Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/06/2008US20080057693 Electrical conductivity bridge in a conductive multilayer article
03/06/2008US20080057692 Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structures
03/06/2008US20080057691 Methods and systems for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
03/06/2008US20080057690 Tantalum silicon oxynitride high-k dielectrics and metal gates
03/06/2008US20080057689 Method of fabricating semiconductor integrated circuit device
03/06/2008US20080057688 Method of forming bit line of semiconductor memory device
03/06/2008US20080057687 Selective area deposition and devices formed therefrom
03/06/2008US20080057686 Continuous dopant addition
03/06/2008US20080057685 Method for forming doped metal-semiconductor compound regions
03/06/2008US20080057684 METHOD FOR FABRICATING LOW-DEFECT-DENSITY CHANGED ORIENTATION Si
03/06/2008US20080057683 Method for junction formation in a semiconductor device and the semiconductor device made thereof
03/06/2008US20080057682 Manufacturing method of an integrated circuit formed on a semiconductor substrate
03/06/2008US20080057681 Dynamic surface annealing of implanted dopants with low temperature hdpcvd process for depositing a high extinction coefficient optical absorber layer
03/06/2008US20080057680 Wafer laser processing method
03/06/2008US20080057679 Method of scribing stuck mother substrate and method of dividing stuck mother substrate
03/06/2008US20080057678 Semiconductor on glass insulator made using improved hydrogen reduction process
03/06/2008US20080057677 Chip location identification
03/06/2008US20080057676 Bonded wafer and method for producing bonded wafer
03/06/2008US20080057675 Method and Device for Controlled Cleaving Process
03/06/2008US20080057674 Method for manufacturing sip semiconductor device
03/06/2008US20080057673 Semiconductor structure and method of making same
03/06/2008US20080057672 Shallow Trench Isolation Structures and a Method for Forming Shallow Trench Isolation Structures
03/06/2008US20080057671 Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures
03/06/2008US20080057670 Semiconductor Device and Method of Fabricating the Same
03/06/2008US20080057669 Method of forming element isolation film and nonvolatile semiconductor memory
03/06/2008US20080057668 Method for fabricating semiconductor device
03/06/2008US20080057667 Test structure and method for detecting via contact shorting in shallow trench isolation regions
03/06/2008US20080057666 Method of manufacturing a semiconductor device
03/06/2008US20080057665 Strained semiconductor device and method of making same
03/06/2008US20080057664 Low leakage mim capacitor
03/06/2008US20080057663 Low leakage mim capacitor
03/06/2008US20080057661 Fabricating method of semiconductor device
03/06/2008US20080057660 Step-gate for a semiconductor device
03/06/2008US20080057659 Hafnium aluminium oxynitride high-K dielectric and metal gates
03/06/2008US20080057658 Method for fabricating a thick copper line and copper inductor resulting therefrom
03/06/2008US20080057657 Method for fabrication of semiconductor device
03/06/2008US20080057656 Method of Manufacturing Semiconductor Device
03/06/2008US20080057655 Method of fabricating semiconductor devices and method of adjusting lattice distance in device channel
03/06/2008US20080057654 Method for manufacturing a transistor device having an improved breakdown voltage and a method for manufacturing an integrated circuit using the same
03/06/2008US20080057653 Method and structure for improving device performance variation in dual stress liner technology
03/06/2008US20080057652 Ion implantation method of semiconductor device
03/06/2008US20080057651 Method of manufacturing non-volatile memory
03/06/2008US20080057650 Semiconductor Device
03/06/2008US20080057649 Recessed-gate thin-film transistor with self-aligned lightly doped drain
03/06/2008US20080057648 Direct tunneling semiconductor memory device and fabrication process thereof
03/06/2008US20080057647 Structure and method of fabricating high-density, trench-based non-volatile random access sonos memory cells for soc applications
03/06/2008US20080057646 Nonvolatile memory device and methods of fabricating and driving the same
03/06/2008US20080057645 Fabricating method of mosfet with thick gate dielectric layer
03/06/2008US20080057644 Semiconductor devices having a convex active region and methods of forming the same
03/06/2008US20080057643 Memory and method of reducing floating gate coupling
03/06/2008US20080057642 Semiconductor device having polycide wiring layer, and manufacturing method of the same
03/06/2008US20080057641 Semiconductor device with capacitors and its manufacture method
03/06/2008US20080057640 Method for fabricating first electrode of capacitor
03/06/2008US20080057639 Semiconductor constructions, and methods of forming semiconductor constructions and flash memory cells
03/06/2008US20080057638 Method of manufacturing a flash memory device
03/06/2008US20080057637 Method for manufacturing semiconductor device
03/06/2008US20080057636 Strained semiconductor device and method of making same
03/06/2008US20080057635 Asymmetric transistor
03/06/2008US20080057634 Method For Forming Semiconductor Device
03/06/2008US20080057633 Method for manufacturing thin film transistor array
03/06/2008US20080057632 Method for Manufacturing Semiconductor Device
03/06/2008US20080057631 Thin film transistor, method of fabricating active layer thereof, and liquid crystal display
03/06/2008US20080057630 Flexible core for enhancement of package interconnect reliablity
03/06/2008US20080057629 Integrated circuit cooling and insulating device and method
03/06/2008US20080057628 Modified chip attach process
03/06/2008US20080057627 Method of manufacturing a combined multilayer circuit board having embedded chips
03/06/2008US20080057626 Method of manufacturing a semiconductor device
03/06/2008US20080057625 Method and apparatus for making semiconductor packages
03/06/2008US20080057624 Stack type semiconductor package utilizing solder coated stacking protrusions and method for manufacturing the same
03/06/2008US20080057623 Thin embedded active IC circuit integration techniques for flexible and rigid circuits
03/06/2008US20080057622 Map type semiconductor package
03/06/2008US20080057621 Microelectronic devices and methods for manufacturing microelectronic devices
03/06/2008US20080057620 Redistribution layers for microfeature workpieces, and associated systems and methods
03/06/2008US20080057619 Microcontainer for Hermetically Encapsulating Reactive Materials
03/06/2008US20080057618 Method for Manufacturing Semiconductor Device
03/06/2008US20080057617 Method of thin lightshield process for solid-state image sensors
03/06/2008US20080057616 Bandgap grading in thin-film devices via solid group iiia particles
03/06/2008US20080057615 Manufacturing method of photoelectric conversion device
03/06/2008US20080057614 Color image sensor device and fabrication method thereof
03/06/2008US20080057613 Cmos image sensor and method for manufacturing the same
03/06/2008US20080057612 Method for adding an implant at the shallow trench isolation corner in a semiconductor substrate
03/06/2008US20080057611 Method of manufacturing a thin-film thermo-electric generator
03/06/2008US20080057610 Method of forming a mask structure and method of forming a minute pattern using the same
03/06/2008US20080057608 Manufacturing method of group III nitride substrate, group III nitride substrate, group III nitride substrate with epitaxial layer, manufacturing method of group III nitride substrate with epitaxial layer, and manufacturing method of group III nitride device
03/06/2008US20080057607 Liquid crystal display
03/06/2008US20080057606 Liquid crystal display
03/06/2008US20080057605 Method for manufacturing semiconductor device and method for manufacturing display device
03/06/2008US20080057604 Method of fabricating display device
03/06/2008US20080057602 Fabrication System and Manufacturing Method of Light-Emitting Device
03/06/2008US20080057601 Method for manufacturing a white LED
03/06/2008US20080057600 Mounting circuit and method for producing semiconductor-chip-mounting circuit
03/06/2008US20080057599 Fabrication method of semiconductor device
03/06/2008US20080057598 Method for forming ferroelectric capacitor and method for fabricating semiconductor device
03/06/2008US20080057408 Photomask and pattern forming method employing the same
03/06/2008US20080057344 Formation of Titanium Nitride Film
03/06/2008US20080056976 Heating a mixture of a boron containing vapor and a titanium tetrachloride dopant vapor to produce doped boron and exposing the doped boron to magnesium vapor; superconductors
03/06/2008US20080056967 Oxidizing method and oxidizing unit for object to be processed
03/06/2008US20080056857 Substrate transfer device, substrate processing apparatus and substrate transfer method
03/06/2008US20080056856 Compact Processing Apparatus
03/06/2008US20080056855 Vertical diffusion furnace having wafer mapping equipment and method of using the same
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