Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/06/2008WO2008026468A1 Resist underlayer film forming composition containing liquid additive
03/06/2008WO2008026451A1 Polishing pad
03/06/2008WO2008026422A1 Compound, positive-type resist composition, and method for formation of resist pattern
03/06/2008WO2008026421A1 Compound, positive-type resist composition, and method for formation of resist pattern
03/06/2008WO2008026415A1 Method for forming semiconductor substrate and electrode, and method for manufacturing solar battery
03/06/2008WO2008026408A1 Photoresist-removing solution, and method for treatment of substrate using the same
03/06/2008WO2008026406A1 Photosensitive insulating resin composition, hardening product thereof, and circuit board equipped therewith
03/06/2008WO2008026401A1 Photosensitive insulation resin composition and cured product thereof
03/06/2008WO2008026397A1 Radiation-sensitive insulation resin composition, cured article, and electronic device
03/06/2008WO2008026388A1 Multi-chip type semiconductor device
03/06/2008WO2008026387A1 Method of forming amorphous silica coating of low dielectric constant and amorphous silica coating of low dielectric constant obtained thereby
03/06/2008WO2008026366A1 Surface treatment method and apparatus
03/06/2008WO2008026335A1 Electronic part device and method of manufacturing it and electronic part assembly and method of manufacturing it
03/06/2008WO2008026284A1 Logic circuit
03/06/2008WO2008026237A1 Carbon nanotube materials, process for production thereof, and electronic components and devices
03/06/2008WO2008026181A1 Method for improving inversion layer mobility in a silicon carbide mosfet
03/06/2008WO2008026175A1 Method of manufacturing a bipolar transistor
03/06/2008WO2008026120A2 Electrical conductivity bridge in a conductive multilayer article
03/06/2008WO2008025889A1 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
03/06/2008WO2008025832A1 Method and apparatus for manufacturing an electronic module
03/06/2008WO2008025764A1 Device for wetting bumps of a semiconductor chip with a liquid substance
03/06/2008WO2008025725A1 Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (mems) produced therewith
03/06/2008WO2008025676A1 Interconnect structures for integrated circuits and formation methods therefor
03/06/2008WO2008025661A1 Method and structure for improving device performance variation in dual stress liner technology
03/06/2008WO2008025588A1 Semiconductor structure with enhanced performance using a simplified dual stress liner configuration
03/06/2008WO2008025354A2 Method for selective plasmochemical dry-etching of phosphosilicate glass deposited on surfaces of silicon wafers
03/06/2008WO2008025209A1 Polishing slurry for low dielectric material
03/06/2008WO2008025208A1 Polishing slurry containing blended abrasives for low dielectric material
03/06/2008WO2008025057A1 Thin-film diode structure using a sacrificial doped dielectric layer
03/06/2008WO2008008741A3 Bridge loadport and method
03/06/2008WO2008007335A3 High electron mobility transistor.
03/06/2008WO2008007331A3 Semiconductor devices and methods of manufacture thereof
03/06/2008WO2008005539A3 Apparatus for cleaning a wafer substrate
03/06/2008WO2008002735A3 Abrasive articles, cmp monitoring system and method
03/06/2008WO2008002415A3 Precursors for depositing silicon containing films and processes thereof
03/06/2008WO2007149901A3 Novel reworkable underfills for ceramic mcm c4 protection
03/06/2008WO2007146848A3 Surface modification of interlayer dielectric for minimizing contamination and surface degradation
03/06/2008WO2007142937A3 High-voltage bipolar-cmos-dmos integrated circuit devices and modular methods of forming the same
03/06/2008WO2007131867B1 Dual wired integrated circuit chips
03/06/2008WO2007126966A3 Insulator system for a terminal structure of an ion implantation system
03/06/2008WO2007117802A8 Method for integrating a conformal ruthenium layer into copper metallization of high aspect ratio features
03/06/2008WO2007061996B1 Ball grid attachment
03/06/2008WO2007061603A3 Methods and apparatus for transferring substrates during electronic device manufacturing
03/06/2008WO2001042727A3 Method, apparatus, and composition for drying solid articles
03/06/2008US20080059939 Performance in model-based opc engine utilizing efficient polygon pinning method
03/06/2008US20080059261 Method for capturing and using design intent in an integrated circuit fabrication process
03/06/2008US20080059094 Defect Inspection Apparatus and Defect Inspection Method
03/06/2008US20080059083 Method for inspecting defect and system therefor
03/06/2008US20080058977 Reviewing apparatus using a sem and method for reviewing defects or detecting defects using the reviewing apparatus
03/06/2008US20080057845 Method for manufacturing microporous CMP materials having controlled pore size
03/06/2008US20080057837 Method and appratus of manufacturing semiconductor device
03/06/2008US20080057836 Pad conditioning head for cmp process
03/06/2008US20080057832 Silicide containing silica and Group 2a oxides in mixture with oxidizer and water liquid carrier
03/06/2008US20080057742 Circuit-connecting material and circuit terminal connected structure and connecting method
03/06/2008US20080057740 Dopant activation in doped semiconductor substrates
03/06/2008US20080057739 Defect Control in Gate Dielectrics
03/06/2008US20080057738 Atomic layer deposition apparatus and method for manufacturing semiconductor device using the same
03/06/2008US20080057737 System and method for forming a gate dielectric
03/06/2008US20080057736 Method for improving adhesion force between thin films
03/06/2008US20080057735 Method of Manufacturing a Semiconductor Device
03/06/2008US20080057734 Apparatus for fabricating a semiconductor device and method of fabricating a semiconductor device using the same
03/06/2008US20080057733 Method of fabricating a semiconductor integrated circuit device
03/06/2008US20080057732 Method for manufacturing silicon substrate, method for manufacturing droplet discharging head, and method for manufacturing droplet discharging apparatus
03/06/2008US20080057731 Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part
03/06/2008US20080057730 Method for using a modified post-etch clean rinsing agent
03/06/2008US20080057729 Etch methods to form anisotropic features for high aspect ratio applications
03/06/2008US20080057728 Process For Fabricating Semiconductor Device
03/06/2008US20080057727 Method of manufacturing a semiconductor device
03/06/2008US20080057726 Apparatus and method for fabricating semiconductor device and removing by-products
03/06/2008US20080057725 Method of manufacturing semiconductor device
03/06/2008US20080057724 Selective etch chemistries for forming high aspect ratio features and associated structures
03/06/2008US20080057723 Image sensor and method for manufacturing the same
03/06/2008US20080057722 Fabricating method of semiconductor device
03/06/2008US20080057721 Method of fabricating semiconductor device
03/06/2008US20080057720 Method for patterning contact etch stop layers by using a planarization process
03/06/2008US20080057719 Method and apparatus for fabricating or altering microstructures using local chemical alterations
03/06/2008US20080057718 Method for manufacturing semiconductor device
03/06/2008US20080057717 Semiconductor device manufacturing method
03/06/2008US20080057715 Cmp system utilizing halogen adduct
03/06/2008US20080057714 Polished semiconductor wafer and process for producing it
03/06/2008US20080057713 Silicon carbide polishing method utilizing water-soluble oxidizers
03/06/2008US20080057712 Method For Achieving Uniform Etch Depth Using Ion Implantation And A timed Etch
03/06/2008US20080057711 Reduction of punch-thru defects in damascene processing
03/06/2008US20080057710 Mosfets comprising source/drain recesses with slanted sidewall surfaces, and methods for fabricating the same
03/06/2008US20080057709 Method and apparatus for workpiece surface modification for selective material deposition
03/06/2008US20080057708 Method for Filling a Trench in a Semiconductor Product
03/06/2008US20080057707 Method for forming contacts of semiconductor device
03/06/2008US20080057706 Method for forming cyclinder type storage node for preventing creation of watermarks
03/06/2008US20080057705 Technique for reducing plasma-induced etch damage during the formation of vias in interlayer dielectrics
03/06/2008US20080057704 Semiconductor device with a barrier film
03/06/2008US20080057703 Post passivation interconnection schemes on top of IC chip
03/06/2008US20080057702 Mehtod of manufacturing semiconductor device
03/06/2008US20080057701 Method for prevention of resist poisoning in integrated circuit fabrication
03/06/2008US20080057700 Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
03/06/2008US20080057699 Method for manufacturing semiconductor device
03/06/2008US20080057698 Method of manufacturing semiconductor device
03/06/2008US20080057697 Methods of Forming Dual-Damascene Interconnect Structures Using Adhesion Layers Having High Internal Compressive Stress and Structures Formed Thereby
03/06/2008US20080057696 Method of forming crack arrest features in embedded device build-up package and package thereof
03/06/2008US20080057695 Semiconductor and method for manufacturing the same
03/06/2008US20080057694 Method for manufacturing semiconductor device
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