Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/31/2008US20080026534 SELF-ALIGNED PROCESS FOR NANOTUBE/NANOWIRE FETs
01/31/2008US20080026533 Semiconductor device and manufacturing method thereof
01/31/2008US20080026532 Nano-Enabled Memory Devices and Anisotropic Charge Carrying Arrays
01/31/2008US20080026531 Field effect transistor and method of forming a field effect transistor
01/31/2008US20080026530 Method of forming a doped portion of a semiconductor and method of forming a transistor
01/31/2008US20080026529 Transistor with asymmetry for data storage circuitry
01/31/2008US20080026528 Non-volatile Memory Cell Array Having Discontinuous Source and Drain Diffusions Contacted by Continuous Bit Line Conductors and Methods of Forming
01/31/2008US20080026527 An apparatus and associated method for making a floating gate memory device with increased gate coupling ratio
01/31/2008US20080026526 Method for removing nanoclusters from selected regions
01/31/2008US20080026525 Semiconductor processing method and chemical mechanical polishing methods
01/31/2008US20080026524 Semiconductor device having a well structure for improving soft error rate immunity and latch-up immunity and a method of making such a device
01/31/2008US20080026523 Structure and method to implement dual stressor layers with improved silicide control
01/31/2008US20080026522 High performance cmos device structures and method of manufacture
01/31/2008US20080026521 Method for manufacturing a transistor of a semiconductor device
01/31/2008US20080026520 Semiconductor Method and Device with Mixed Orientation Substrate
01/31/2008US20080026519 Semiconductor devices and methods of fabricating the same
01/31/2008US20080026518 Spacer layer etch method providing enhanced microelectronic device performance
01/31/2008US20080026517 Method for forming a stressor layer
01/31/2008US20080026516 Raised sti structure and superdamascene technique for nmosfet performance enhancement with embedded silicon carbon
01/31/2008US20080026515 Silicide block isolated junction field effect transistor source, drain and gate
01/31/2008US20080026514 Method for producing nitride semiconductor device
01/31/2008US20080026513 Method and structure for self-aligned device contacts
01/31/2008US20080026512 Integrated circuit chip with fets having mixed body thicknesses and method of manufacture thereof
01/31/2008US20080026511 Semiconductor device and method for manufacturing thereof
01/31/2008US20080026510 Nonvolatile memory cell comprising a reduced height vertical diode
01/31/2008US20080026508 Integrated Circuit Device Incorporating Metallurgical Bond to Enhance Thermal Conduction to a Heat Sink
01/31/2008US20080026507 Stack package using anisotropic conductive film (ACF) and method of making same
01/31/2008US20080026506 Semiconductor multi-chip package and fabrication method
01/31/2008US20080026505 Electronic packages with roughened wetting and non-wetting zones
01/31/2008US20080026503 On-Chip Sensor Array for Temperature Management in Integrated Circuits
01/31/2008US20080026502 Growth of non-polar m-plane iii-nitride film using metalorganic chemical vapor deposition (mocvd)
01/31/2008US20080026501 Method of manufacturing a light emitting device
01/31/2008US20080026500 Flat panel display device and method for manufacturing the same
01/31/2008US20080026499 Method for forming pattern, and method for manufacturing liquid crystal display
01/31/2008US20080026498 Light emitting diode package element with internal meniscus for bubble free lens placement
01/31/2008US20080026497 Manufacturing method of light-emitting element
01/31/2008US20080026496 Method of making organic light emitting devices
01/31/2008US20080026495 Electromagnetic waveguide
01/31/2008US20080026494 Method of fabricating a terbium-doped electroluminescence device via metal organic deposition processes
01/31/2008US20080026493 Efficient method to predict integrated circuit temperature and power maps
01/31/2008US20080026492 Method of reducing contamination by providing a removable polymer protection film during microstructure processing
01/31/2008US20080026491 Method of wafer segmenting
01/31/2008US20080026490 Evaluation method using a TEG, a method of manufacturing a semiconductor device having the TEG, an element substrate and a panel having the TEG, a program for controlling dosage and a computer-readable recording medium recording the program
01/31/2008US20080026489 Method and system for modeling statistical leakage-current distribution
01/31/2008US20080026488 Method and apparatus for detecting endpoint in a dry etching system by monitoring a superimposed DC current
01/31/2008US20080026487 Method of forming an etch indicator layer for reducing etch non-uniformities
01/31/2008US20080026300 Photomask manufacturing method and semiconductor device manufacturing method
01/31/2008US20080026299 Multi-tone optical mask, method of manufacturing the same and method of manufacturing thin-film transistor substrate by using the same
01/31/2008US20080026251 Insulating film formation method, semiconductor device, and substrate processing apparatus
01/31/2008US20080026234 Epitaxial oxide films via nitride conversion
01/31/2008US20080026232 Monocrystalline Semiconductor Wafer Comprising Defect-Reduced Regions And Method For Producing It
01/31/2008US20080026231 Method for Metallizing the Pre-Passivated Surface of a Semiconductor Material Obtained by Said Method
01/31/2008US20080026230 Method for bonding a pair of silicon wafers together, and a semiconductor wafer
01/31/2008US20080026212 Film splicer
01/31/2008US20080026203 ULTRA LOW K (ULK) SiCOH FILM AND METHOD
01/31/2008US20080026185 Method for Polishing Silicon Wafer, Method for Producing Silicon Wafer, Apparatus for Polishing Disk-Shaped Workpiece, and Silicon Wafer
01/31/2008US20080026148 Film Forming System And Method For Forming Film
01/31/2008US20080026132 Substrate for realization of actions with samples of materials, and method for its manufacturing
01/31/2008US20080025899 Plasma surface treatment method, quartz member, plasma processing apparatus and plasma processing method
01/31/2008US20080025824 Wafer transfer apparatus and substrate transfer apparatus
01/31/2008US20080025823 Load lock device, and substrate processing apparatus and substrate processing system including the same
01/31/2008US20080025822 Device and method for handling an object of interest using a directional adhesive structure
01/31/2008US20080025821 Octagon transfer chamber
01/31/2008US20080025371 On chip temperature measuring and monitoring circuit and method
01/31/2008US20080025369 Simultaneous control of deposition time and temperature of multi-zone furnaces
01/31/2008US20080025096 Nonvolatile memory devices and methods of fabricating the same
01/31/2008US20080025084 High aspect ration bitline oxides
01/31/2008US20080025082 Spin-current switchable magnetic memory element and method of fabricating the memory element
01/31/2008US20080025065 Ferroelectric memory devices having expanded plate lines
01/31/2008US20080024885 Acceleration Clamp Assist
01/31/2008US20080024873 Metallic nano-optic lenses and beam shaping devices
01/31/2008US20080024794 Semiconductor Surface Inspection Apparatus and Method of Illumination
01/31/2008US20080024697 Flexible printed circuit, back light assembly, and liquid crystal display including the same
01/31/2008US20080024475 Display Device
01/31/2008US20080024424 Liquid Crystal Display Device
01/31/2008US20080024415 Display panel, mask and method of manufacturing the same
01/31/2008US20080024156 Inspection System, Inspection Method, and Method for Manufacturing Semiconductor Device
01/31/2008US20080024126 Beam Measuring Equipment and Beam Measuring Method Using the Same
01/31/2008US20080023854 Generating an Integrated Circuit Identifier
01/31/2008US20080023853 Flip chip adaptor package for bare die
01/31/2008US20080023848 Semiconductor device and its wiring method
01/31/2008US20080023847 Semiconductor device and its wiring method
01/31/2008US20080023846 Semiconductor device and manufacturing method of the same
01/31/2008US20080023838 Manufacturing method of semiconductor device and semiconductor device
01/31/2008US20080023837 Method for fabricating interconnect and interconnect fabricated thereby
01/31/2008US20080023833 Solder bumps in flip-chip technologies
01/31/2008US20080023832 Contact structure and manufacturing method thereof
01/31/2008US20080023819 Package structure having semiconductor chip embedded therein and method for fabricating the same
01/31/2008US20080023817 Component packaging apparatus, systems, and methods
01/31/2008US20080023807 Dual side cooling integrated power device package and module and methods of manufacture
01/31/2008US20080023806 Stress-free lead frame
01/31/2008US20080023804 High-speed electrical interconnects and method of manufacturing
01/31/2008US20080023803 Method for forming vertical structures in a semiconductor device
01/31/2008US20080023801 Method for producing an integrated circuit indlcuding a semiconductor
01/31/2008US20080023800 polishing the wafer surfaces with cubic boron nitride abrasive particles
01/31/2008US20080023799 Nitride semiconductor device and manufacturing method of the same
01/31/2008US20080023797 Semiconductor device and method for manufacturing same
01/31/2008US20080023796 Semiconductor device and method of manufacturing the same
01/31/2008US20080023795 Semiconductor devices and method of manufacturing them
01/31/2008US20080023788 Fuse box of semiconductor device formed using conductive oxide layer and method for forming the same