| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/03/2008 | WO2008078501A1 Film forming apparatus and method of forming film |
| 07/03/2008 | WO2008078500A1 Film deposition apparatus and film deposition method |
| 07/03/2008 | WO2008078478A1 Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device |
| 07/03/2008 | WO2008078447A1 Photoresist composition and pattern formation method |
| 07/03/2008 | WO2008078410A1 Process for producing polymer for semiconductor lithography |
| 07/03/2008 | WO2008078405A1 Probe inspecting device, displacement correcting method, information processor, information processing method, and program |
| 07/03/2008 | WO2008078404A1 Silicon epitaxial wafer and its manufacturing method, semiconductor device manufacturing method, and soi wafer manufacturing method |
| 07/03/2008 | WO2008078401A1 Method for producing self-supporting nitride semiconductor substrate and self-supporting nitride semiconductor substrate |
| 07/03/2008 | WO2008078363A1 Process for producing semiconductor device and semiconductor device |
| 07/03/2008 | WO2008078301A2 Iii-nitride light emitting devices grown on tempaltes to reduce strain |
| 07/03/2008 | WO2008078185A2 Antireflective coating compositions |
| 07/03/2008 | WO2008078133A1 Method for producing a semiconductor-on-insulator structure |
| 07/03/2008 | WO2008078132A1 Method for producing a semiconductor-on-insulator structure |
| 07/03/2008 | WO2008077796A1 A method of fabricating a mixed substrate |
| 07/03/2008 | WO2008061101A3 Method and apparatus for localized bonding |
| 07/03/2008 | WO2008061031B1 Methods of etching a pattern layer to form staggered heights therein and intermediate semiconductor device structures |
| 07/03/2008 | WO2008058851A3 Method for setting up an automatic machine for mounting semiconductor chips |
| 07/03/2008 | WO2008057837A9 Systems and methods to passivate on-die redistribution interconnects |
| 07/03/2008 | WO2008057692A3 System and method for providing a nanoscale, highly selective, and thermally resilient boron etch-stop |
| 07/03/2008 | WO2008057454A3 Growth and manufacture of reduced dislocation density and free-standing aluminum nitride films by hydride vapor phase epitaxy |
| 07/03/2008 | WO2008055007A3 Methods of fabricating a barrier layer with varying composition for copper metallization |
| 07/03/2008 | WO2008052528A3 Method and device for patterning components using a material based on silicon oxide |
| 07/03/2008 | WO2008051880A3 Method and apparatus for sample extraction and handling |
| 07/03/2008 | WO2008049019A3 Copper deposition for filling features in manufacture of microelectronic devices |
| 07/03/2008 | WO2008048925A3 Wafer via formation |
| 07/03/2008 | WO2008048786A3 Fabrication of ccd image sensors using single layer polysilicon |
| 07/03/2008 | WO2008048704A3 Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices |
| 07/03/2008 | WO2008048303A3 Group iii nitride articles and methods for making same |
| 07/03/2008 | WO2008042200A3 Acceleration sensor with redundant accelerometers |
| 07/03/2008 | WO2008042199A3 Particles sensor integrated with substrate |
| 07/03/2008 | WO2008039471A3 Masking of and material constraint for depositing battery layers on flexible substrates |
| 07/03/2008 | WO2008039372A3 Assembling and applying nano-electro-mechanical systems |
| 07/03/2008 | WO2008038249A3 Process for preparing a semiconductor structure for mounting and mounted optoelectronic semiconductor structure |
| 07/03/2008 | WO2008038236A3 A multi-transistor based non-volatile memory cell with dual threshold voltage |
| 07/03/2008 | WO2008035270A3 Method of manufacturing a vertical contact in a semiconductor substrate |
| 07/03/2008 | WO2008024991A3 Er doped iii-nitride materials and devices synthesized by mocvd |
| 07/03/2008 | WO2008022097A3 Methods for forming patterned structures |
| 07/03/2008 | WO2008020009A3 Method for picking and placing semiconductor chips and pick-and-place robot |
| 07/03/2008 | WO2008016437A3 Methods and apparatus for efficiently generating profiles for circuit board work/rework |
| 07/03/2008 | WO2008015533A3 Porous dielectric layers obtained from pore -forming precursors |
| 07/03/2008 | WO2008008581A3 An electronics package with an integrated circuit device having post wafer fabrication integrated passive components |
| 07/03/2008 | WO2008005756B1 Apparatus for substrate processing and methods therefor |
| 07/03/2008 | WO2007127670A3 Buffer-layer treatment of mocvd-grown nitride structures |
| 07/03/2008 | WO2007124472A3 Patterning sub-lithographic features with variable widths |
| 07/03/2008 | WO2007109658A3 Shared metallic source/drain cmos circuits and methods thereof |
| 07/03/2008 | WO2006060554A3 A micro-fluid ejection head containing reentrant fluid feed slots |
| 07/03/2008 | US20080163139 Method, system, and computer program product for preparing multiple layers of semiconductor substrates for electronic designs |
| 07/03/2008 | US20080162781 Method, apparatus, and system for flash memory |
| 07/03/2008 | US20080162065 Pattern inspection apparatus |
| 07/03/2008 | US20080160905 Exhaust unit, exhausting method, and semiconductor manufacturing facility with the exhaust unit |
| 07/03/2008 | US20080160895 Atmosphere control apparatus, device-manufacturing apparatus, device-manufacturing method, and exposure apparatus |
| 07/03/2008 | US20080160789 Laser patterning of encapsulated organic light emitting diodes |
| 07/03/2008 | US20080160788 Polishing the front surface of a wafer wherethe polishing sp does not reduce the roughnesst to below >1.5 A as measured with by scanning followed by thermal annealing the polished wafer at a temperature of >1050 degrees C. for 5 minutes in an atmosphere of an inert gas and/or hydrogen; efficiency |
| 07/03/2008 | US20080160787 Method For Manufacturing a Thin-Layer Structure |
| 07/03/2008 | US20080160786 Method for increasing film stress and method for forming high stress layer |
| 07/03/2008 | US20080160785 Method Of Forming Oxide Layer In Semiconductor Device |
| 07/03/2008 | US20080160784 Method of manufacturing semiconductor device |
| 07/03/2008 | US20080160783 Method For Manufacturing Semiconductor Device |
| 07/03/2008 | US20080160782 Method for forming insulating film |
| 07/03/2008 | US20080160781 Substrate processing method, substrate processing system, and computer-readable storage medium |
| 07/03/2008 | US20080160780 Forming a charge pattern on the surface of a stamp layer by plasma enhanced vapor deposition;applying the treated stamp layer to a surface of a substrate to form a charge pattern on the surface of the substrate; separating the stamp layer; electrets; electrography; miniaturization; semiconductors |
| 07/03/2008 | US20080160779 By-die-exposure for patterning of holes in edge die |
| 07/03/2008 | US20080160778 Method for forming pattern using hard mask |
| 07/03/2008 | US20080160777 Cleaning Method For Processing Chamber Of Semiconductor Substrates And Etching Method For Silicon Substrates Technical Field |
| 07/03/2008 | US20080160776 Plasma-enhanced substrate processing method and apparatus |
| 07/03/2008 | US20080160775 Method and apparatus for processing a substrate using plasma |
| 07/03/2008 | US20080160774 Method for fabricating semiconductor device |
| 07/03/2008 | US20080160773 Method of fabricating semiconductor device |
| 07/03/2008 | US20080160772 Method for forming fine pattern in semiconductor device |
| 07/03/2008 | US20080160771 Etching method using hard mask in semiconductor device |
| 07/03/2008 | US20080160770 Method for manufacturing semiconductor device |
| 07/03/2008 | US20080160769 Method for fabricating semiconductor device with recess gate |
| 07/03/2008 | US20080160768 Method of manufacturing gate dielectric layer |
| 07/03/2008 | US20080160767 Semiconductor Device And Method For Forming Pattern In The Same |
| 07/03/2008 | US20080160766 Method for fabricating bulb-shaped recess pattern |
| 07/03/2008 | US20080160765 Method for forming pattern in semiconductor device |
| 07/03/2008 | US20080160764 Method for improved planarization in semiconductor devices |
| 07/03/2008 | US20080160763 Semiconductor Device And Method For Forming Pattern In The Same |
| 07/03/2008 | US20080160762 Method for the protection of metal layers against external contamination |
| 07/03/2008 | US20080160761 Method of modifying a surface and a method of forming an area of a functional liquid on the modified surface |
| 07/03/2008 | US20080160760 Method of Forming Contact Plug in Semiconductor |
| 07/03/2008 | US20080160759 Method for fabricating landing plug contact in semiconductor device |
| 07/03/2008 | US20080160758 Method of manufacturing semiconductor device |
| 07/03/2008 | US20080160757 Semiconductor device fabricating method |
| 07/03/2008 | US20080160756 Method of manufacturing opening and via opening |
| 07/03/2008 | US20080160755 Method of Forming Interconnection of Semiconductor Device |
| 07/03/2008 | US20080160754 Method for fabricating a microelectronic conductor structure |
| 07/03/2008 | US20080160753 Method of forming metal wire in semiconductor device |
| 07/03/2008 | US20080160752 Method for chip to package interconnect |
| 07/03/2008 | US20080160751 Microelectronic die including solder caps on bumping sites thereof and method of making same |
| 07/03/2008 | US20080160750 Method of manfacturing semiconcudtor device |
| 07/03/2008 | US20080160749 Semiconductor device and method of forming thereof |
| 07/03/2008 | US20080160748 Method of Forming Dielectric Layer of Flash Memory Device |
| 07/03/2008 | US20080160747 Method of forming a gate of a semiconductor device |
| 07/03/2008 | US20080160746 Method for fabricating semiconductor device with gate stack structure |
| 07/03/2008 | US20080160745 Method For Fabricating A Dual Poly Gate In Semiconductor Device |
| 07/03/2008 | US20080160744 Method for fabricating semiconductor device and improving thin film uniformity |
| 07/03/2008 | US20080160743 Composition for cleaning substrates and method of forming gate using the composition |
| 07/03/2008 | US20080160742 Method for fabricating semiconductor device with recess gate |
| 07/03/2008 | US20080160741 Method of manufacturing semiconductor device |