | DE19725830B4 Photomaske mit Halbton-Phasenverschiebungsmaterial und einem Chrommuster auf einem transparenten Substrat Photomask having halftone phase shift material and a chromium pattern on a transparent substrate |
| 01/31/2008 | DE112006000811T5 Ätzprozess für CD-Reduzierung eines ARC-Materials Etching process for CD reduction of ARC material |
| 01/31/2008 | DE112006000413T5 Steuergateprofil für Flash-Technologie Control gate profile for Flash technology |
| 01/31/2008 | DE112005003128T5 Verbesserte Gleichförmigkeit bei der Sprühbearbeitung von Chargen durch Ausnutzen unabhängiger Kassettendrehung Improved uniformity in Sprühbearbeitung batches by utilizing independent cassette rotation |
| 01/31/2008 | DE10356097B4 Seitenwandsperrschichtstruktur und Herstellungsverfahren Sidewall barrier structure and manufacturing method |
| 01/31/2008 | DE10342472B4 Schaltungsanordnung und Verfahren zum Testen eines Kapazitätsfeldes in einer integrierten Schaltung Circuit arrangement and method for testing a capacitance array in an integrated circuit |
| 01/31/2008 | DE10333129B4 Verfahren zur Bildung einer Siliziumnitridschicht für einen flaschenförmigen Graben A method for forming a silicon nitride layer for a bottle-shaped trench |
| 01/31/2008 | DE10303682B4 Verfahren zum Bewerten lateraler Dotier- und/oder Ladungsträgerprofile A method for evaluating lateral doping and / or carrier profiles |
| 01/31/2008 | DE102007033918A1 Halbleiterbauelement und Herstellungsverfahren davon A semiconductor device and manufacturing method thereof |
| 01/31/2008 | DE102007033234A1 Halbleiterchip und Verfahren zur Ausbildung desselben The same semiconductor chip and process for forming |
| 01/31/2008 | DE102007031966A1 Struktur eines Bildsensormoduls und Herstellungsverfahren für ein Wafer-Level-Package An image sensor module structure and production method of a wafer level package |
| 01/31/2008 | DE102007029378A1 Nachgiebige, leitende Zwischenverbindungen Resilient, conductive interconnections |
| 01/31/2008 | DE102007025950A1 Halbleitervorrichtung und ihr Herstellungsverfahren A semiconductor device and its manufacturing method |
| 01/31/2008 | DE102007020033A1 Verfahren zur Qualitätsbestimmung einer Lichtquelle Method for determining the quality of a light source |
| 01/31/2008 | DE102006053941B3 Method for examining mechanical break resistance of semiconductor wafer, involves exposing border area of semiconductor wafer, by discharging semiconductor wafer with manipulation tool from thermal pressure of heated reactor |
| 01/31/2008 | DE102006048583B3 Component has two connections and four side surfaces with contact areas, where two side surfaces are opposite to each other, and contact areas of opposite side surfaces are connected with different connections |
| 01/31/2008 | DE102006044525B3 Method for production of integrated circuit, involves continuous making of flexible substrate having conductive strip structure, where flexible integrated circuit is connected with conductive strip structure of flexible substrate |
| 01/31/2008 | DE102006040435B3 Power semiconductor module assembling arrangement, has area of terminal contacts aligned parallel towards lower side of module housing such that contacts form angle of preset degrees to lower side of housing |
| 01/31/2008 | DE102006038077A1 Solid electrolyte storage cell comprises cathode, anode and solid electrolytes, where anode has intercalation material and metal species, which are unfixed in intercalation material |
| 01/31/2008 | DE102006035650A1 Verfahren zum Herstellen mindestens einer Halbleiterkomponente und Speicherzellen A method for manufacturing at least one semiconductor component, and memory cells |
| 01/31/2008 | DE102006035596A1 Signal producing method, involves measuring emission of electromagnetic radiation during etching and cleaning steps, where signal is produced, when measured emission exceeds predetermined threshold value |
| 01/31/2008 | DE102006035119A1 Verfahren zur Herstellung eines Transistors, Verfahren zur Herstellung einer Speicherzellenanordnung, Transistor und Speicherzellenanordnung A method of manufacturing a transistor, method of making a memory cell array transistor and memory cell arrangement |
| 01/31/2008 | DE102006035073A1 Bauelement mit einem Dünnfilmtransistor und CMOS-Transistoren sowie Verfahren zur Herstellung Component having a thin film transistor and CMOS transistors, as well as process for preparing |
| 01/31/2008 | DE102006034679A1 Halbleitermodul mit Leistungshalbleiterchip und passiven Bauelement sowie Verfahren zur Herstellung desselben The same semiconductor module with a power semiconductor die and passive component as well as methods for preparing |
| 01/31/2008 | DE102006034599A1 Method for grouping semiconductor chips, involves preparing wafer, which is rotated around rotation axis during manufacture or processing and has many unscattered semiconductor chips |
| 01/31/2008 | DE102006034455A1 Lageveränderliche Werkstückauflage für eine Maschine und Bearbeitungsanlage mit einer entsprechenden Werkstückauflage Location variable workpiece support for a machine and processing plant with a corresponding workpiece support |
| 01/31/2008 | DE102006034309A1 Vorrichtung zum Reinigen eines flachen Gegenstands Device for cleaning a flat object |
| 01/31/2008 | DE102006033870A1 Elektronisches Bauteil mit mehreren Substraten sowie ein Verfahren zur Herstellung desselben The same electronic component having a plurality of substrates, and a process for preparing |
| 01/31/2008 | DE102006033701A1 Herstellungsverfahren für ein elektronisches Bauelement und Bauelement in VQFN-Bauweise Manufacturing method for an electronic component and structural element in construction VQFN |
| 01/31/2008 | DE102006033692A1 Laterally diffused metal oxide semiconductor transistor for use as high voltage transistor, has structured dielectric zone coated on semiconductor body over drift zone and under gate, where dielectric zone has adapted edge profile |
| 01/31/2008 | DE102006033354A1 Flat fragile substrate e.g. silicon wafer, treating device for use in semiconductor and solar industry, has individual counter roller units movable in vertical direction independent of each other and exerting pressure on substrates |
| 01/31/2008 | DE102006033296A1 Anlage zur Strukturierung von Solarmodulen System for the structuring of solar modules |
| 01/31/2008 | DE102006025162B3 Flip-Chip-Bauelement und Verfahren zur Herstellung Flip-chip component and method for preparing |
| 01/31/2008 | DE102006019413A1 Semiconductor device structure formation method involves removing sacrificial material which is arranged in horizontal and vertical portions for structuring hardmask |
| 01/31/2008 | DE102006009272A1 Technik zur Herstellung eines verformten Transistors durch eine späte Amorphisierung und durch zu entfernende Abstandshalter Technology for producing a strained transistor by a late and amorphization to be removed by spacers |