Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/17/2008US20080014753 Method of Manufacturing a Semiconductor Device Using a Radical Oxidation Process
01/17/2008US20080014752 Method of Forming Fine Pitch Hardmask Patterns and Method of Forming Fine Patterns of Semiconductor Device Using the Same
01/17/2008US20080014751 Method of manufacturing semiconductor device
01/17/2008US20080014750 Systems and methods for fabricating self-aligned memory cell
01/17/2008US20080014749 Method of etching and etching apparatus
01/17/2008US20080014748 Method and system for electronic spatial filtering of spectral reflectometer optical signals
01/17/2008US20080014747 Process for removing high stressed film using lf or hf bias power and capacitively coupled vhf source power with enhanced residue capture
01/17/2008US20080014746 Reducing corrosion in copper damascene processes
01/17/2008US20080014745 Method of manufacturing semiconductor device
01/17/2008US20080014744 Interconnect structure and method of fabrication of same
01/17/2008US20080014743 Method of fabricating semiconductor interconnections
01/17/2008US20080014742 Method of manufacturing a semiconductor device with through-chip vias
01/17/2008US20080014741 Process for improving the reliability of interconnect structures and resulting structure
01/17/2008US20080014740 Semiconductor-on-insulator (SOI) structures including gradient nitrided buried oxide (BOX)
01/17/2008US20080014739 Silicon nitride/oxygen doped silicon carbide etch stop bi-layer for improved interconnect reliability
01/17/2008US20080014738 Integrated circuit mount system with solder mask pad
01/17/2008US20080014737 Electrically programmable pi-shaped fuse structures and methods of fabrication thereof
01/17/2008US20080014736 Semiconductor device and manufacturing process therefor
01/17/2008US20080014735 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
01/17/2008US20080014734 Metal line of semiconductor device and method of fabricating the same
01/17/2008US20080014733 Bottom electrode contacts for semiconductor devices and methods of forming same
01/17/2008US20080014732 Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding
01/17/2008US20080014731 An interconnect structure with dielectric air gaps
01/17/2008US20080014730 Method and apparatus to prevent lateral oxidation in a transistor utilizing an ultra thin oxygen-diffusion barrier
01/17/2008US20080014729 Method of manufacturing a memory device
01/17/2008US20080014728 Method to improve metal defects in semiconductor device fabrication
01/17/2008US20080014727 Method for Manufacturing a Semiconductor Device Including a Memory Cell Array Area and Peripheral Circuit Area
01/17/2008US20080014726 Methods of fabricating semiconductor devices having laser-formed single crystalline active structures
01/17/2008US20080014725 Deposition over mixed substrates using trisilane
01/17/2008US20080014724 Methods for depositing tungsten after surface treatment
01/17/2008US20080014723 Iii-v nitride semiconductor substrate and its production method
01/17/2008US20080014722 Semiconductor device and method for forming the same
01/17/2008US20080014721 Dual channel heterostructure
01/17/2008US20080014720 Street smart wafer breaking mechanism
01/17/2008US20080014719 Semiconductor device and manufacturing method for the same
01/17/2008US20080014718 Treatment for bonding interface stabilization
01/17/2008US20080014717 Method for Manufacturing SOI Substrate
01/17/2008US20080014716 Method for Manufacturing SOI Substrate
01/17/2008US20080014715 Device and method for the processing of wafers
01/17/2008US20080014714 Method of fabricating a hybrid substrate
01/17/2008US20080014713 Treatment for bonding interface stabilization
01/17/2008US20080014712 Method for direct bonding two semiconductor substrates
01/17/2008US20080014711 Semiconductor device isolation structures and methods of fabricating such structures
01/17/2008US20080014710 Isolation regions
01/17/2008US20080014709 Method and apparatus for electroprocessing a substrate with edge profile control
01/17/2008US20080014708 Method of fabricating semiconductor device
01/17/2008US20080014707 Process integration scheme of SONOS technology
01/17/2008US20080014706 Increasing dielectric constant in local regions for the formation of capacitors
01/17/2008US20080014705 Structure and method for performance improvement in vertical bipolar transistors
01/17/2008US20080014704 Field effect transistors and methods for fabricating the same
01/17/2008US20080014703 Method of fabricating semiconductor integrated circuit device and semiconductor integrated circuit device manufactured using the same
01/17/2008US20080014702 Silicon carbide semiconductor device and method for manufacturing the same
01/17/2008US20080014701 Direct tunneling memory with separated transistor and tunnel areas
01/17/2008US20080014700 Methods for fabricating improved gate dielectrics
01/17/2008US20080014699 Subresolution silicon features and methods for forming the same
01/17/2008US20080014698 Method of forming memory devices by performing halogen ion implantation and diffusion processes
01/17/2008US20080014697 Semiconductor device with dram cell and method of manufacturing the same
01/17/2008US20080014696 Trench capacitor and method of manufacturing the same
01/17/2008US20080014695 Semiconductor device and method of manufacturing the same
01/17/2008US20080014694 Capacitors and methods of forming capacitors
01/17/2008US20080014693 Silicon carbide vertical mosfet design for fast switching applications
01/17/2008US20080014692 Method for fabricating a nitrided silicon-oxide gate dielectric
01/17/2008US20080014691 Mask rom cell, nor-type mask rom device, and related methods of fabrication
01/17/2008US20080014690 LDMOS using a combination of enhanced dielectric stress layer and dummy gates
01/17/2008US20080014689 Method for making planar nanowire surround gate mosfet
01/17/2008US20080014688 Selective uniaxial stress modification for use with strained silicon on insulator integrated circuit
01/17/2008US20080014687 Oxide isolated metal silicon-gate JFET
01/17/2008US20080014686 Method of fabricating vertical thin film transistor
01/17/2008US20080014685 Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers
01/17/2008US20080014684 Two-print-two-etch method for enhancement of CD control using ghost poly
01/17/2008US20080014683 Wiring base, semiconductor device, manufacturing method thereof and electronic equipment
01/17/2008US20080014682 Method and system for sealing packages for optics
01/17/2008US20080014681 Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
01/17/2008US20080014680 Method of fabrication of a semiconductor chip package
01/17/2008US20080014679 Packaging structure with protective layers and packaging method thereof
01/17/2008US20080014678 System and method of attenuating electromagnetic interference with a grounded top film
01/17/2008US20080014677 Chip scale package (CSP) assembly apparatus and method
01/17/2008US20080014676 Method for Making a Pillar-Type Phase Change Memory Element
01/17/2008US20080014675 Method for Producing Electronic Device and Electronic Device
01/17/2008US20080014674 Method for Manufacturing Semiconductor Device
01/17/2008US20080014673 Method of making a deep junction for electrical crosstalk reduction of an image sensor
01/17/2008US20080014671 Semiconductor manufacturing method and semiconductor laser device manufacturing method
01/17/2008US20080014669 Dual seed semiconductor photodetectors
01/17/2008US20080014668 Imprinted Waveguide Printed Circuit Board Structure
01/17/2008US20080014665 Method of fabricating liquid crystal display device
01/17/2008US20080014663 Structure and method of fabricating a hinge type mems switch
01/17/2008US20080014662 Semiconductor light emitting apparatus and method of fabricating the same
01/17/2008US20080014661 Method for the manufacture of solar panels and special transport carrier
01/17/2008US20080014535 photoresists; Scanning Electron Microscope, Charge-Coupled Device camera, image analysis device
01/17/2008US20080014530 Graft Pattern-Forming Method, Graft Pattern Material, Lithography Method, Conductive Pattern - Forming Method, Conductive Pattern, Color Filter Producing Method, Color Filter, and Mircrolens Producing Method
01/17/2008US20080014510 Photomask designing apparatus, photomask, photomask designing method, photomask designing program and computer-readable storage medium on which the photomask designing program is stored
01/17/2008US20080014460 Method for the Multi-Stage Production of Diffusion Soldered Connections for Power Components Comprising Semiconductor Chips
01/17/2008US20080014439 Process for manufacture of thin wafer
01/17/2008US20080014431 Systems and methods of synthesis of extended length nanostructures
01/17/2008US20080014409 Method of making a circuitized substrate
01/17/2008US20080014369 Two Step Post-Deposition Treatment of ILD Layer for a Lower Dielectric Constant and Improved Mechanical Properties
01/17/2008US20080014366 Method for minimizing the corner effect by densifying the insulating layer
01/17/2008US20080014363 Electro-Static Chucking Mechanism and Surface Processing Apparatus
01/17/2008US20080014352 System and method for forming an integrated barrier layer
01/17/2008US20080014345 Processing apparatus, exhaust processing process and plasma processing process