Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/22/2008US7320847 locally etching first substrate as far as protective layer to form a trench around a reversed alignment marker; forming a patterned layer on a second surface of first substrate using a lithographic projector having a front-to-back alignment system
01/22/2008US7320828 Composition for forming insulating film and process for producing insulating film
01/22/2008US7320817 Holding structure and a molding with the same
01/22/2008US7320772 System for embossing carrier tape and method for producing carrier tape
01/22/2008US7320733 Electron bombardment heating apparatus and temperature controlling apparatus and control method thereof
01/22/2008US7320732 Method for preparing atomistically straight boundary junctions in high temperature superconducting oxides
01/22/2008US7320482 Semiconductor integrated circuit device
01/22/2008US7320424 Linear split axis wire bonder
01/22/2008US7320423 High speed linear and rotary split-axis wire bonder
01/22/2008US7320265 Article transfer system
01/22/2008CA2450412C Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
01/22/2008CA2334287C Data storage and processing apparatus, and method for fabricating the same
01/17/2008WO2008008948A2 System and method of attenuating electromagnetic interference with a grounded top film
01/17/2008WO2008008798A1 Integrated circuit mount system with solder mask pad
01/17/2008WO2008008767A2 Methods of using ppar-gamma agonists and caspase-dependent chemotherapeutic agents for the treatment of cancer
01/17/2008WO2008008764A2 Oxide isolated metal silicon-gate jfet
01/17/2008WO2008008758A2 An interconnect structure with dielectric air gaps
01/17/2008WO2008008753A2 A method for fabricating a gate dielectric layer utilized in a gate structure
01/17/2008WO2008008750A2 Resonant infrared laser-assisted nanoparticle transfer and applications of same
01/17/2008WO2008008741A2 Bridge loadport and method
01/17/2008WO2008008739A2 Variable lot size load port
01/17/2008WO2008008738A2 Variable lot size load port
01/17/2008WO2008008737A2 Variable lot size load port
01/17/2008WO2008008586A2 A method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from soi and related materials in stacked-die packages
01/17/2008WO2008008314A1 System and method for forming through wafer vias using reverse pulse plating
01/17/2008WO2008008216A2 Liquid aerosol particle removal method
01/17/2008WO2008008204A1 Subresolution silicon features and methods for forming the same
01/17/2008WO2008008157A2 Electron induced chemical etching for detecting defects
01/17/2008WO2008008154A2 Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
01/17/2008WO2008007962A1 Method and device for etching a substrate by means of a plasma
01/17/2008WO2008007944A1 Method and device for treating a substrate by means of a plasma
01/17/2008WO2008007928A1 Photocathode lighting device, method for manufacturing the same and exposure apparatus using photocathode lighting device
01/17/2008WO2008007824A1 Automatically replaceable apparatus for collecting byproducts and the controlling method thereof in equipment producing semiconductor
01/17/2008WO2008007765A1 Surface position detecting apparatus, exposure apparatus and device manufacturing method
01/17/2008WO2008007764A1 Photosensitive resin composition, layered product thereof, cured object therefrom, and method of forming pattern from the composition (3)
01/17/2008WO2008007762A1 Photosensitive resin composition, layered product thereof, cured object therefrom, and method of forming pattern from the composition (2)
01/17/2008WO2008007749A1 Transistor and semiconductor device
01/17/2008WO2008007748A1 Semiconductor device
01/17/2008WO2008007732A1 Method for manufacturing semiconductor device
01/17/2008WO2008007731A1 Nonvolatile semiconductor memory and its drive method
01/17/2008WO2008007730A1 Nonvolatile semiconductor memory and its drive method
01/17/2008WO2008007660A1 Stage apparatus and exposure apparatus
01/17/2008WO2008007633A1 Illuminating optical apparatus, exposure apparatus and device manufacturing method
01/17/2008WO2008007632A1 Illuminating optical apparatus, exposure apparatus and device manufacturing method
01/17/2008WO2008007617A1 Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
01/17/2008WO2008007614A1 Surface inspecting apparatus
01/17/2008WO2008007578A1 Compound, acid generator, resist composition and method for forming resist pattern
01/17/2008WO2008007576A1 Film-forming composition
01/17/2008WO2008007535A1 Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display
01/17/2008WO2008007521A1 Reticle holding member, reticle stage, exposure apparatus, projection exposure method and device manufacturing method
01/17/2008WO2008007517A1 Multi-joint robot and wiring method
01/17/2008WO2008007516A1 Multijoint robot
01/17/2008WO2008007508A1 Method for reusing removed wafer
01/17/2008WO2008007467A1 Field effect transistor
01/17/2008WO2008007466A1 Semiconductor device for high frequency
01/17/2008WO2008007455A1 Method of wafer thinning and support plate
01/17/2008WO2008007454A1 Support plate, transfer apparatus, peeling apparatus and peeling method
01/17/2008WO2008007335A2 High electron mobility transistor.
01/17/2008WO2008007331A2 Semiconductor devices and methods of manufacture thereof
01/17/2008WO2008007326A2 Transponder and method of producing a transponder
01/17/2008WO2008006900A1 Method for the production of a ceramic substrate, and a ceramic substrate
01/17/2008WO2008006504A2 Method for producing optoelectronic components and correspondingly produced products
01/17/2008WO2008006418A1 Method for packaging components
01/17/2008WO2008006340A1 Method for heat- and impact-resistant connection of a semiconductor by means of pressure sintering
01/17/2008WO2008006299A1 Method for packing resin coating on a substrate
01/17/2008WO2007137058A3 Methods to reduce the minimum pitch in a pattern
01/17/2008WO2007136461A3 Grown nanofin transistors
01/17/2008WO2007129264A3 Semiconductor device with insulated trench gates and isolation region
01/17/2008WO2007127496A3 Topography directed patterning
01/17/2008WO2007126482A3 Methods for forming thin oxide layers on semiconductor wafers
01/17/2008WO2007117779A3 Semiconductor device with a multi-plate isolation structure
01/17/2008WO2007111780A3 METHOD OF PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF TaC AND TaCN FILMS HAVING GOOD ADHESION TO COPPER
01/17/2008WO2007107885A3 Device for contact by adhesion to a glass or semiconductor plate (wafer) surface of the like, and system for gripping such a plate comprising such a device
01/17/2008WO2007074153A3 Method for relaxing a stressed thin film
01/17/2008WO2007072655A3 Lateral soi semiconductor devices and manufacturing method thereof
01/17/2008WO2007059480A3 Polycide fuse with reduced programming time
01/17/2008WO2007057472A3 Method and structure for charge dissipation in integrated circuits
01/17/2008WO2007053802A3 Drug and gene delivery by polymer nanonozzle and nanotip cell patch
01/17/2008WO2007047454A3 Process and composition for electrochemical mechanical polishing
01/17/2008WO2007040752A3 Process and system for etching doped silicon using sf6-based chemistry
01/17/2008WO2007030806A3 Process of stripping a microarray for reuse
01/17/2008WO2007024984A3 High performance mosfet comprising a stressed gate metal silicide layer and method of fabricating the same
01/17/2008WO2006099538A3 Devices with ultrathin structures and method of making same
01/17/2008WO2004109775A3 Formation of highly dislocation free compound semiconductor on a lattice mismatched substrate
01/17/2008WO2004061914A3 Chamber for uniform substrate heating
01/17/2008US20080016486 System and method of assessing reliability of a semiconductor
01/17/2008US20080016414 Low Cost High Density Rectifier Matrix Memory
01/17/2008US20080016376 Logic circuit system and method of changing operating voltage of a programmable logic circuit
01/17/2008US20080014838 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
01/17/2008US20080014764 Low temperature, long term annealing of nickel contacts to lower interfacial resistance
01/17/2008US20080014763 Method of heating semiconductor wafer to improve wafer flatness
01/17/2008US20080014762 Process for producing zirconium oxide thin films
01/17/2008US20080014761 Decreasing the etch rate of silicon nitride by carbon addition
01/17/2008US20080014760 Semiconductor device and method of manufacturing the same
01/17/2008US20080014759 Method for fabricating a gate dielectric layer utilized in a gate structure
01/17/2008US20080014758 Film formation apparatus for semiconductor process and method for using the same
01/17/2008US20080014757 Leadframes for Improved Moisture Reliability and Enhanced Solderability of Semiconductor Devices
01/17/2008US20080014756 Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers
01/17/2008US20080014755 Plasma etching method and computer-readable storage medium
01/17/2008US20080014754 Methods of finishing quartz glass surfaces and components made by the methods