| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/17/2008 | US20080169574 Direct Die Attachment |
| 07/17/2008 | US20080169572 INTERCONNECT STRUCTURE ENCASED WITH HIGH AND LOW k INTERLEVEL DIELECTRICS |
| 07/17/2008 | US20080169571 Semiconductor device and method for manufacturing the same |
| 07/17/2008 | US20080169570 Method for manufacturing a semiconductor device using a reflow sputtering technique |
| 07/17/2008 | US20080169568 Structure and method of making interconnect element having metal traces embedded in surface of dielectric |
| 07/17/2008 | US20080169566 Press-Fit Diode Having a Silver-Plated Wire Termination |
| 07/17/2008 | US20080169565 Metal capping process for beol interconnect with air gaps |
| 07/17/2008 | US20080169563 Semiconductor package and method of manufacturing the same |
| 07/17/2008 | US20080169562 Semiconductor device having conductive bumps and fabrication method thereof |
| 07/17/2008 | US20080169559 Bump structure with annular support and manufacturing method thereof |
| 07/17/2008 | US20080169558 Redistribution circuit structure and manufacturing method thereof |
| 07/17/2008 | US20080169555 Anchor structure for an integrated circuit |
| 07/17/2008 | US20080169553 Fabrication of a Micro-Electromechanical System (Mems) Device From a Complementary Metal Oxide Semiconductor (Cmos) |
| 07/17/2008 | US20080169552 Semiconductor device and programming method |
| 07/17/2008 | US20080169548 Semiconductor package having a semiconductor chip in a substrate and method of fabricating the same |
| 07/17/2008 | US20080169546 Stack type semiconductor chip package having different type of chips and fabrication method thereof |
| 07/17/2008 | US20080169545 Stacked structure of semiconductor devices, semiconductor device package, and methods of fabricating the same |
| 07/17/2008 | US20080169544 Semiconductor device and method of fabricating the same |
| 07/17/2008 | US20080169542 Semiconductor device and manufacturing method thereof |
| 07/17/2008 | US20080169541 Enhanced durability multimedia card |
| 07/17/2008 | US20080169539 Under bump metallurgy structure of a package and method of making same |
| 07/17/2008 | US20080169537 Semiconductor device |
| 07/17/2008 | US20080169536 Semiconductor device and signal terminating method thereof |
| 07/17/2008 | US20080169535 Sub-lithographic faceting for mosfet performance enhancement |
| 07/17/2008 | US20080169534 Reduced defect silicon or silicon germanium deposition in micro-features |
| 07/17/2008 | US20080169532 III Nitride Single Crystal, and Manufacturing Method Therefor and Semiconductor Device Therewith |
| 07/17/2008 | US20080169531 Methods of forming nano line structures in microelectronic devices and related devices |
| 07/17/2008 | US20080169530 X8R Dielectric Composition For Use With Nickel Electrodes |
| 07/17/2008 | US20080169528 Subground rule sti fill for hot structure |
| 07/17/2008 | US20080169527 Semiconductor Device And Method Of Manufacturing Such A Device |
| 07/17/2008 | US20080169523 Element having a refractive index that varies between its optical axis and its periphery, over an annular part; tablet in front of the semiconductor sensor or a lens in front of the semiconductor sensor |
| 07/17/2008 | US20080169522 Moving element and method of manufacturing the same |
| 07/17/2008 | US20080169521 MEMS structure using carbon dioxide and method of fabrication |
| 07/17/2008 | US20080169520 Dieletric film layered product, semiconductor apparatus and production methods of the same |
| 07/17/2008 | US20080169519 Process for manufacturing a power device on a semiconductor substrate and corresponding device |
| 07/17/2008 | US20080169518 Semiconductor structure with field shield and method of forming the structure. |
| 07/17/2008 | US20080169517 Method for manufacturing electronic devices integrated in a semiconductor substrate and corresponding devices |
| 07/17/2008 | US20080169515 Semiconductor devices and methods of forming the same |
| 07/17/2008 | US20080169513 Emitter Ballasting by Contact Area Segmentation in ESD Bipolar Based Semiconductor Component |
| 07/17/2008 | US20080169512 Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow |
| 07/17/2008 | US20080169511 Dual Gate Cmos Fabrication |
| 07/17/2008 | US20080169510 Performance enhancement on both nmosfet and pmosfet using self-aligned dual stressed films |
| 07/17/2008 | US20080169508 Stressed soi fet having doped glass box layer |
| 07/17/2008 | US20080169505 Structure of Trench MOSFET and Method for Manufacturing the same |
| 07/17/2008 | US20080169504 Semiconductor constructions, methods of forming semiconductor constructions, and methods of recessing materials within openings |
| 07/17/2008 | US20080169503 Semiconductor nanostructures, semiconductor devices, and methods of making same |
| 07/17/2008 | US20080169501 Flash memory device with hybrid structure charge trap layer and method of manufacturing same |
| 07/17/2008 | US20080169499 Flash memory using sti structure in element isolation region and manufacturing method thereof |
| 07/17/2008 | US20080169496 Methods of forming NAND cell units |
| 07/17/2008 | US20080169495 Fin differential mos varactor diode |
| 07/17/2008 | US20080169493 Semiconductor devices and dynamic random access memories having a retrograde region and methods of forming the same |
| 07/17/2008 | US20080169488 Device selection circuitry constructed with nanotube technology |
| 07/17/2008 | US20080169485 Field effect transistor device and method of producing the same |
| 07/17/2008 | US20080169483 Substrate having thin film of GaN joined thereon and method of fabricating the same, and a GaN-based semiconductor device and method of fabricating the same |
| 07/17/2008 | US20080169482 Semiconductor light emitting device and a method for manufacturing the same |
| 07/17/2008 | US20080169477 Package structure for optoelectronic device and fabrication method thereof |
| 07/17/2008 | US20080169474 Integrated Nitride and Silicon Carbide-Based Devices and Methods of Fabricating Integrated Nitride-Based Devices |
| 07/17/2008 | US20080169473 Thin film transistor array panel |
| 07/17/2008 | US20080169472 Gate and an elongated semiconductor body where a center region spirals around the gate and end regions extend outward; transistor size can be scaled without decreasing the effective channel length to the point where deleterious short-channel effects are exhibited |
| 07/17/2008 | US20080169471 Display substrate and method of manufacturing the same |
| 07/17/2008 | US20080169470 Thin film transistor array substrate and method of manufacturing the same |
| 07/17/2008 | US20080169468 Method and Apparatus For Fabricating Polycrystalline Silicon Film Using Transparent Substrate |
| 07/17/2008 | US20080169466 Test Cells for semiconductor yield improvement |
| 07/17/2008 | US20080169465 Semiconductor probe structure using impact-ionization metal oxide semiconductor device, information storing device therewith and manufacturing method thereof |
| 07/17/2008 | US20080169461 Display device and method of manufacturing the same |
| 07/17/2008 | US20080169269 Method for processing wafer in reaction chamber |
| 07/17/2008 | US20080169123 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 07/17/2008 | US20080169121 Printed wiring board unit for method of detecting rising level of electrically-conductive body in bore |
| 07/17/2008 | US20080169120 Printed circuit board and method of manufacturing printed ciruit board |
| 07/17/2008 | US20080169064 Surface-treating apparatus |
| 07/17/2008 | US20080169008 Enhanced wafer cleaning method |
| 07/17/2008 | US20080168947 Gas-purged vacuum valve |
| 07/17/2008 | US20080168945 Plasma generating apparatus |
| 07/17/2008 | US20080168649 Magnetic recording element and method of manufacturing magnetic recording element |
| 07/17/2008 | DE60222663T2 Zweilagige schutzschicht Two layers of protection layer |
| 07/17/2008 | DE112006002267T5 Transistor, Verfahren zu seiner Herstellung und Halbleiterbauelement mit einem solchen Transistor Transistor, method of producing the semiconductor device and with such a transistor |
| 07/17/2008 | DE112005001223T5 Sondenbaugruppe Probe assembly |
| 07/17/2008 | DE112005000394B4 Halbleiterbauelement mit Mehrgatestruktur und Verfahren zu seiner Herstellung A semiconductor device comprising multi-gate structure and process for its preparation |
| 07/17/2008 | DE112004001234T5 Polymer-Speichervorrichtung Polymer memory device |
| 07/17/2008 | DE10235981B4 Teilchenoptische Vorrichtung und Elektronenmikroskop A particle-optical and electron microscope |
| 07/17/2008 | DE102008003160A1 Wafer Level Package (WLP) mit Die-Aufnahmebohrung und Verfahren zu deren Herstellung Wafer Level Package (WLP) using the receiving bore and processes for their preparation |
| 07/17/2008 | DE102007063551A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 07/17/2008 | DE102007063341A1 Wafer Level Package (WLP) mit Die-Aufnahmebohrung und Verfahren zu deren Herstellung Wafer Level Package (WLP) using the receiving bore and processes for their preparation |
| 07/17/2008 | DE102007063039A1 Method for production of silicon wafer, involves cutting silicon monocrystal block to manufacture wafer, and edge of wafer is bended cut from block |
| 07/17/2008 | DE102007062787A1 Semiconductor arrangement for use in integrated circuit, has organic solderability preservative material applied to one of substrate and semiconductor chip, and copper wire wire-bonded to one of chip and substrate by material |
| 07/17/2008 | DE102007060886A1 Verfahren zum Ausbilden eines nicht-flüchtigen Speichers A method of forming a non-volatile memory |
| 07/17/2008 | DE102007055880A1 Halbleiteranordnungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same |
| 07/17/2008 | DE102007052100A1 Haltering für Polierkopf Retaining ring for polishing head |
| 07/17/2008 | DE102007002421A1 Integrierter Schaltkreis und Verfahren zum Ausbilden eines integrierten Schaltkreises Integrated circuit and method for forming an integrated circuit |
| 07/17/2008 | DE102007002119A1 Organic thin film transistor i.e. top gate-organic thin film transistor, manufacturing method, involves bringing semiconductor layer that is made of organic semiconductor material, on intermediate layer between source- and drain electrodes |
| 07/17/2008 | DE102007001722A1 Transportvorrichtung, Zuführungsvorrichtung, Entnahmevorrichtung und Vorrichtung zum Aufnehmen, Transportieren und Sortieren von elektronischen Bauelementen Transport device, delivery device, extraction device, and apparatus for receiving, transporting and sorting electronic components |
| 07/17/2008 | DE102007001523A1 Semiconductor circuit arrangement, has semiconductor material region provided with two semiconductor circuit parts, and void structure with hollow cavity, which is arranged between semiconductor circuit parts |
| 07/17/2008 | DE102006007096B4 MOSFET mit Kompensationsstruktur und Randabschluss sowie Verfahren zu dessen Herstellung MOSFET with compensation structure and edge finish and method for its manufacture |
| 07/17/2008 | DE102005061663B4 Ionenimplantationsvorrichtung An ion implantation apparatus |
| 07/17/2008 | CA2674448A1 Nitride nanowires and method of producing such |
| 07/16/2008 | EP1945013A1 Multilayer printed wiring board and method for manufacturing same |
| 07/16/2008 | EP1945012A1 LED module with gold bonding |
| 07/16/2008 | EP1944804A2 Organic light emitting device and manufacturing method thereof |
| 07/16/2008 | EP1944802A2 Method for manufacturing a leadframe, packaging method for using the leadframe and semiconductor package product |
| 07/16/2008 | EP1944801A1 Methods for manufacturing a CMOS device with dual work function |