Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/06/2008US20080054355 Semiconductor device and method of manufacturing the same
03/06/2008US20080054354 Photo mask, semiconductor integrated circuit device, and method of manufacturing the same
03/06/2008US20080054353 Semiconductor device and method of manufacturing the same
03/06/2008US20080054352 Semiconductor device and method of manufacturing semiconductor device
03/06/2008US20080054351 Power semiconductor device and manufacturing method therefor
03/06/2008US20080054349 Reduced-resistance finfets by sidewall silicidation and methods of manufacturing the same
03/06/2008US20080054348 Semiconductor device and a method of fabricating the same
03/06/2008US20080054345 Electrically erasable and programmable read only memory device and method of manufacturing the same
03/06/2008US20080054344 Method of fabricating flash memory device
03/06/2008US20080054343 Semiconductor Device and Method for Fabricating the Same
03/06/2008US20080054342 Memory array having floating gate semiconductor device
03/06/2008US20080054341 Semiconductor memory device and method for manufacturing same
03/06/2008US20080054340 Nonvolatile semiconductor memory device including improved gate electrode
03/06/2008US20080054339 Flash memory device with single-poly structure and method for manufacturing the same
03/06/2008US20080054338 Flash memory device
03/06/2008US20080054337 Flash Memory Device and Method for Manufacturing the Flash Memory Device
03/06/2008US20080054335 Embedded NV Memory and Method of Manufacturing the Same
03/06/2008US20080054334 Flash memory device
03/06/2008US20080054333 Semiconductor Device and Manufacturing Method Thereof
03/06/2008US20080054332 Method of depositing nanolaminate film for non-volatile floating gate memory devices by atomic layer deposition
03/06/2008US20080054330 Tantalum lanthanide oxynitride films
03/06/2008US20080054328 Semiconductor device and method of manufacturing the same
03/06/2008US20080054324 Integrated circuit including a gate electrode
03/06/2008US20080054315 Method for manufacturing semiconductor device by using two step pocket implant process
03/06/2008US20080054314 Field effect transistor having a stressed contact etch stop layer with reduced conformality
03/06/2008US20080054312 Junction field effect transistor and production method for the same
03/06/2008US20080054311 Solid-state imaging device and method for manufacturing solid-state imaging device
03/06/2008US20080054302 Field effect transistor and method of manufacturing the same
03/06/2008US20080054299 Image sensor and fabricating method thereof
03/06/2008US20080054296 Nitride-based semiconductor light emitting device and method of manufacturing the same
03/06/2008US20080054292 Nitride semiconductor substrate, method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate
03/06/2008US20080054291 Vertical semiconductor light-emitting device and method of manufacturing the same
03/06/2008US20080054288 Lighting Device Package
03/06/2008US20080054286 Light emitting device packages, light emitting diode (LED) packages and related methods
03/06/2008US20080054285 Light emitting device and manufacturing method thereof
03/06/2008US20080054280 Light emitting packages and methods of making same
03/06/2008US20080054279 Phosphor Position in Light Emitting Diodes
03/06/2008US20080054277 Semiconductor laser device
03/06/2008US20080054272 Semiconductor light-emitting device and method of manufacturing the same
03/06/2008US20080054270 Semiconductor memory device and the production method
03/06/2008US20080054269 Method of Fabricating A Semiconductor Device
03/06/2008US20080054268 Display device and method of manufacturing the display device
03/06/2008US20080054267 Display apparatus and manufacturing method of the same
03/06/2008US20080054266 Thin film semiconductor device and method for manufacturing thin film semiconductor device
03/06/2008US20080054263 Semiconductor device and method of fabricating the same
03/06/2008US20080054260 Semiconductor Integrated Circuit Device, Method For Testing The Semiconductor Integrated Circuit Device, Semiconductor Wafer And Burn-In Test Apparatus
03/06/2008US20080054259 Semiconductor Component with an Electric Contact Arranged on at Least One Surface
03/06/2008US20080054253 Single-Electron Tunnel Junction for a Complementary Metal-Oxide Device and Method of Manufacturing the Same
03/06/2008US20080054245 Memory Device Including Phase-Changeable Material Region and Method of Fabricating the Same
03/06/2008US20080054243 Switching elements and production methods thereof
03/06/2008US20080054228 one non-silicon precursor (such as a germanium precursor, a carbon precursor, etc.) during formation of a silicon nitride, silicon oxide, silicon oxynitride or silicon carbide film improves the deposition rate and/or makes possible tuning of properties of the film
03/06/2008US20080054227 Compositions for use in electronics devices
03/06/2008US20080054225 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer
03/06/2008US20080054197 Substrate holding apparatus, and inspection or processing apparatus
03/06/2008US20080054195 Substrate cover, and charged particle beam writing apparatus and method
03/06/2008US20080054187 Charged particle beam scanning method and charged particle beam apparatus
03/06/2008US20080053964 Wire bonders and methods of wire-bonding
03/06/2008US20080053959 Method for low temperature bonding and bonded structure
03/06/2008US20080053958 Plasma processing apparatus
03/06/2008US20080053957 Substrate processing system, substrate processing method and storage medium
03/06/2008US20080053818 Plasma processing apparatus of substrate and plasma processing method thereof
03/06/2008US20080053614 Surface Processing Apparatus
03/06/2008US20080053488 Substrate treatment apparatus and substrate treatment method
03/06/2008US20080053123 Cooling air flow control valve for burn-in system
03/06/2008US20080053001 Polishing Composition and Polishing Method
03/06/2008US20080052947 Substrate processing method and substrate processing apparatus
03/06/2008US20080052904 Method Of Manufacturing An Electronic Circuit Assembly
03/06/2008US20080052886 Degas chamber for fabricating semiconductor device and degas method employing the same
03/06/2008DE112006001203T5 Verfahren zum Bilden eines hoch auflösenden Musters und Substrat mit einem Vormuster, das dadurch gebildet wird A method for forming a high-resolution pattern and substrate with a pre-production samples, which is formed by
03/06/2008DE112006001199T5 Kompositmetallschicht, die unter Verwendung von metallischen nanokristallinen Partikeln in einem Elektroplattierungsbad geformt ist Composite metal layer that is formed using metallic nanocrystalline particles in an electroplating
03/06/2008DE112006001169T5 Verfahren zur Herstellung eines SOI-Bauelements A method of manufacturing an SOI-device
03/06/2008DE112006001123T5 Integrierte Schaltung und Verfahren zu deren Herstellung Integrated circuit and method for their preparation
03/06/2008DE112006001025T5 Implantationsprozess in der Halbleiterfabrikation Implantation process in semiconductor manufacturing
03/06/2008DE112004002527T5 Verfahren zum Verkapseln von Schaltkreischips A method for encapsulating circuit chip
03/06/2008DE10345576B4 Durchlaufende Vorrichtung zum Löten von Solarzellen Continuous apparatus for soldering of solar cells
03/06/2008DE10297756B4 Microchip package for electronic assembly e.g. printed circuit board, has interposer with segmented apertures mounted on microchip device
03/06/2008DE10250868B4 Vertikal integrierter Feldeffekttransistor, Feldeffekttransistor-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Feldeffekttransistors Vertically integrated field-effect transistor, field effect transistor arrangement and method for manufacturing a vertically-integrated field-effect transistor
03/06/2008DE10240107B4 Randabschluss für Leistungshalbleiterbauelement und für Diode sowie Verfahren zur Herstellung einer n-leitenden Zone für einen solchen Randabschluss Edge termination for power semiconductor component and diode and method for producing an n-type region for such an edge termination
03/06/2008DE102006040926A1 Semiconductor disk or wafer scribing method, involves forming average value from measurement values to execute necessary readjustment of scribing force corresponding to stored reference position value
03/06/2008DE102006040600A1 Verfahren zum Herstellen eines kartenförmigen Datenträgers A method for producing a card-shaped data carrier
03/06/2008DE102006035865B3 Material placing method for use in integrated circuit, involves positioning transfer plate opposite to target plate, where material is casted out from blind holes to contact with target plate and to place at target plate
03/06/2008DE102006019122B4 Verfahren zur Herstellung einer integrierten Speichervorrichtung mit vergrabenen Bitleitungen und integrierte Speichervorrichtung mit vergrabenen Bitleitungen A method of fabricating an integrated memory device with buried bit lines and integrated memory device with buried bit lines
03/06/2008DE102004025423B4 Dünnfilm-Feldeffekt-Transistor mit Gate-Dielektrikum aus organischem Material und Verfahren zu dessen Herstellung Thin film field effect transistor having gate dielectric of organic material and process for its preparation
03/06/2008DE10137088B4 Verfahren zum Ausbilden von siliziumhaltigen Dünnschichten mittels Atomschichtabscheidung (Atomic Layer Deposition) unter Verwendung von Aminosilanen A method of forming silicon-containing thin films by atomic layer deposition (Atomic Layer Deposition) using aminosilanes
03/06/2008CA2661715A1 Method and system for implementing a circuit design in a reconfigurable device
03/05/2008EP1895596A1 DRAM memory cell with no capacitance made up of a partially deserted MOSFET-type device comprising a gate insulator in two parts
03/05/2008EP1895594A2 Non-volatile memory cell with metal capacitor
03/05/2008EP1895588A2 Capacitor built-in interposer and method of manufacturing the same and electronic component device
03/05/2008EP1895584A1 Thermally conductive substrate with leadframe and heat radiation plate and manufacturing method thereof
03/05/2008EP1895583A1 Electronic control unit and manufacturing method thereof
03/05/2008EP1895582A1 Semiconducteur device and method for manufacturing same
03/05/2008EP1895581A2 Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet
03/05/2008EP1895580A1 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device
03/05/2008EP1895579A1 Diamond semiconductor element and method for manufacturing same
03/05/2008EP1895578A1 Manufacturing method of an integrated circuit formed on a semiconductor substrate
03/05/2008EP1895577A1 Etching composition for metal material and method for manufacturing semiconductor device by using same
03/05/2008EP1895576A1 Pattern coating material and pattern forming method
03/05/2008EP1895575A1 Heat treatment apparatus
03/05/2008EP1895574A1 Quartz glass tool for heat treatment of silicon wafer and process for producing the same
03/05/2008EP1895573A1 Silicon carbide single-crystal wafer and process for producing the same
1 ... 2693 2694 2695 2696 2697 2698 2699 2700 2701 2702 2703 2704 2705 2706 2707 2708 2709 2710 2711 2712 2713 ... 6590