Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/25/2008US7348267 Flash memory and method of fabricating the same
03/25/2008US7348266 Method and apparatus for a metallic dry-filling process
03/25/2008US7348265 Semiconductor device having a silicided gate electrode and method of manufacture therefor
03/25/2008US7348264 Plasma doping method
03/25/2008US7348263 Manufacturing method for electronic component, electronic component, and electronic equipment
03/25/2008US7348262 Method for fabricating module of semiconductor chip
03/25/2008US7348261 Wafer scale thin film package
03/25/2008US7348260 Method for forming a relaxed or pseudo-relaxed useful layer on a substrate
03/25/2008US7348259 Method of fabricating a semiconductor structure that includes transferring one or more material layers to a substrate and smoothing an exposed surface of at least one of the material layers
03/25/2008US7348258 Method and device for controlled cleaving process
03/25/2008US7348257 Process for manufacturing wafers of semiconductor material by layer transfer
03/25/2008US7348256 Methods of forming reduced electric field DMOS using self-aligned trench isolation
03/25/2008US7348255 Semiconductor device and method for fabricating a semiconductor device
03/25/2008US7348254 Method of fabricating fin field-effect transistors
03/25/2008US7348253 High-quality SGOI by annealing near the alloy melting point
03/25/2008US7348252 Method of forming silicon-on-insulator wafer having reentrant shape dielectric trenches
03/25/2008US7348251 Modulated trigger device
03/25/2008US7348250 Bipolar structure with two base-emitter junctions in the same circuit
03/25/2008US7348249 Method for manufacturing semiconductor device
03/25/2008US7348248 CMOS transistor with high drive current and low sheet resistance
03/25/2008US7348247 Semiconductor devices and methods of manufacturing the same
03/25/2008US7348246 Methods of fabricating non-volatile memory devices including divided charge storage structures
03/25/2008US7348245 Semiconductor device and a method of manufacturing the same
03/25/2008US7348244 Method of producing a semiconductor device
03/25/2008US7348243 Semiconductor device and method for fabricating the same
03/25/2008US7348242 Nonvolatile memory device and methods of fabricating the same
03/25/2008US7348241 Cell structure of EPROM device and method for fabricating the same
03/25/2008US7348240 Method for forming metal line in flash memory device
03/25/2008US7348239 Semiconductor device and method of manufacturing the same
03/25/2008US7348238 Bottom electrode for memory device and method of forming the same
03/25/2008US7348237 NOR flash memory cell with high storage density
03/25/2008US7348236 Formation of memory cells and select gates of NAND memory arrays
03/25/2008US7348235 Semiconductor device and method of manufacturing the same
03/25/2008US7348234 Methods of forming capacitor constructions
03/25/2008US7348233 Methods for fabricating a CMOS device including silicide contacts
03/25/2008US7348232 Highly activated carbon selective epitaxial process for CMOS
03/25/2008US7348231 Methods of fabricating semiconductor devices having insulating layers with differing compressive stresses
03/25/2008US7348230 Manufacturing method of semiconductor device
03/25/2008US7348229 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
03/25/2008US7348228 Deep buried channel junction field effect transistor (DBCJFET)
03/25/2008US7348227 Semiconductor device and manufacturing method thereof
03/25/2008US7348226 Method of forming lattice-matched structure on silicon and structure formed thereby
03/25/2008US7348225 Structure and method of fabricating FINFET with buried channel
03/25/2008US7348224 Method for manufacturing thin film transistor, electro-optical device and electronic apparatus
03/25/2008US7348222 Method for manufacturing a thin film transistor and method for manufacturing a semiconductor device
03/25/2008US7348221 Process for manufacturing a semiconductor device, a semiconductor device and a high-frequency circuit
03/25/2008US7348220 Resin-encapsulated type semiconductor packages, and production method and apparatus therefor
03/25/2008US7348219 Method of mounting memory device on PCB for memory module
03/25/2008US7348218 Semiconductor packages and methods of manufacturing thereof
03/25/2008US7348217 Method and structure for interfacing electronic devices
03/25/2008US7348216 Rework process for removing residual UV adhesive from C4 wafer surfaces
03/25/2008US7348215 Methods for assembly and packaging of flip chip configured dice with interposer
03/25/2008US7348214 Integrated circuit package with improved power signal connection
03/25/2008US7348213 Method for forming component mounting hole in semiconductor substrate
03/25/2008US7348212 Interconnects for semiconductor light emitting devices
03/25/2008US7348211 Method for fabricating semiconductor packages
03/25/2008US7348210 Post bump passivation for soft error protection
03/25/2008US7348205 Method of forming resistance variable devices
03/25/2008US7348204 Method of fabricating solid state imaging device including filling interelectrode spacings
03/25/2008US7348203 Hermetic packaging
03/25/2008US7348202 CMOS image sensor and method for fabricating the same
03/25/2008US7348201 Creation of anisotropic strain in semiconductor quantum well
03/25/2008US7348200 Method of growing non-polar a-plane gallium nitride
03/25/2008US7348199 Wafer dividing method
03/25/2008US7348198 Liquid crystal display device and fabricating method thereof
03/25/2008US7348197 Liquid crystal display device and fabrication method thereof
03/25/2008US7348196 Liquid crystal display and manufacturing method of the same
03/25/2008US7348195 Semiconductor light-emitting device and method for fabricating the device
03/25/2008US7348193 Hermetic seals for micro-electromechanical system devices
03/25/2008US7348192 Method for monitoring film thickness, a system for monitoring film thickness, a method for manufacturing a semiconductor device, and a program product for controlling film thickness monitoring system
03/25/2008US7348191 Semiconductor device with terminals, and method of manufacturing the same
03/25/2008US7348190 Method of detecting a defect in a semiconductor device
03/25/2008US7348189 Field transistor monitoring pattern for shallow trench isolation defects in semiconductor device
03/25/2008US7348188 Method for analyzing metal element on surface of wafer
03/25/2008US7348187 Method, device, computer-readable storage medium and computer program element for the monitoring of a manufacturing process of a plurality of physical objects
03/25/2008US7348186 Method for improving a semiconductor substrate having SiGe film and semiconductor device manufactured by using this method
03/25/2008US7348130 Electron exposure to reduce line edge roughness
03/25/2008US7348129 method and apparatus for reforming an organic material film such as an interlayer insulating film; irradiated onto the organic material film through a hydrocarbon radical generating gas
03/25/2008US7348109 increases the number of semiconductor dice obtained from one semiconductor; dicing line is not formed through the Test Element Group die pattern
03/25/2008US7348108 Design and layout of phase shifting photolithographic masks
03/25/2008US7348107 Reticle, semiconductor exposure apparatus and method, and semiconductor device manufacturing method
03/25/2008US7348106 after forming a predetermined mask pattern through an energy beam resist layer, mask is inspected for at least one missing pattern; mask is repaired in defect area; missing pattern is reformed; mask pattern is transferred in the shift layer material
03/25/2008US7348105 Reflective maskblanks
03/25/2008US7347951 Method of manufacturing electronic device
03/25/2008US7347915 Plasma in-situ treatment of chemically amplified resist
03/25/2008US7347901 Thermally zoned substrate holder assembly
03/25/2008US7347900 Chemical vapor deposition apparatus and method
03/25/2008US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts
03/25/2008US7347683 Mold and molding apparatus using the same
03/25/2008US7347656 Vacuum processing apparatus and semiconductor manufacturing line using the same
03/25/2008US7347348 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
03/25/2008US7347347 Head assembly, disk unit, and bonding method and apparatus
03/25/2008US7347228 Method of making semiconductor devices
03/25/2008US7347214 Rotary shaft sealing mechanism and liquid processing apparatus
03/25/2008US7347006 Processing apparatus and method for removing particles therefrom
03/25/2008CA2406347C Gan substrate, method of growing gan and method of producing gan substrate
03/25/2008CA2238208C Protective coating by high rate arc plasma deposition
03/20/2008WO2008034137A1 Group ii element alloys for protecting metal interconnects
03/20/2008WO2008034113A1 Formation of strain-inducing films using hydrogenated amorphous silicon
03/20/2008WO2008034062A2 Method for making cobalt nanomaterials