| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/13/2008 | WO2008029595A1 Temperature measuring device |
| 03/13/2008 | WO2008029589A1 Method and equipment for producing group-iii nitride |
| 03/13/2008 | WO2008029582A1 Semiconductor device, method for manufacturing the semiconductor device, and display device |
| 03/13/2008 | WO2008029579A1 Silicon single-crystal wafer and process for producing the same |
| 03/13/2008 | WO2008029557A1 Board storage container and check valve |
| 03/13/2008 | WO2008029544A1 Semiconductor device, method for fabricating the same and electronic device |
| 03/13/2008 | WO2008029538A1 Polishing pad |
| 03/13/2008 | WO2008029537A1 Method for production of polishing pad |
| 03/13/2008 | WO2008029361A1 Integrated circuit and use thereof |
| 03/13/2008 | WO2008029360A1 Manufacturing a contact structure in a semiconductor device |
| 03/13/2008 | WO2008029334A1 Fabrication of self-assembled nanowire-type interconnects on a semiconductor device |
| 03/13/2008 | WO2008029176A1 Method of pumping gas |
| 03/13/2008 | WO2008028940A1 Low resistance contact structure and fabrication thereof |
| 03/13/2008 | WO2008028906A1 Method and device for controlling the generation of ultrasonic wire bonds |
| 03/13/2008 | WO2008028851A1 Control of carbon nanostructure growth in an interconnect structure |
| 03/13/2008 | WO2008028850A1 CuSiN/SiN DIFFUSION BARRIER FOR COPPER IN INTEGRATED-CIRCUIT DEVICES |
| 03/13/2008 | WO2008028660A2 Device with pb-based high-k dielectric thin-film capacitor comprising pb-donating layers |
| 03/13/2008 | WO2008028452A1 Plasma etching method for producing positive etching profiles in silicon substrates |
| 03/13/2008 | WO2008028352A1 An apparatus of controlling temperature and a method of controlling the temperature of wafer |
| 03/13/2008 | WO2008016514A3 Nand memory with silicon-rich charge storage layers and manufacturing method thereof using self-aligned shallow-trench isolation |
| 03/13/2008 | WO2008014506A3 Dual inductor circuit for multi-band wireless communication device |
| 03/13/2008 | WO2008011688A3 GROWTH OF MONOCRYSTALLINE GeN ON A SUBSTRATE |
| 03/13/2008 | WO2008011687A3 Conductive contacts on ge |
| 03/13/2008 | WO2008007326A3 Transponder and method of producing a transponder |
| 03/13/2008 | WO2008005716A3 Wafer platform |
| 03/13/2008 | WO2008005630A3 Methods for minimizing mask undercuts and notches for plasma processing system |
| 03/13/2008 | WO2007142817A3 Memory system with switch element |
| 03/13/2008 | WO2007137946A3 Trench widening without merging |
| 03/13/2008 | WO2007130333A3 Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors |
| 03/13/2008 | WO2007121735A3 Composite substrate, and method for the production of a composite substrate |
| 03/13/2008 | WO2007120228A3 Carbon nanotubes solder composite for high performance interconnect |
| 03/13/2008 | WO2007111779A8 Method of integrating peald ta-containing films into cu metallization |
| 03/13/2008 | WO2007108925A3 Oxidation-stabilized cmp compositions and methods |
| 03/13/2008 | WO2007081642A3 Flash devicewith shared word lines and manufacturing methods thereof |
| 03/13/2008 | WO2007014631A3 Substrate comprising at least one entire surface or partial surface macrostructured layer, method for the production thereof and its use |
| 03/13/2008 | WO2006136584A8 Method of forming a high dielectric constant film and method of forming a semiconductor device |
| 03/13/2008 | US20080065340 Particle-measuring system and particle-measuring method |
| 03/13/2008 | US20080064849 Adhesive film for circuit connection, and circuit connection structure |
| 03/13/2008 | US20080064791 Encapsulation; reliable high temperature operation; including phenol resin, curing accelerator, silica and alumina |
| 03/13/2008 | US20080064358 Semiconductor device and method for making the same |
| 03/13/2008 | US20080064311 Polishing Pad |
| 03/13/2008 | US20080064308 Polishing apparatus and manufacturing method of an electronic apparatus |
| 03/13/2008 | US20080064302 Polishing apparatus, polishing pad, and polishing method |
| 03/13/2008 | US20080064233 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 03/13/2008 | US20080064227 Apparatus For Chemical Vapor Deposition and Method For Cleaning Injector Included in the Apparatus |
| 03/13/2008 | US20080064226 Method of processing a substrate, heating apparatus, and method of forming a pattern |
| 03/13/2008 | US20080064225 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond |
| 03/13/2008 | US20080064224 Device comprising an ohmic via contact, and method of fabricating thereof |
| 03/13/2008 | US20080064223 Etching liquid, etching method, and method of manufacturing electronic component |
| 03/13/2008 | US20080064222 Alkaline etching solution for semiconductor wafers and alkaline etching method |
| 03/13/2008 | US20080064221 Method for fabricating semiconductor device including plug |
| 03/13/2008 | US20080064220 Method and system for dry etching a hafnium containing material |
| 03/13/2008 | US20080064219 Method of removing photoresist |
| 03/13/2008 | US20080064218 Manufacturing method for preventing image sensor from undercut |
| 03/13/2008 | US20080064217 Methods of Forming Semiconductor Devices Using Di-Block Polymer Layers |
| 03/13/2008 | US20080064216 Method of manufacturing flash memory device |
| 03/13/2008 | US20080064215 Method of fabricating a semiconductor package |
| 03/13/2008 | US20080064214 Semiconductor processing including etched layer passivation using self-assembled monolayer |
| 03/13/2008 | US20080064213 Method for forming a fine pattern of a semiconductor device |
| 03/13/2008 | US20080064212 Method of manufacturing semiconductor device |
| 03/13/2008 | US20080064211 Polishing compound for copper wirings and method for polishing surface of semiconductor integrated circuit |
| 03/13/2008 | US20080064210 Systems and methods of forming refractory metal nitride layers using organic amines |
| 03/13/2008 | US20080064209 Systems and methods for forming metal-containing layers using vapor deposition processes |
| 03/13/2008 | US20080064208 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding |
| 03/13/2008 | US20080064207 Semiconductor Device Power Interconnect Striping |
| 03/13/2008 | US20080064206 Method of manufacturing a semiconductor memory device |
| 03/13/2008 | US20080064205 Silicon-alloy based barrier layers for integrated circuit metal interconnects |
| 03/13/2008 | US20080064204 Method of forming a metal line of a semiconductor device |
| 03/13/2008 | US20080064203 Method for fabricating a contact hole |
| 03/13/2008 | US20080064202 Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases |
| 03/13/2008 | US20080064201 Flip chip packaging method that protects the sensing area of an image sensor from contamination |
| 03/13/2008 | US20080064200 Method to manufacture a phase change memory |
| 03/13/2008 | US20080064199 Methods of Forming Electrical Interconnect Structures Using Polymer Residues to Increase Etching Selectivity Through Dielectric Layers |
| 03/13/2008 | US20080064198 Chalcogenide semiconductor memory device with insulating dielectric |
| 03/13/2008 | US20080064197 STRUCTURES AND METHODS FOR MANUFACTURING OF DISLOCATION FREE STRESSED CHANNELS IN BULK SILICON AND SOI MOS DEVICES BY GATE STRESS ENGINEERING WITH SiGe AND/OR Si:C |
| 03/13/2008 | US20080064196 Semiconductor device and method of manufacturing same |
| 03/13/2008 | US20080064195 Method for Manufacturing Gate of Non Volatile Memory Device |
| 03/13/2008 | US20080064194 Method for fabricating flash memory device |
| 03/13/2008 | US20080064193 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING KrF LIGHT SOURCE |
| 03/13/2008 | US20080064192 Method for forming semiconductor device |
| 03/13/2008 | US20080064191 Modulation of Stress in Stress Film through Ion Implantation and Its Application in Stress Memorization Technique |
| 03/13/2008 | US20080064190 Manufacturing method of semiconductor device and semiconductor manufacturing device |
| 03/13/2008 | US20080064189 Crack stop for low k dielectrics |
| 03/13/2008 | US20080064188 Wafer processing method and wafer processing apparatus |
| 03/13/2008 | US20080064187 Production Method for Stacked Device |
| 03/13/2008 | US20080064186 Manufacturing method of semiconductor element |
| 03/13/2008 | US20080064185 Semiconductor wafer front side protection |
| 03/13/2008 | US20080064184 Method, apparatus for holding and treatment of a substrate |
| 03/13/2008 | US20080064183 Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
| 03/13/2008 | US20080064182 Process for high temperature layer transfer |
| 03/13/2008 | US20080064181 Semiconductor device and method of fabricating the same |
| 03/13/2008 | US20080064180 Method for passivating inductively coupled surface currents in a semiconductor device |
| 03/13/2008 | US20080064179 Low leakage mim capacitor |
| 03/13/2008 | US20080064178 Deep trench capacitor through soi substrate and methods of forming |
| 03/13/2008 | US20080064177 Bipolar Device Having Improved Capacitance |
| 03/13/2008 | US20080064176 Method of removing a spacer, method of manufacturing a metal-oxide-semiconductor transistor device, and metal-oxide-semiconductor transistor device |
| 03/13/2008 | US20080064175 Low Stress Sacrificial Cap Layer |
| 03/13/2008 | US20080064174 Method for manufacturing an integrated circuit with fully depleted and partially depleted transistors |
| 03/13/2008 | US20080064173 Semiconductor device, cmos device and fabricating methods of the same |
| 03/13/2008 | US20080064172 Stressed semiconductor device structures having granular semiconductor material |