| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/03/2008 | US20080158944 Nonvolatile memory device and method for fabricating the same |
| 07/03/2008 | US20080158943 Method of fabricating an integrated circuit having a memory including a low-k dielectric material |
| 07/03/2008 | US20080158942 Memory having storage locations within a common volume of phase change material |
| 07/03/2008 | US20080158842 Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate |
| 07/03/2008 | US20080158841 Printed circuit board and method for manufacturing printed circuit board |
| 07/03/2008 | US20080158838 Printed circuit board and method for manufacturing printed circuit board |
| 07/03/2008 | US20080158775 Semiconductor device and method for fabricating the same |
| 07/03/2008 | US20080158667 Sample observation method, microscope, and solid immersion lens, optical contact liquid used in the method |
| 07/03/2008 | US20080158534 Assembly |
| 07/03/2008 | US20080158519 Laminated Micromirror Package |
| 07/03/2008 | US20080158449 Electric field reduction in display device |
| 07/03/2008 | US20080158282 Method and Apparatus For Accurately Applying Structures to a Substrate |
| 07/03/2008 | US20080158090 Integrated coupler |
| 07/03/2008 | US20080157897 Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules |
| 07/03/2008 | US20080157790 Stiffener assembly for use with testing devices |
| 07/03/2008 | US20080157787 Sensitivity capacitive sensor |
| 07/03/2008 | US20080157455 Compliant substrate holding assembly |
| 07/03/2008 | US20080157406 Recyclable stamp device and recyclable stamp process for wafer bond |
| 07/03/2008 | US20080157405 Chip stack with precision alignment, high yield assembly and thermal conductivity |
| 07/03/2008 | US20080157404 Trench structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
| 07/03/2008 | US20080157403 Semocondutor device having multiple-layer hard mask with opposite stresses and method for fabricating the same |
| 07/03/2008 | US20080157399 Pmd layer of semiconductor device |
| 07/03/2008 | US20080157397 Flip-chip packages and methods of manufacturing the same |
| 07/03/2008 | US20080157395 Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers |
| 07/03/2008 | US20080157394 Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages |
| 07/03/2008 | US20080157391 RF semiconductor devices and methods for fabricating the same |
| 07/03/2008 | US20080157390 Method of forming low-k dielectric layer and structure thereof |
| 07/03/2008 | US20080157388 Semiconductor Device and Fabricating Method Thereof |
| 07/03/2008 | US20080157387 Semiconductor device and method of fabricating the same |
| 07/03/2008 | US20080157386 Semiconductor Device Having Dummy Pattern and the Method for Fabricating the Same |
| 07/03/2008 | US20080157385 IC package with integral vertical passive delay cells |
| 07/03/2008 | US20080157384 Alignment Key of Semiconductor Device and Method of Manufacturing the Same |
| 07/03/2008 | US20080157381 Semiconductor integrated circuit |
| 07/03/2008 | US20080157380 Method for forming metal interconnection of semiconductor device |
| 07/03/2008 | US20080157379 Semiconductor device having metal wiring and method for fabricating the same |
| 07/03/2008 | US20080157378 Semiconductor device, and method of manufacturing same |
| 07/03/2008 | US20080157377 Semiconductor device and fabricating method thereof |
| 07/03/2008 | US20080157376 Semiconductor Device and Method for Manufacturing the Same |
| 07/03/2008 | US20080157375 Semiconductor device having a metal interconnection and method of fabricating the same |
| 07/03/2008 | US20080157374 Semiconductor device and fabricating method thereof |
| 07/03/2008 | US20080157373 Metal Line of Semiconductor Device and Method of Forming the Same |
| 07/03/2008 | US20080157372 Metal Line of Semiconductor Device and Manufacturing Method Thereof |
| 07/03/2008 | US20080157371 Metal Line of Semiconductor Device and Method of Manufacturing the Same |
| 07/03/2008 | US20080157370 Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same |
| 07/03/2008 | US20080157369 Multi-layered metal line of semiconductor device for preventing diffusion between metal lines and method for forming the same |
| 07/03/2008 | US20080157368 Multi-layered metal line of semiconductor device having excellent diffusion barrier and method for forming the same |
| 07/03/2008 | US20080157367 Multi-layer metal wiring of semiconductor device preventing mutual metal diffusion between metal wirings and method for forming the same |
| 07/03/2008 | US20080157366 Semiconductor device and fabricating method thereof |
| 07/03/2008 | US20080157365 Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate, and method therefor |
| 07/03/2008 | US20080157364 Fan-out, display substrate having the same and method for manufacturing the display substrate |
| 07/03/2008 | US20080157362 Method to reduce UBM undercut |
| 07/03/2008 | US20080157361 Semiconductor components having through interconnects and methods of fabrication |
| 07/03/2008 | US20080157360 Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same |
| 07/03/2008 | US20080157358 Wafer level package with die receiving through-hole and method of the same |
| 07/03/2008 | US20080157357 Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same |
| 07/03/2008 | US20080157356 Methods of forming stepped bumps and structures formed thereby |
| 07/03/2008 | US20080157354 Multiple stacked nanostructure arrays and methods for making the same |
| 07/03/2008 | US20080157352 Reducing underfill keep out zone on substrate used in electronic device processing |
| 07/03/2008 | US20080157351 Semiconductor device fabricating method |
| 07/03/2008 | US20080157350 Package on package design to improve functionality and efficiency |
| 07/03/2008 | US20080157348 Thermal interface material with hotspot heat remover |
| 07/03/2008 | US20080157346 Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto |
| 07/03/2008 | US20080157345 Curved heat spreader design for electronic assemblies |
| 07/03/2008 | US20080157342 Package with a marking structure and method of the same |
| 07/03/2008 | US20080157341 RF module package |
| 07/03/2008 | US20080157340 RF module package |
| 07/03/2008 | US20080157338 Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device |
| 07/03/2008 | US20080157336 Wafer level package with die receiving through-hole and method of the same |
| 07/03/2008 | US20080157335 Strip patterned transmission line |
| 07/03/2008 | US20080157333 Chip package and manufacturing method thereof |
| 07/03/2008 | US20080157332 Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages |
| 07/03/2008 | US20080157331 Semiconductor device and method of manufacturing the same |
| 07/03/2008 | US20080157328 Semiconductor device and method for manufacturing same |
| 07/03/2008 | US20080157327 Package on package structure for semiconductor devices and method of the same |
| 07/03/2008 | US20080157326 Ic package and method of manufacturing the same |
| 07/03/2008 | US20080157325 Integrated circuit package with molded cavity |
| 07/03/2008 | US20080157324 Stacked die package with die interconnects |
| 07/03/2008 | US20080157323 Stacked packages |
| 07/03/2008 | US20080157322 Double side stacked die package |
| 07/03/2008 | US20080157320 Laterally Interconnected IC Packages and Methods |
| 07/03/2008 | US20080157319 Mountable integrated circuit package-in-package system with adhesive spacing structures |
| 07/03/2008 | US20080157318 Bridge stack integrated circuit package-on-package system |
| 07/03/2008 | US20080157308 Multi-Die Semiconductor Package Structure and Method for Manufacturing the Same |
| 07/03/2008 | US20080157302 Stacked-package quad flat null lead package |
| 07/03/2008 | US20080157301 Leadframe package for mems microphone assembly |
| 07/03/2008 | US20080157300 Thermally Enhanced IC Package and Method |
| 07/03/2008 | US20080157299 Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads |
| 07/03/2008 | US20080157297 Stress-Resistant Leadframe and Method |
| 07/03/2008 | US20080157295 Methods and apparatus for multichip module packaging |
| 07/03/2008 | US20080157293 Semiconductor device and fabrication method thereof |
| 07/03/2008 | US20080157292 High-stress liners for semiconductor fabrication |
| 07/03/2008 | US20080157291 Packaging implementation while mitigating threshold voltage shifting |
| 07/03/2008 | US20080157290 Method for fabricating semiconductor device |
| 07/03/2008 | US20080157289 Method to achieve a low cost transistor isolation dielectric process module with improved process control, process cost, and yield potential |
| 07/03/2008 | US20080157288 Semiconductor device and method of fabricating semiconductor device |
| 07/03/2008 | US20080157287 Semiconductor devices and methods of forming the same |
| 07/03/2008 | US20080157284 Guard ring extension to prevent reliability failures |
| 07/03/2008 | US20080157283 Template for three-dimensional thin-film solar cell manufacturing and methods of use |
| 07/03/2008 | US20080157282 attaching a metal to the penetrating pit or the penetrating crack of a free-standing substrate of a nitride semiconductor, the metal being adapted to be nitrided, and nitriding the metal to form a nitride that seals the penetrating pit or the penetrating crack |
| 07/03/2008 | US20080157280 Bjt and method for fabricating the same |