Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/06/2008US20080056854 Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
03/06/2008US20080056559 Pattern Inspection Method And Apparatus
03/06/2008US20080056319 Semiconductor laser device and manufacturing method thereof
03/06/2008US20080056044 Semiconductor device and fabrication method thereof
03/06/2008US20080056031 Semiconductor memory
03/06/2008US20080056011 Semiconductor device
03/06/2008US20080056004 NAND Flash Memory Device and Method of Manufacturing and Operating the Same
03/06/2008US20080055974 Semiconductor device
03/06/2008US20080055958 Semiconductor memory device
03/06/2008US20080055872 Printed circuit board and method for manufacturing printed circuit board
03/06/2008US20080055817 Capacitor and method for fabricating the same
03/06/2008US20080055816 Capacitor of Semiconductor Device and Fabrication Method Thereof
03/06/2008US20080055813 Electrostatic chuck, substrate processing apparatus having the same, and substrate processing method using the same
03/06/2008US20080055606 Apparatus and method for inspecting a pattern and method for manufacturing a semiconductor device
03/06/2008US20080055508 Liquid crystal display panel and method for manufacturing the same
03/06/2008US20080055503 Liquid Crystal Display Pixel Structure and Method for Manufacturing the Same
03/06/2008US20080055451 Solid-state imaging device and imaging apparatus
03/06/2008US20080055297 Liquid crystal display device, method of driving the same, and method of fabricating the same
03/06/2008US20080054994 Dual-Gate Metal-Oxide-Semiconductor Device
03/06/2008US20080054916 Probe
03/06/2008US20080054885 Chuck for holding a device under test
03/06/2008US20080054884 Chuck for holding a device under test
03/06/2008US20080054883 Chuck for holding a device under test
03/06/2008US20080054493 Systems and arrangements for interconnecting integrated circuit dies
03/06/2008US20080054492 Semiconductor device and method for manufacturing the same
03/06/2008US20080054490 Flip-Chip Ball Grid Array Strip and Package
03/06/2008US20080054486 Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same
03/06/2008US20080054485 Semiconductor device and fabricating method thereof
03/06/2008US20080054484 Method for protecting an alignment mark
03/06/2008US20080054480 Semiconductor device and fabricating method thereof
03/06/2008US20080054479 Semiconductor device and method of producing the same
03/06/2008US20080054478 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054477 Processing with Reduced Line End Shortening Ratio
03/06/2008US20080054476 Circuitized substrate with increased roughness conductive layer as part thereof
03/06/2008US20080054475 Method of fabricating semiconductor device
03/06/2008US20080054474 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054473 Metal Wiring and Method for Forming the Same
03/06/2008US20080054471 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054470 Semiconductor Device and Method of Fabricating the Same
03/06/2008US20080054469 Electroformed metal structure
03/06/2008US20080054468 Semiconductor device and methods of forming the same
03/06/2008US20080054467 Method for manufacturing a semiconductor device and semiconductor device
03/06/2008US20080054466 Semiconductor device and method of manufacturing semiconductor device
03/06/2008US20080054465 Semiconductor device including fluorine diffusion barrier layer and method for manufacturing the same
03/06/2008US20080054464 Semiconductor Device and Method for Fabricating the Same
03/06/2008US20080054463 Semiconductor apparatus and manufacturing method of semiconductor apparatus
03/06/2008US20080054461 Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor device
03/06/2008US20080054459 Low fabrication cost, fine pitch and high reliability solder bump
03/06/2008US20080054458 Electronic device and method of manufacturing the same
03/06/2008US20080054456 Semiconductor package including silver bump and method for fabricating the same
03/06/2008US20080054455 Semiconductor ball grid array package
03/06/2008US20080054454 Semiconductor device and method for manufacturing semiconductor device
03/06/2008US20080054452 Microelectronic device having a plurality of stacked microelectronic dies and methods for manufacturing such microelectronic assemblies
03/06/2008US20080054445 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
03/06/2008US20080054442 Semiconductor module arrangement and method
03/06/2008US20080054437 Pop package and method of fabricating the same
03/06/2008US20080054436 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054435 Stacked Die Packages
03/06/2008US20080054431 Embedded package in package
03/06/2008US20080054427 Semiconductor devices and manufacturing method therefor
03/06/2008US20080054426 Semiconductor device and manufacturing method thereof
03/06/2008US20080054423 Apparatus and method for packaging circuits
03/06/2008US20080054415 n-channel field effect transistor having a contact etch stop layer in combination with an interlayer dielectric sub-layer having the same type of intrinsic stress
03/06/2008US20080054414 Method of manufacturing semiconductor device having impurity region under isolation region
03/06/2008US20080054413 Self-aligned dual segment liner and method of manufacturing the same
03/06/2008US20080054412 Reduction of carrot defects in silicon carbide epitaxy
03/06/2008US20080054411 Semiconductor device and method for manufacturing the device
03/06/2008US20080054410 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054409 Fabricating method of semiconductor device
03/06/2008US20080054407 Semiconductor device and manufacturing method thereof
03/06/2008US20080054405 Semiconductor devices including resistor elements and related methods
03/06/2008US20080054402 Semiconductor device and method of manufacturing the same
03/06/2008US20080054400 Capacitor and method of manufacturing the same
03/06/2008US20080054398 Method for making high-performance RF integrated circuits
03/06/2008US20080054397 Inductor and method for manufacturing the same
03/06/2008US20080054396 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054395 Semiconductor device and method of manufacturing the semiconductor device
03/06/2008US20080054393 Methods of fabricating passive element without planarizing and related semiconductor device
03/06/2008US20080054389 Planar layer of image sensor, method for manufacturing planer layer, and image sensor including planar layer
03/06/2008US20080054386 Recessed color filter array and method of forming the same
03/06/2008US20080054384 Semiconductor device and method of manufacturing same
03/06/2008US20080054381 Gate electrode of semiconductor device and method of forming same
03/06/2008US20080054380 Semiconductor Device and Method for Manufacturing the Same
03/06/2008US20080054378 Semiconductor apparatus and method of manufacturing the semiconductor apparatus
03/06/2008US20080054377 Semiconductor Device and Method of Manufacturing the Same
03/06/2008US20080054376 Semiconductor and Method for Manufacturing the Same
03/06/2008US20080054375 Threshold voltage adjustment for long-channel transistors
03/06/2008US20080054374 Semiconductor device having fin field effect transistor and manufacturing method thereof
03/06/2008US20080054371 Transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor
03/06/2008US20080054370 Semiconductor device and method of fabricating the same
03/06/2008US20080054369 Semiconductor device with a field stop zone and process of producing the same
03/06/2008US20080054367 Method of forming semiconductor device
03/06/2008US20080054366 CMOS semiconductor device having tensile and compressive stress films
03/06/2008US20080054365 Semiconductor device and manufacturing method therefor
03/06/2008US20080054364 Semiconductor device having cmos device
03/06/2008US20080054363 Dual gate cmos semiconductor device and method for manufacturing the same
03/06/2008US20080054362 Semiconductor device and method of manufacturing the same
03/06/2008US20080054361 Method and apparatus for reducing flicker noise in a semiconductor device
03/06/2008US20080054358 Thin film transistor and method of manufacturing thin film and thin film transistor
03/06/2008US20080054356 Semiconductor device and manufacturing method thereof