Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/20/2008US20080067693 Post passivation interconnection schemes on top of IC chip
03/20/2008US20080067692 Semiconductor devices having contact pad protection for reduced electrical failures and methods of fabricating the same
03/20/2008US20080067689 Deep Via Construction for a Semiconductor Device and a Method of Manufacturing Same
03/20/2008US20080067688 Power-via structure for integration in advanced logic/smart-power technologies
03/20/2008US20080067686 Post passivation interconnection schemes on top of IC chip
03/20/2008US20080067685 Semiconductor Device Manufacturing Method
03/20/2008US20080067682 Bonding Pad for Contacting a Device
03/20/2008US20080067681 Interconnection structure and manufacturing method thereof
03/20/2008US20080067680 Semiconductor device and fabrication process thereof
03/20/2008US20080067679 Semiconductor Device and Method for Manufacturing the Same, and Processing Liquid
03/20/2008US20080067678 Semiconductor Devices Having Contact Holes Including Protrusions Exposing Contact Pads and Methods of Fabricating the Same
03/20/2008US20080067675 Castellation wafer level packaging of integrated circuit chips
03/20/2008US20080067674 System in package (sip) integrated circuit and packaging method thereof
03/20/2008US20080067672 Semiconductor device and method for fabricating the same
03/20/2008US20080067671 Semiconductor device and method for manufacturing the same
03/20/2008US20080067667 Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same
03/20/2008US20080067666 Circuit board structure with embedded semiconductor chip and method for fabricating the same
03/20/2008US20080067663 Wafer level chip package and a method of fabricating thereof
03/20/2008US20080067662 Modularized Die Stacking System and Method
03/20/2008US20080067659 Stacked semiconductor package, method of fabrication, and method of wire-bond monitoring
03/20/2008US20080067656 Stacked multi-chip package with EMI shielding
03/20/2008US20080067655 Device Comprising an Encapsulated Microsystem and Production Method Thereof
03/20/2008US20080067653 Reduction in Thickness of Semiconductor Component on Substrate
03/20/2008US20080067651 Method and apparatus for prevention of solder corrosion utilizing forced air
03/20/2008US20080067649 Semiconductor device, lead-frame product used for the same and method for manufacturing the same
03/20/2008US20080067648 Locking Feature and Method for Manufacturing Transfer Molded IC Packages
03/20/2008US20080067643 Semiconductor device and method of manufacturing the same
03/20/2008US20080067641 Package semiconductor and fabrication method thereof
03/20/2008US20080067635 Chip-mounted film package
03/20/2008US20080067634 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
03/20/2008US20080067632 Em rectifying antenna suitable for use in conjunction with a natural breakdown device
03/20/2008US20080067631 Creating increased mobility in a bipolar device
03/20/2008US20080067627 Fuse Structure and Method for Manufacturing Same
03/20/2008US20080067626 Method for fabricating a trench structure, and a semiconductor arrangement comprising a trench structure
03/20/2008US20080067621 Image sensor structure and method of fabricating the same
03/20/2008US20080067618 Nano-Piezoelectronics
03/20/2008US20080067617 Semiconductor device and manufacturing method thereof
03/20/2008US20080067616 Semiconductor device
03/20/2008US20080067615 Semiconductor device and method for fabricating thereof
03/20/2008US20080067612 Semiconductor Device Including Nickel Alloy Silicide Layer Having Uniform Thickness and Method of Manufacturing the Same
03/20/2008US20080067611 Semiconductor device and manufacturing method thereof
03/20/2008US20080067609 Semiconductor Device Including Field Effct Transistor and Method of Forming the Same
03/20/2008US20080067607 Tunnel effect transistors based on elongate monocrystalline nanostructures having a heterostructure
03/20/2008US20080067604 Field effect transistor arrangement, memory device and methods of forming the same
03/20/2008US20080067603 Thin film transistor array panel and method of manufacture
03/20/2008US20080067599 Semiconductor device and method of manufacturing the same
03/20/2008US20080067597 Method of manufacturing a semiconductor device
03/20/2008US20080067596 Method of Fabricating A Semiconductor Device
03/20/2008US20080067594 Insulated-gate field-effect thin film transistors
03/20/2008US20080067593 Semiconductor device
03/20/2008US20080067592 Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof
03/20/2008US20080067591 Semiconductor device and method of producing the same
03/20/2008US20080067590 Semiconductor device and manufacturing method of the same
03/20/2008US20080067587 Method for producing an electronic component, method for producing a thyristor, method for producing a drain-extended MOS filed-effect transistor, electronic component, drain-extended MOS field-effect transistor, electronic component arrangement
03/20/2008US20080067584 Inverted-trench grounded-source FET structure with trenched source body short electrode
03/20/2008US20080067583 Nonvolatile semiconductor memory device and manufacturing method thereof
03/20/2008US20080067581 Non-volatile memory device and method of manufacturing the same
03/20/2008US20080067580 Memory device and method of manufacturing the same
03/20/2008US20080067579 Flash memory device and method for manufacturing the same
03/20/2008US20080067576 Nonvolatile semiconductor memory and manufacturing method thereof
03/20/2008US20080067575 Semiconductor device and method of manufacturing the same
03/20/2008US20080067574 Semiconductor device and method for manufacturing the same
03/20/2008US20080067569 Memory device with vertical transistor and fabrication method thereof
03/20/2008US20080067568 Capacitor with hemispherical silicon-germanium grains and a method for making the same
03/20/2008US20080067566 ferroelectric memory device may include a substrate, an interlayer insulating layer on the semiconductor substrate, a contact plug penetrating the interlayer insulating layer, the contact plug being formed of a sequentially stacked metal plug and buffer plug, a conductive protection pattern covering
03/20/2008US20080067562 Semiconductor device and manufacturing method thereof
03/20/2008US20080067560 High Voltage Depletion Layer Field Effect Transistor
03/20/2008US20080067557 MOS devices with partial stressor channel
03/20/2008US20080067556 X-Y address type solid state image pickup device and method of producing the same
03/20/2008US20080067555 Self-assembled monolayer based silver switches
03/20/2008US20080067553 Electromechanical memory array using nanotube ribbons and method for making same
03/20/2008US20080067552 Semiconductor integrated circuit device and method for desiging the same
03/20/2008US20080067545 Semiconductor device including field effect transistor and method of forming the same
03/20/2008US20080067544 Method for Producing a Strained Layer on a Substrate and Layered Structure
03/20/2008US20080067543 Method of manufacturing single crystalline gallium nitride thick film
03/20/2008US20080067541 Nitride-based semiconductor device and method of fabricating the same
03/20/2008US20080067537 Support for flip-chip bonding a light emitting chip
03/20/2008US20080067532 Semiconductor Materials and Devices
03/20/2008US20080067531 Light emitting diode having light diffusion member and method for manufacturing the same
03/20/2008US20080067529 Manufacturing a semiconductor device
03/20/2008US20080067528 Liquid crystal display device having touch screen function and method of fabricating the same
03/20/2008US20080067526 Flexible circuits having improved reliability and thermal dissipation
03/20/2008US20080067523 High Electron Mobility Transistor (Hemt) Made of Layers of Group XIII Element Nitrides and Manufacturing Method Thereof
03/20/2008US20080067522 Gallium Nitride-Based Semiconductor Stacked Structure, Production Method Thereof, and Compound Semiconductor and Light-Emitting Device Each Using the Stacked Structure
03/20/2008US20080067520 Organic electro-luminescent display and method of fabricating the same
03/20/2008US20080067519 Display device and method of manufacturing the same
03/20/2008US20080067518 Pixel structure and repairing method thereof
03/20/2008US20080067517 Semiconductor device and method for forming the same
03/20/2008US20080067516 Method for manufacturing a TFT transistor
03/20/2008US20080067515 Method of manufacturing laterally crystallized semiconductor layer and method of manufacturing thin film transistor using the same method
03/20/2008US20080067514 Flat panel display device with polycrystalline silicon thin film transistor
03/20/2008US20080067508 Field-effect transistor and method for manufacturing the same
03/20/2008US20080067501 Spin transistor based on the spin-filter effect, and non-volatile memory using spin transistors
03/20/2008US20080067499 Silicon/germanium superlattice thermal sensor
03/20/2008US20080067498 Method for forming quantum dot, and quantum semiconductor device and method for fabricating the same
03/20/2008US20080067495 Tunnel effect transistors based on silicon nanowires
03/20/2008US20080067431 Pattern writing apparatus using charged particle beam, and program-recorded readable recording medium
03/20/2008US20080067429 Static electricity deflecting device, electron beam irradiating apparatus, substrate processing apparatus, substrate processing method and method of manufacturing substrate
03/20/2008US20080067385 Method and apparatus for processing a micro sample
03/20/2008US20080067334 Image sensor package structure and method for manufacturing the same