Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/10/2008US20080164606 Spacers for wafer bonding
07/10/2008US20080164603 Method and Apparatus for Providing Thermal Management on High-Power Integrated Circuit Devices
07/10/2008US20080164599 Semiconductor module
07/10/2008US20080164598 Semiconductor module
07/10/2008US20080164595 Stackable semiconductor package and the method for making the same
07/10/2008US20080164593 Method of packaging semiconductor devices
07/10/2008US20080164592 Apparatus and method for housing micromechanical systems
07/10/2008US20080164591 Microelectronic component assemblies with recessed wire bonds and methods of making same
07/10/2008US20080164590 Semiconductor power device
07/10/2008US20080164589 Power device package comprising metal tab die attach paddle (dap) and method of fabricating the package
07/10/2008US20080164587 Molding compound flow controller
07/10/2008US20080164586 Thin semiconductor package having stackable lead frame and method of manufacturing the same
07/10/2008US20080164582 Semiconductor devices and methods of manufacture thereof
07/10/2008US20080164581 Electronic device and process for manufacturing the same
07/10/2008US20080164580 Chemical vapor deposition method for the incorporation of nitrogen into materials including germanium and antimony
07/10/2008US20080164579 Process for chemical vapor deposition of materials with via filling capability and structure formed thereby
07/10/2008US20080164577 Patterned silicon submicron tubes
07/10/2008US20080164576 Process for manufacturing a microelectromechanical interaction system for a storage medium
07/10/2008US20080164575 Method for manufacturing a three-dimensional semiconductor device and a wafer used therein
07/10/2008US20080164573 Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density
07/10/2008US20080164572 Semiconductor substrate and manufacturing method thereof
07/10/2008US20080164571 Electronic components produced by a method of separating two layers of material from one another
07/10/2008US20080164570 Zirconium and Hafnium Boride Alloy Templates on Silicon for Nitride Integration Applications
07/10/2008US20080164568 Resistance random access memory and method of manufacturing the same
07/10/2008US20080164565 Semiconductor device and method of manufacturing the same
07/10/2008US20080164564 Micromechanical component having integrated passive electronic components and method for its production
07/10/2008US20080164563 Thin Film Capacitor and Manufacturing Method Therefor
07/10/2008US20080164562 Substrate with embedded passive element and methods for manufacturing the same
07/10/2008US20080164560 Planar Oxidation Method for Producing a Localised Buried Insulator
07/10/2008US20080164559 Integrated assist features for epitaxial growth
07/10/2008US20080164558 Method for fabricating shallow trench isolation structures using diblock copolymer patterning
07/10/2008US20080164557 Semiconductor device and method of forming the same
07/10/2008US20080164548 Low resistance high-tmr magnetic tunnel junction and process for fabrication thereof
07/10/2008US20080164544 Packaging for an interferometric modulator with a curved back plate
07/10/2008US20080164543 Package, in particular for MEMS devices and method of making same
07/10/2008US20080164542 Methods and systems for wafer level packaging of mems structures
07/10/2008US20080164539 Use of f-based gate etch to passivate the high-k/metal gate stack for deep submicron transistor technologies
07/10/2008US20080164538 Nitride read-only memory cell and method of manufacturing the same
07/10/2008US20080164537 Integrated complementary low voltage rf-ldmos
07/10/2008US20080164535 Curved finfets
07/10/2008US20080164533 Method of manufacturing a germanosilicide and a semiconductor device having the germanosilicide
07/10/2008US20080164532 Embedded stressed nitride liners for cmos performance improvement
07/10/2008US20080164531 Dual interlayer dielectric stressor integration with a sacrificial underlayer film stack
07/10/2008US20080164530 Integrated circuits with stress memory effect and fabrication methods thereof
07/10/2008US20080164529 Semiconductor device and manufacturing method thereof
07/10/2008US20080164528 Self-aligned metal-semiconductor alloy and metallization for sub-lithographic source and drain contacts
07/10/2008US20080164527 Semiconductor device and method of manufacturing the same
07/10/2008US20080164526 Method of trimming a hard mask layer, method for fabricating a gate in a mos transistor, and a stack for fabricating a gate in a mos transistor
07/10/2008US20080164525 Structure and Method for Mosfet Gate Electrode Landing Pad
07/10/2008US20080164524 Thin film transistor liquid crystal display device; region in which wiring is formed in the upper end section of the array substrate at up and down direction
07/10/2008US20080164523 Dynamic random access memory cell and manufacturing method thereof
07/10/2008US20080164522 Semiconductor device and manufacturing method thereof
07/10/2008US20080164519 Power Device with Trenches Having Wider Upper Portion than Lower Portion
07/10/2008US20080164517 Semiconductor device and method for making the same
07/10/2008US20080164515 High-density power MOSFET with planarized metalization
07/10/2008US20080164514 Semiconductor device having three-demensional transistor and manufacturing method thereof
07/10/2008US20080164513 Non-volatile semiconductor memory device and a method of fabricating a non-volatile semiconductor memory device
07/10/2008US20080164512 Light erasable memory and method therefor
07/10/2008US20080164511 Semiconductor device
07/10/2008US20080164510 Semiconductor memory devices performing erase operation using erase gate and methods of manufacturing the same
07/10/2008US20080164509 Nonvolatile Memory Devices and Methods of Forming the Same
07/10/2008US20080164507 Area-Efficient Gated Diode Structure and Method of Forming Same
07/10/2008US20080164506 Pn junction and mos capacitor hybrid resurf transistor
07/10/2008US20080164505 Metal-oxide-semiconductor field-effect transistor with electrostatic-discharge protection and voltage-stabilizing capacitor and method for manufacturing the same
07/10/2008US20080164504 Phase change memory device and method for fabricating the same
07/10/2008US20080164503 Ferroelectric Memory Devices Having a Protruding Bottom Electrode and Methods of Forming the Same
07/10/2008US20080164499 Method of manufacturing cmos image sensor
07/10/2008US20080164498 Forming a semiconductor device having a metal electrode and structure thereof
07/10/2008US20080164495 Heterojunction bipolar transistor (hbt) with self-aligned sub-lithographic metal-semiconductor alloy base contacts
07/10/2008US20080164494 Bipolar transistor with silicided sub-collector
07/10/2008US20080164493 Structures containing electrodeposited germanium and methods for their fabrication
07/10/2008US20080164492 Process for transferring a layer of strained semiconductor material
07/10/2008US20080164491 Structure and method for mobility enhanced mosfets with unalloyed silicide
07/10/2008US20080164490 Power semiconductor device
07/10/2008US20080164489 Metalorganic chemical vapor deposittion (MOCVD) growth of high performance non-polar III-nitride optical devices
07/10/2008US20080164487 Ceramic package for led
07/10/2008US20080164485 Light Emitting Device Having A Plurality Of Light Emitting Cells Connected In Series And Method Of Fabricating The Same
07/10/2008US20080164483 Semiconductor Device and Manufacturing Method Thereof, and Liquid Crystal Display Device
07/10/2008US20080164482 Light-Emitting Device and Method for Manufacturing Same
07/10/2008US20080164480 Fabrication of Semiconductor Devices
07/10/2008US20080164479 Semiconductor device including poly-si and method of manufacturing the same
07/10/2008US20080164478 Semiconductor Device and Method of Manufacturing the Same
07/10/2008US20080164477 Thin film transistor, method of fabricating the same, and flat panel display device including the same
07/10/2008US20080164476 METHOD OF MANUFACTURING P-TYPE ZnO SEMICONDUCTOR LAYER USING ATOMIC LAYER DEPOSITION AND THIN FILM TRANSISTOR INCLUDING THE P-TYPE ZnO SEMICONDUCTOR LAYER
07/10/2008US20080164475 Method of forming polysilicon, thin film transistor using the polysilicon, and method of fabricating the thin film transistor
07/10/2008US20080164474 Display Device and Electronic Apparatus
07/10/2008US20080164472 Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof
07/10/2008US20080164471 Thin film transistor substrate and method of producing the same
07/10/2008US20080164470 Tft array substrate and manufacturing method thereof
07/10/2008US20080164459 System and Method For Using Pre-Equilibrium Ballistic Charge Carrier Refraction
07/10/2008US20080164453 Uniform critical dimension size pore for pcram application
07/10/2008US20080164326 Connecting Part For Mounting IC Chip, Antenna Circuit, IC Inlet, IC Tag and Method of Adjusting Capacitance
07/10/2008US20080164298 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
07/10/2008US20080164240 System and method for multi-pulse laser processing
07/10/2008US20080163928 Comprising zinc, tellurium, manganese; photovoltaically active semiconductor material consists of a metal halide comprising a metal selected from germanium, tin, antimony, bismuth and copper and a halogen selected from fluorine, chlorine, bromine and iodine
07/10/2008US20080163818 Substrate heating apparatus and purging method thereof
07/10/2008US20080163816 Apparatus For Forming Thin Film
07/10/2008US20080163813 Anneal of epitaxial layer in a semiconductor device
07/10/2008US20080163481 Component mounting apparatus and component mounting method
07/10/2008DE69738172T2 Eine integrierte Schaltung auf einem ultrabiegsamen Substrat und ein Verfahren für eine Drahtverbindung zwischen einer integrierten Schaltung und einem ultrabiegsamen Substrat An integrated circuit on a substrate and a method for ultrabiegsamen a wire connection between a integrated circuit and a substrate ultrabiegsamen