Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/03/2008US20080160740 Method For Manufacturing Semiconductor Device
07/03/2008US20080160739 Method for fabricating semiconductor device
07/03/2008US20080160738 Method for fabricating semiconductor device
07/03/2008US20080160737 Method for forming metal pattern and method for forming gate electrode in semiconductor device using the same
07/03/2008US20080160736 Lanthanide series metal implant to control work function of metal gate electrodes
07/03/2008US20080160735 Forming Polysilicon Regions
07/03/2008US20080160734 Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
07/03/2008US20080160733 Stable dispersion of nanoparticles in liquid having a concentration of 0.1-20 weight percent; average particle size of <100nm and viscosity of 0.1-100 mPa; heating a deposit in contact with substrate surface to drive into the substrate; patterns; photoelectric cells; solar cells; quality; uniformity
07/03/2008US20080160732 Method for the Production of a Buried Stop Zone in a Semiconductor Component and Semiconductor Component Comprising a Buried Stop Zone
07/03/2008US20080160731 Method for fabricating cmos image sensor
07/03/2008US20080160730 Method of ion implantation and method of fabricating a semiconductor device
07/03/2008US20080160729 Technique for removing resist material after high dose implantation in a semiconductor device
07/03/2008US20080160728 Method for introducing impurities and apparatus for introducing impurities
07/03/2008US20080160727 Silicon-on-Insulator Chip with Multiple Crystal Orientations
07/03/2008US20080160726 Methods of fabricating semiconductor devices including channel layers having improved defect density and surface roughness characteristics
07/03/2008US20080160725 Semiconductor die pick up apparatus and method thereof
07/03/2008US20080160724 Method of dicing
07/03/2008US20080160723 Method of fabricating silicon/dielectric multi-layer semiconductor structures using layer transfer technology and also a three-dimensional multi-layer semiconductor device and stacked layer type image sensor using the same method, and a method of manufacturing a three-dimensional multi-layer semiconductor device and the stack type image sensor
07/03/2008US20080160722 Method for manufacturing semiconductor device
07/03/2008US20080160721 Method For Fabricating Isolation Film In Semiconductor Device
07/03/2008US20080160720 Method for forming trench isolation
07/03/2008US20080160719 Methods of forming shallow trench isolation structures in semiconductor devices
07/03/2008US20080160718 Method for fabricating isolation layer in semiconductor device
07/03/2008US20080160717 Method of Forming Trench in Semiconductor Device
07/03/2008US20080160716 Method for fabricating an isolation layer in a semiconductor device
07/03/2008US20080160715 Method of forming a device isolation film of a semiconductor device
07/03/2008US20080160714 Method of forming semiconductor device
07/03/2008US20080160713 Simultaneously forming high-speed and low-power memory devices on a single substrate
07/03/2008US20080160712 Multiple-layer dielectric layer and method for fabricating capacitor including the same
07/03/2008US20080160711 Contactless flash memory array
07/03/2008US20080160710 Method of fabricating mosfet device
07/03/2008US20080160709 Advanced activation approach for MOS devices
07/03/2008US20080160708 Sidewall spacer pullback scheme
07/03/2008US20080160707 Method for fabricating sesmiconductor device
07/03/2008US20080160706 Method for fabricating semiconductor device
07/03/2008US20080160705 Gate etch process for a high-voltage FET
07/03/2008US20080160704 Ion implantation method for high voltage device
07/03/2008US20080160703 Method for Manufacturing Semiconductor Device
07/03/2008US20080160702 Method of manufacturing semiconductor device
07/03/2008US20080160701 Method of Fabricating Trench Gate Type MOSFET Device
07/03/2008US20080160700 Method For Manufacturing Semiconductor Device Having Bulb-Type Recessed Channel
07/03/2008US20080160699 Method for Fabricating Semiconductor Device Having Bulb-Type Recessed Channel
07/03/2008US20080160698 Method for fabricating a semiconductor device
07/03/2008US20080160697 Metal-oxide-semiconductor transistor and method of manufacturing the same
07/03/2008US20080160696 Method for fabricating flash memory device
07/03/2008US20080160695 Method of fabricating semiconductor device
07/03/2008US20080160694 Method for forming flash memory device
07/03/2008US20080160693 Methods of forming non-volatile memory device
07/03/2008US20080160692 Method for Manufacturing Flash Memory Device
07/03/2008US20080160691 Fabricating Method of Semiconductor Device
07/03/2008US20080160690 Flash memory device and method for fabricating the same
07/03/2008US20080160689 Three-Dimensional Control-Gate Architecture For Single Poly EPROM Memory Devices Fabricated In Planar CMOS Technology
07/03/2008US20080160688 Methods for fabricating an integrated circuit
07/03/2008US20080160687 Method and resulting structure for fabricating dram capacitor structure
07/03/2008US20080160686 Semiconductor device and method of manufacturing same
07/03/2008US20080160685 Semiconductor device with surge current protection and method of making the same
07/03/2008US20080160684 Method of fabricating multi-gate transistor and multi-gate transistor fabricated thereby
07/03/2008US20080160683 Source/drain extensions in nmos devices
07/03/2008US20080160682 Semiconductor device having fuse circuit on cell region and method of fabricating the same
07/03/2008US20080160681 Manufacture including shield structure
07/03/2008US20080160680 Methods of fabricating shield plates for reduced field coupling in nonvolatile memory
07/03/2008US20080160679 Apparatus and Methods for Encapsulating Microelectromechanical (MEM) Devices on a Wafer Scale
07/03/2008US20080160678 Method for fabricating semiconductor package
07/03/2008US20080160677 Method of Forming Component Package
07/03/2008US20080160676 Heat Transfer Structures
07/03/2008US20080160675 Microelectronic package with thermal access
07/03/2008US20080160674 Method of making a semiconductor device having multiple die redistribution layer
07/03/2008US20080160673 Assembly of thin die coreless package
07/03/2008US20080160672 Method for manufacturing semiconductor device
07/03/2008US20080160671 Ball-mounting method for coplanarity improvement in large package
07/03/2008US20080160670 Physical alignment features on integrated circuit devices for accurate die-in-substrate embedding
07/03/2008US20080160667 Fabricating method of image sensor
07/03/2008US20080160661 Method and structure for fabricating solar cells using a layer transfer process
07/03/2008US20080160659 Pressure transducer diaphragm and method of making same
07/03/2008US20080160657 method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same
07/03/2008US20080160656 Addressable hierarchical metal wire test methodology
07/03/2008US20080160655 Method of verifying line reliability and method of manufacturing semiconductor device
07/03/2008US20080160654 Method of testing an integrity of a material layer in a semiconductor structure
07/03/2008US20080160653 Method for fabricating a semiconductor device
07/03/2008US20080160652 Two-step method for etching a fuse window on a semiconductor substrate
07/03/2008US20080160651 Recessing trench to target depth using feed forward data
07/03/2008US20080160650 System and method for controlling an electrochemical etch process
07/03/2008US20080160649 Method for Manufacturing Semiconductor Device
07/03/2008US20080160648 Establishing Correspondence and Traceability Between Wafers and Solar Cells
07/03/2008US20080160647 Thick oxide film for wafer backside prior to metalization loop
07/03/2008US20080160645 Semiconductor device and method of fabricating the same
07/03/2008US20080160644 Method and structure for improved alignment in mram integration
07/03/2008US20080160643 Magnetic Random Access Memory Cells Having Split Subdigit Lines Having Cladding Layers Thereon and Methods of Fabricating the Same
07/03/2008US20080160642 Semiconductor device
07/03/2008US20080160641 Multi-state thermally assisted storage
07/03/2008US20080160640 Top contact alignment in semiconductor devices
07/03/2008US20080160431 Focused ion beam patterning then transferring to second layer; conformal coverage and very fine critical feature control; direct write semiconductor manufacturing
07/03/2008US20080160428 Method for repairing bridge in photo mask
07/03/2008US20080160315 Connect microelectronic circuitry; solid component heat curable at a first temperature; a liquid component, which is either heat curable at a second temperature or curable upon exposure to radiation in the electromagnetic spectrum; and a heat cure catalyst for the solid curable component
07/03/2008US20080160293 Heat-Peelable Pressure-Sensitive Adhesive Sheet and Method for Processing Adherend Using the Heat-Peelable Pressure-Sensitive Adhesive Sheet
07/03/2008US20080160235 Clean container having elastic positioning structure
07/03/2008US20080160214 Substrate processing apparatus
07/03/2008US20080159939 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element
07/03/2008US20080159833 Printed circuit board transferring apparatus for chip mounter and printed circuit board transferring method using the same
07/03/2008US20080158995 Flash EEPROM System