Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/20/2008WO2008034026A1 Device and method of manufacture for a low noise junction field effect transistor
03/20/2008WO2008033994A1 Micropipe-free silicon carbide and related method of manufacture
03/20/2008WO2008033886A2 Method and system for dry etching a hafnium containing material
03/20/2008WO2008033707A1 Semiconductor processing including etched layer passivation using self-assembled monolayer
03/20/2008WO2008033680A2 Method and apparatus for creating rfid devices using masking techniques
03/20/2008WO2008033436A1 Systems and methods for forming strontium-and/or barium-containing layers
03/20/2008WO2008033303A2 Branched nanoscale wires
03/20/2008WO2008033234A2 In-situ wafer temperature measurement and control
03/20/2008WO2008033186A1 Methods of controlling morphology during epitaxial layer formation
03/20/2008WO2008033135A1 System for and method of laser cutting of materials in a vacuum environment with a vacuum system
03/20/2008WO2008032983A1 Tray handling apparatus and semiconductor device inspecting method using the same
03/20/2008WO2008032910A1 Apparatus of chemical vapor deposition with a showerhead regulating injection velocity of reactive gases positively and method thereof
03/20/2008WO2008032873A1 Method for manufacturing semiconductor epitaxial crystal substrate
03/20/2008WO2008032866A1 Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure
03/20/2008WO2008032794A1 Cmp polishing agent, additive solution for cmp polishing agent, and method for polishing substrate by using the polishing agent and the additive solution
03/20/2008WO2008032786A1 Display device
03/20/2008WO2008032753A1 Polishing apparatus and polishing method
03/20/2008WO2008032745A1 Magnetoresistive element manufacturing method, and multi-chamber apparatus for manufacturing the magnetoresistive element
03/20/2008WO2008032728A1 Etching solution composition
03/20/2008WO2008032716A1 Resist material for lithography and method for formation of resist pattern
03/20/2008WO2008032715A1 Organic semiconductor material, organic semiconductor device using the same, and their production methods
03/20/2008WO2008032714A1 Coating/developing apparatus, coating/developing apparatus control method and storage medium
03/20/2008WO2008032701A1 Clock adjusting circuit and semiconductor integrated circuit device
03/20/2008WO2008032681A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device
03/20/2008WO2008032680A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device
03/20/2008WO2008032637A1 Organic transistor, and organic transistor manufacturing method
03/20/2008WO2008032627A1 Dry etching method
03/20/2008WO2008032620A1 Semiconductor device
03/20/2008WO2008032591A1 Work transfer apparatus
03/20/2008WO2008032522A1 Positive-type resist composition and method for formation of resist pattern
03/20/2008WO2008032516A1 Treating gas supply system and method of supplying treating gas
03/20/2008WO2008032512A1 Positive-type resist composition and method for formation of resist pattern
03/20/2008WO2008032510A1 Process for producing semiconductor device
03/20/2008WO2008032456A1 Substrate transfer apparatus and substrate transfer method
03/20/2008WO2008032455A1 Substrate transfer apparatus and substrate transfer method
03/20/2008WO2008032367A1 Dicing/die bonding film
03/20/2008WO2008032108A1 Method of recycling hydrogen
03/20/2008WO2008031980A1 Method of transferring a layer at high temperature
03/20/2008WO2008031809A1 Process for making a gan substrate
03/20/2008WO2008031633A1 Modular microelectronic system
03/20/2008WO2008031321A1 Inductive coupling coil and inductive coupling plasma apparatus thereof
03/20/2008WO2008031320A1 Inductive coupling coil and inductive coupling plasma apparatus thereof
03/20/2008WO2008031255A1 Method of self-aligned silicon nitride overlying for the borderless contact hole of copper technology
03/20/2008WO2008018981A3 Silicone resin and silicone composition
03/20/2008WO2008016836A3 Radical-enhanced atomic layer deposition system and method
03/20/2008WO2008015368A3 Method for cutting electronic elements out of a semiconductor wafer
03/20/2008WO2008013820A9 Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method
03/20/2008WO2008013516A3 Seed layers, cap layers, and thin films and methods of making thereof
03/20/2008WO2008011329A3 Method and system for isolated and discretized process sequence integration
03/20/2008WO2008011014A3 System and method for processing high puruity materials
03/20/2008WO2008010982A3 Thermally imageable dielectric layers, thermal transfer donors and receivers
03/20/2008WO2008008338A3 Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same
03/20/2008WO2008005216A3 Metal layer inducing strain in silicon
03/20/2008WO2008002780A3 Batch processing platform for ald and cvd
03/20/2008WO2007146757A3 Methods of forming solder connections and structure thereof
03/20/2008WO2007143073A3 Doped plug for ccd gaps
03/20/2008WO2007142975A3 Resonating conductive traces and methods of using same for bonding components
03/20/2008WO2007139681A3 Power mosfet contact metallization
03/20/2008WO2007136809A3 Electrostatic chuck to limit particle deposits thereon
03/20/2008WO2007127044A3 Method of manufacturing a ccd with improved charge transfer
03/20/2008WO2007109522A3 Methods for etching a dielectric barrier layer with high selectivity
03/20/2008WO2007079277A3 Manufacturing method and device for making an in-mold circuit comprising a chip
03/20/2008US20080072208 Mask defect inspecting method, semiconductor device manufacturing method, mask defect inspecting apparatus, defect influence map generating method, and computer program product
03/20/2008US20080071486 Semiconductor device with its test time reduced and a test method therefor
03/20/2008US20080071479 Method for an automatic optical measuring of an OPC structure
03/20/2008US20080071409 Handler
03/20/2008US20080071408 Substrate processing apparatus, substrate processing method, computer program, and storage medium
03/20/2008US20080070488 Polishing method and polishing apparatus
03/20/2008US20080070423 Buried seed one-shot interlevel crystallization
03/20/2008US20080070422 Serial irradiation of a substrate by multiple radiation sources
03/20/2008US20080070421 Bi-layer capping of low-k dielectric films
03/20/2008US20080070420 Method of fabricating image sensor
03/20/2008US20080070419 Process of manufacturing a semiconductor device
03/20/2008US20080070418 Substrate processing apparatus and substrate processing method
03/20/2008US20080070417 Method of etching semiconductor device and method of fabricating semiconductor device using the same
03/20/2008US20080070416 Phase shift mask including a substrate with recess
03/20/2008US20080070415 Method for burying resist and method for manufacturing semiconductor device
03/20/2008US20080070414 Method for designing mask and method for manufacturing semiconductor device employing thereof
03/20/2008US20080070413 Fabrication methods of a patterned sapphire substrate and a light-emitting diode
03/20/2008US20080070412 Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device
03/20/2008US20080070411 Methods for uniformly etching films on a semiconductor wafer
03/20/2008US20080070410 Method for manufacturing capacitor using system in package
03/20/2008US20080070409 Method of Fabricating Interconnections of Microelectronic Device Using Dual Damascene Process
03/20/2008US20080070408 Method for adjusting sizes and shapes of plug openings
03/20/2008US20080070407 Method for forming a conductive pattern in a semiconductor device
03/20/2008US20080070406 Pattern forming method and semiconductor device manufacturing method using the same
03/20/2008US20080070405 Methods of forming metal wiring layers for semiconductor devices
03/20/2008US20080070404 Methods of manufacturing semiconductor devices and structures thereof
03/20/2008US20080070403 Method and arrangement for contacting terminals
03/20/2008US20080070402 Method of Forming Contact Hole Pattern in Semiconductor Integrated Circuit Device
03/20/2008US20080070401 Memory device and method for manufacturing the same
03/20/2008US20080070400 Semiconductor device and manufacturing method thereof
03/20/2008US20080070399 Process for forming low defect density heterojunctions
03/20/2008US20080070397 Methods for Selective Placement of Dislocation Arrays
03/20/2008US20080070396 Group II element alloys for protecting metal interconnects
03/20/2008US20080070395 Semiconductor devices and methods with bilayer dielectrics
03/20/2008US20080070394 Mos transistor in an active region
03/20/2008US20080070393 Method for Manufacturing Semiconductor Device
03/20/2008US20080070392 Controlling diffusion in doped semiconductor regions
03/20/2008US20080070391 Anti-halo compensation
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