Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/18/2008US7345737 Exposure method and apparatus having a projection optical system in which a projection gap is filled with liquid
03/18/2008US7345727 Substrate for a liquid crystal display device and fabricating method thereof
03/18/2008US7345703 CMOS image sensor including photodiodes having different depth according to wavelength of light
03/18/2008US7345497 Protection circuit for semiconductor device and semiconductor device including the same
03/18/2008US7345461 Semiconductor circuit device and data processing system
03/18/2008US7345384 Linear motor armature and linear motor
03/18/2008US7345368 Semiconductor device and the manufacturing method for the same
03/18/2008US7345367 Magnetic memory device and producing method thereof
03/18/2008US7345365 Electronic component with die and passive device
03/18/2008US7345362 Electronic component and method for manufacturing the same
03/18/2008US7345359 Integrated circuit package with chip-side signal connections
03/18/2008US7345358 Copper interconnect for semiconductor device
03/18/2008US7345355 Complementary junction-narrowing implants for ultra-shallow junctions
03/18/2008US7345352 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same
03/18/2008US7345351 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same
03/18/2008US7345350 Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
03/18/2008US7345345 Semiconductor device
03/18/2008US7345343 Integrated circuit having a top side wafer contact and a method of manufacture therefor
03/18/2008US7345342 Power semiconductor devices and methods of manufacture
03/18/2008US7345339 Vertical channel FET with super junction construction
03/18/2008US7345338 Bulb-shaped recess gate of a semiconductor device and method for fabricating the same
03/18/2008US7345337 Semiconductor apparatus having a divided column region
03/18/2008US7345336 Semiconductor memory device having self-aligned charge trapping layer
03/18/2008US7345335 Semiconductor integrated circuit, booster circuitry, and non-volatile semiconductor memory device
03/18/2008US7345333 Double sided container process used during the manufacture of a semiconductor device
03/18/2008US7345332 Semiconductor constructions
03/18/2008US7345331 Ferroelectric capacitor circuit for sensing hydrogen gas
03/18/2008US7345329 Method for reduced N+ diffusion in strained Si on SiGe substrate
03/18/2008US7345327 Bipolar transistor
03/18/2008US7345326 Electric signal transmission line
03/18/2008US7345311 Semiconductor substrate, method of manufacturing the semiconductor substrate, semiconductor device and pattern forming method
03/18/2008US7345299 Semiconductor device comprising a crystalline layer containing silicon/germanium, and comprising a silicon Enriched floating charge trapping media over the crystalline layer
03/18/2008US7345298 Horizontal emitting, vertical emitting, beam shaped, distributed feedback (DFB) lasers by growth over a patterned substrate
03/18/2008US7345296 Nanotube transistor and rectifying devices
03/18/2008US7345290 Lens array for electron beam lithography tool
03/18/2008US7345289 Sample support prepared by semiconductor silicon process technique
03/18/2008US7345260 Heater and method of manufacturing the same
03/18/2008US7345254 Die sorting apparatus and method
03/18/2008US7345003 Semiconductor device manufacturing method, wafer, and wafer manufacturing method
03/18/2008US7345002 Replication and transfer of microstructures and nanostructures
03/18/2008US7345001 Gate dielectric having a flat nitrogen profile and method of manufacture therefor
03/18/2008US7345000 Method and system for treating a dielectric film
03/18/2008US7344999 Method for cleaning substrate having exposed silicon and silicon germanium layers and related method for fabricating semiconductor device
03/18/2008US7344998 Wafer recovering method, wafer, and fabrication method
03/18/2008US7344997 Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
03/18/2008US7344996 Helium-based etch process in deposition-etch-deposition gap fill
03/18/2008US7344995 Method for preparing a structure with high aspect ratio
03/18/2008US7344994 Multiple layer etch stop and etching method
03/18/2008US7344993 Low-pressure removal of photoresist and etch residue
03/18/2008US7344992 Method for forming via hole and trench for dual damascene interconnection
03/18/2008US7344991 Method and apparatus for multilayer photoresist dry development
03/18/2008US7344990 Method of manufacturing micro-structure element by utilizing molding glass
03/18/2008US7344989 CMP wafer contamination reduced by insitu clean
03/18/2008US7344988 Alumina abrasive for chemical mechanical polishing
03/18/2008US7344987 Method for CMP with variable down-force adjustment
03/18/2008US7344986 Plating solution, semiconductor device and method for manufacturing the same
03/18/2008US7344985 Nickel alloy silicide including indium and a method of manufacture therefor
03/18/2008US7344984 Technique for enhancing stress transfer into channel regions of NMOS and PMOS transistors
03/18/2008US7344983 Clustered surface preparation for silicide and metal contacts
03/18/2008US7344982 System and method of selectively depositing Ruthenium films by digital chemical vapor deposition
03/18/2008US7344981 Plated terminations
03/18/2008US7344979 High pressure treatment for improved grain growth and void reduction
03/18/2008US7344978 Fabrication method of semiconductor device
03/18/2008US7344977 Method of electroplating a substance over a semiconductor substrate
03/18/2008US7344976 Method for fabricating nonvolatile semiconductor memory device
03/18/2008US7344975 Method to reduce charge buildup during high aspect ratio contact etch
03/18/2008US7344974 Metallization method of semiconductor device
03/18/2008US7344973 Semiconductor device and method of manufacturing the same
03/18/2008US7344972 Photosensitive dielectric layer
03/18/2008US7344971 Manufacturing method of semiconductor device
03/18/2008US7344970 Plating method
03/18/2008US7344968 Semiconductor chip having pads with plural junctions for different assembly methods
03/18/2008US7344967 Method for forming an electrode
03/18/2008US7344966 Manufacturing method for a power device having an auto-aligned double thickness gate layer and corresponding device
03/18/2008US7344965 Method of etching dual pre-doped polysilicon gate stacks using carbon-containing gaseous additions
03/18/2008US7344964 Image sensor with improved charge transfer efficiency and method for fabricating the same
03/18/2008US7344963 Method of reducing charging damage to integrated circuits during semiconductor manufacturing
03/18/2008US7344962 Method of manufacturing dual orientation wafers
03/18/2008US7344961 Methods for nanowire growth
03/18/2008US7344960 Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
03/18/2008US7344959 Metal filled through via structure for providing vertical wafer-to-wafer interconnection
03/18/2008US7344958 Method for wafer bonding (A1, In, Ga)N and Zn(S, Se) for optoelectronic applications
03/18/2008US7344957 SOI wafer with cooling channels and a method of manufacture thereof
03/18/2008US7344956 Method and device for wafer scale packaging of optical devices using a scribe and break process
03/18/2008US7344955 Cut-and-paste imprint lithographic mold and method therefor
03/18/2008US7344954 Method of manufacturing a capacitor deep trench and of etching a deep trench opening
03/18/2008US7344953 Process for vertically patterning substrates in semiconductor process technology by means of inconformal deposition
03/18/2008US7344952 Laminating encapsulant film containing phosphor over LEDs
03/18/2008US7344951 Surface preparation method for selective and non-selective epitaxial growth
03/18/2008US7344949 Non-volatile memory device and method of fabricating the same
03/18/2008US7344948 Methods of forming transistors
03/18/2008US7344947 Methods of performance improvement of HVMOS devices
03/18/2008US7344946 Structure for amorphous carbon based non-volatile memory
03/18/2008US7344945 Method of manufacturing a drain side gate trench metal-oxide-semiconductor field effect transistor
03/18/2008US7344944 Non-volatile memory device and fabricating method thereof
03/18/2008US7344943 Method for forming a trench MOSFET having self-aligned features
03/18/2008US7344942 Isolation regions for semiconductor devices and their formation
03/18/2008US7344941 Methods of manufacturing a metal-insulator-metal capacitor
03/18/2008US7344940 Methods of fabricating integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors
03/18/2008US7344939 Ferroelectric capacitor with parallel resistance for ferroelectric memory
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