Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/13/2008US20080064171 Method of forming a thin layer and method of manufacturing a semiconductor device
03/13/2008US20080064170 Transistor for memory device and method for manufacturing the same
03/13/2008US20080064169 Method for manufacturing semiconductor device, and semiconductor device
03/13/2008US20080064168 Method for Forming a Shielded Gate Trench FET with the Shield and Gate Electrodes Being Connected Together
03/13/2008US20080064167 Semiconductor device with a bulb-type recess gate
03/13/2008US20080064166 Semiconductor Devices and Methods of Manufacture Thereof
03/13/2008US20080064165 Dual storage node memory devices and methods for fabricating the same
03/13/2008US20080064164 Method of manufacturing nonvolatile memory device
03/13/2008US20080064163 Method and structure for integrating mim capacitors within dual damascene processing techniques
03/13/2008US20080064162 Vertical soi transistor memory cell and method of forming the same
03/13/2008US20080064161 Memory cell having bar-shaped storage node contact plugs and methods of fabricating same
03/13/2008US20080064160 Cmos devices incorporating hybrid orientation technology (hot) with embedded connectors
03/13/2008US20080064159 Semiconductor device
03/13/2008US20080064158 Method for fabricating non-volatile memory
03/13/2008US20080064157 Low noise and high performance LSI device, layout and manufacturing method
03/13/2008US20080064156 Semiconductor device and method of manufacturing the same
03/13/2008US20080064155 Method for Producing a Multi-Stage Recess in a Layer Structure and a Field Effect Transistor with a Multi-Recessed Gate
03/13/2008US20080064154 Process flow for metal gate access device
03/13/2008US20080064153 Fully salicided (FUCA) MOSFET structure
03/13/2008US20080064152 Liquid crystal display device having drive circuit and fabricating method thereof
03/13/2008US20080064151 Thin film transistor and method of manufacturing the same
03/13/2008US20080064150 Manufacturing method of thin film transistor array substrate
03/13/2008US20080064149 Strained-channel fin field effect transistor (fet) with a uniform channel thickness and separate gates
03/13/2008US20080064148 Semiconductor device and manufacturing process thereof
03/13/2008US20080064147 Method for fabricating a metal-insulator-metal (mim) capacitor having capacitor dielectric layer formed by atomic layer deposition (ald)
03/13/2008US20080064145 Die attach paddle for mounting integrated circuit die
03/13/2008US20080064144 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
03/13/2008US20080064143 Microelectronic Devices and Methods
03/13/2008US20080064142 Method for fabricating a wafer level package having through wafer vias for external package connectivity
03/13/2008US20080064141 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
03/13/2008US20080064140 Semiconductor device having curved leads offset from the center of bonding pads
03/13/2008US20080064139 Reliable printed wiring board assembly employing packages with solder joints and related assembly technique
03/13/2008US20080064138 Perimeter matrix ball grid array circuit package with a populated center
03/13/2008US20080064137 Method of protecting integrated circuits
03/13/2008US20080064136 Supercritical fluid-assisted deposition of materials on semiconductor substrates
03/13/2008US20080064135 Method of manufacturing image sensor
03/13/2008US20080064134 Methods of making combinational structures for electro-luminscent displays
03/13/2008US20080064132 Method of fabricating vertical devices using a metal support film
03/13/2008US20080064131 Light emitting apparatus and method for the same
03/13/2008US20080064129 Method of Manufacturing a Display Substrate
03/13/2008US20080064128 Annealing apparatus, annealing method, and method of manufacturing a semiconductor device
03/13/2008US20080064127 Method and system for yield and productivity improvements in semiconductor processing
03/13/2008US20080064126 In-situ wafer temperature measurement and control
03/13/2008US20080064125 Extendable connector and network
03/13/2008US20080064124 Semiconductor device and manufacturing method thereof
03/13/2008US20080063988 Exposure method and method for manufacturing semiconductor device
03/13/2008US20080063984 Process Solutions Containing Surfactants
03/13/2008US20080063975 Polymer, Positive Resist Composition and Method for Forming Resist Pattern
03/13/2008US20080063950 Photomask Blank and Photomask
03/13/2008US20080063880 Ultra-large scale integrated (ULSI); film stack; hydrosilation
03/13/2008US20080063878 Method for low temperature bonding and bonded structure
03/13/2008US20080063855 Semiconductor thin films formed from group iv nanoparticles
03/13/2008US20080063840 Silicon-on Insulator Substrate and Method for manufacturing the Same
03/13/2008US20080063786 Method for changing concentration of treatment solution and treatment solution supply apparatus
03/13/2008US20080063576 stably generates jet at atmospheric pressure with low electric power; surface treatment, cutting, etching, film deposition; High-resolution microanalysis; High-resolution microanalysis with a "micro total analysis" using a VHF-driven inductively-coupled microplasma source
03/13/2008US20080063494 Sheet sticking apparatus
03/13/2008US20080063493 Substrate dryer using supercritical fluid, apparatus including the same, and method for treating substrate
03/13/2008US20080063257 Pattern Inspection Method And Apparatus
03/13/2008US20080062790 Bit-line equalizer, semiconductor memory device including the same, and method for manufacturing bit-line equalizer
03/13/2008US20080062779 Semiconductor integrated circuit
03/13/2008US20080062759 Flash memory device, method of operating a flash memory device and method for manufacturing the same device
03/13/2008US20080062756 Layout of a Sram Memory Cell
03/13/2008US20080062612 Electrostatic chuck
03/13/2008US20080062611 Electrostatic chuck device
03/13/2008US20080062610 Electrostatic chuck device
03/13/2008US20080062609 Electrostatic chuck device
03/13/2008US20080062577 Magnetoresistance effect element, magnetic head, magnetic reproducing apparatus, and magnetic memory
03/13/2008US20080062498 Apparatus for crystallizing semiconductor with laser beams
03/13/2008US20080062389 Method and apparatus for personalization of semiconductor
03/13/2008US20080062369 Method for fabricating thin film pattern, liquid crystal display panel and method for fabricating thereof using the same
03/13/2008US20080062363 Process and structure of liquid crystal panel with one drop fill
03/13/2008US20080062361 Display panel and method for manufacturing a color filter substrate of the display panel
03/13/2008US20080062344 Method for manufacturing liquid crystal display panel and liquid crystal display panel
03/13/2008US20080062095 Active matrix organic electroluminescent display device and method of fabricating the same
03/13/2008US20080062094 Active matrix organic electroluminescent display device and method of fabricating the same
03/13/2008US20080061807 Configurable Prober for TFT LCD Array Test
03/13/2008US20080061452 Bonded wafer and method of manufacturing the same
03/13/2008US20080061451 Semiconductor package and fabrication method thereof
03/13/2008US20080061449 Semiconductor Component Arrangement
03/13/2008US20080061448 System and method for thermal expansion pre-compensated package substrate
03/13/2008US20080061446 Semiconductor device with contact structure and manufacturing method thereof
03/13/2008US20080061444 Post passivation interconnection schemes on top of IC chip
03/13/2008US20080061443 Method of manufacturing semiconductor device
03/13/2008US20080061442 Interconnect structures and methods for fabricating the same
03/13/2008US20080061439 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond
03/13/2008US20080061438 Method of forming metal line in semiconductor device
03/13/2008US20080061436 Wafer level chip scale package and method for manufacturing the same
03/13/2008US20080061432 Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device
03/13/2008US20080061427 Packaging structure and fabricating method thereof
03/13/2008US20080061426 Electronic Circuit Unit
03/13/2008US20080061423 Method for producing a circuit module comprising at least one integrated circuit
03/13/2008US20080061420 Integrated passive devices with high q inductors
03/13/2008US20080061418 Three dimensional device integration method and integrated device
03/13/2008US20080061416 Die attach paddle for mounting integrated circuit die
03/13/2008US20080061415 Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
03/13/2008US20080061414 Method of Producing a Semiconductor Package
03/13/2008US20080061407 Semiconductor device package and manufacturing method
03/13/2008US20080061404 Electronic circuit package and fabricating method thereof
03/13/2008US20080061403 Dielectric layers for metal lines in semiconductor chips
03/13/2008US20080061402 Packaged Stacked Semiconductor Device And Method For Manufacturing The Same
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