Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/16/2008EP1944800A2 Method for manufacturing substrate mounting table
07/16/2008EP1944799A2 High temperature robot end effector
07/16/2008EP1944798A2 Apparatus and method for supplying articles to processing tool
07/16/2008EP1944797A1 Highly conductive composition for wafer coating
07/16/2008EP1944796A2 Oxide etch with NH3-NF3 chemistry
07/16/2008EP1944795A2 Use of F-based gate etch to passivate the high-K/metal gate stack for deep submicron transistor technologies
07/16/2008EP1944794A1 A method for controlled formation of a gate dielectric stack
07/16/2008EP1944793A2 Temperature measurement and control of wafer support in thermal processing chamber
07/16/2008EP1944792A2 Method and apparatus for reducing patterning effects on a substrate during radiation-based heating
07/16/2008EP1944775A1 Production of electronic devices
07/16/2008EP1944722A2 Capacitance detection type sensor and manufacturing method thereof
07/16/2008EP1944654A2 An exposure apparatus and an exposure method
07/16/2008EP1944345A1 Thermal-release double-coated pressure-sensitive adhesive tape or sheet
07/16/2008EP1944123A2 Substrate holding apparatus
07/16/2008EP1944118A1 Laser processing method and laser processing device
07/16/2008EP1944083A1 Group iii/v nitride semiconductor, photocatalyst semiconductor element, photocatalytic redox reaction apparatus, and photoelectrochemical reaction execution method
07/16/2008EP1943680A2 A method of making an inverted-t channel transistor
07/16/2008EP1943679A1 High density, high q capacitor on top of protective layer
07/16/2008EP1943676A2 Electrostatic discharge protection device
07/16/2008EP1943675A1 Metal interconnect structure for a microelectronic element
07/16/2008EP1943673A1 A method of manufacturing a structure
07/16/2008EP1943672A2 Methods and apparatus for flip-chip-on-lead semiconductor package
07/16/2008EP1943671A2 Multiple device types including an inverted-t channel transistor and method therefor
07/16/2008EP1943670A2 Semiconductor device
07/16/2008EP1943669A2 Linear and cross-linked high molecular weight polysilanes, polygermanes, and copolymers thereof, compositions containing the same, and methods of making and using such compounds and compositions
07/16/2008EP1943668A2 Technique and apparatus for depositing layers of semiconductor for solar cell and module fabrication
07/16/2008EP1943667A1 Polymer or resist pattern, and metal film pattern, metal pattern and plastic mold using the same, and fabrication methods thereof
07/16/2008EP1943666A1 Capacitor structure
07/16/2008EP1943665A1 Hybrid chuck
07/16/2008EP1943355A2 Process of stripping a microarray for reuse
07/16/2008EP1943320A1 Method for testing a slurry used to form a semiconductor device
07/16/2008EP1943186A2 Microscopic electro-mechanical systems, radio frequency devices utilizing nanocoils and spiral pitch control techniques for fabricating the same
07/16/2008EP1943171A1 Handling device
07/16/2008EP1880414A4 Method for resist strip in presence of regular low k and/or porous low k dielectric materials
07/16/2008EP1869709A4 Structure and method of fabricating high-density, trench-based non-volatile random access sonos memory cells for soc applications
07/16/2008EP1807868A4 Stacked die module
07/16/2008EP1654770A4 Structure and method of making strained semiconductor cmos transistors having lattice-mismatched source and drain regions
07/16/2008EP1646478B9 Method for epiready surface treatment on sic thin films
07/16/2008EP1625613A4 Substrate holding apparatus and polishing apparatus
07/16/2008EP1532728A4 Improved platen for electrostatic wafer clamping apparatus
07/16/2008EP1513652A4 Polishing pad with optical sensor
07/16/2008EP1497868A4 Structure and method for an emitter ballast resistor in an hbt
07/16/2008EP1497076A4 Method and apparatus for heating polishing pad
07/16/2008EP1495066B1 Organic silicate polymer and insulation film comprising the same
07/16/2008EP1358363B1 Diamond coatings on reactor wall and method of manufacturing thereof
07/16/2008EP1334515B1 Method for producing an integrated semiconductor component
07/16/2008EP1282914B1 Method of manufacturing a semiconductor device with shallow trench isolation (STI) sidewall implant
07/16/2008EP1210638A4 Method/system measuring object features with 2d and 3d imaging coordinated
07/16/2008EP1190434B1 Real-time prediction of proximity resist heating and correction of raster scan electron beam lithography
07/16/2008EP1154471B1 Semiconductor chip with bump contacts
07/16/2008EP1125096B1 Method of and device for determining the warpage of a wafer
07/16/2008EP1060522B1 Display devices
07/16/2008EP1058946B1 Method for forming cavities in a semiconductor substrate by implanting atoms
07/16/2008CN201087903Y Taking and putting head with magnetic auxiliary stabilizing device
07/16/2008CN201087902Y Multi-level chip sorting device
07/16/2008CN201087901Y Chip tray supplying device
07/16/2008CN201087900Y Tray storage mechanism and chip selection machine using the same
07/16/2008CN201087899Y Sliding pin chip force pressing device used for vacuum cavity
07/16/2008CN101223840A Electronic component mounting device and method
07/16/2008CN101223647A Silicon carbide junction barrier schottky diodes with suppressed minority carrier injection
07/16/2008CN101223641A Production method of SIMOX substrates and SIMOX substrates produced by the same
07/16/2008CN101223640A High density nand non-volatile memory device
07/16/2008CN101223637A Apparatus for removing foreign material from substrate and method for removing foreign material from substrate
07/16/2008CN101223636A Substrate transfer robot and processing apparatus
07/16/2008CN101223635A Modular terminal for high-throughput amhs
07/16/2008CN101223634A Mold for forming a molding member and method of fabricating a molding member using the same
07/16/2008CN101223633A Micro-electro-mechanical transducers
07/16/2008CN101223632A Selective wet etching of oxides
07/16/2008CN101223631A Gas treatment apparatus
07/16/2008CN101223630A Diamond medical devices
07/16/2008CN101223629A Semiconductor device manufacturing method
07/16/2008CN101223628A Method of suppressing distortion of a working laser beam of a laser link processing system
07/16/2008CN101223483A Removing solution for photosensitive composition
07/16/2008CN101223482A Process for producing resist composition, filtering apparatus, resist composition applicator, and resist composition
07/16/2008CN101223481A Method for manufacturing internal cell structure, internal cell structure, and display device
07/16/2008CN101223479A Process for producing positive-working resist composition, positive-working resist composition, and method for resist pattern formation
07/16/2008CN101223265A Release agent composition
07/16/2008CN101223260A Lng bog reliquefaction apparatus
07/16/2008CN101223206A Pre-applied sealing resin composition and method for manufacturing semiconductor device using the same
07/16/2008CN101223016A Manufacturing method of laminated sheet and laminated sheet
07/16/2008CN101223010A Wafer position teaching method and teaching tool
07/16/2008CN101223006A Double side polishing method for wafer
07/16/2008CN101223000A Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
07/16/2008CN101222974A A patterning process
07/16/2008CN101222818A Wiring substrate and manufacturing method thereof, and semiconductor device
07/16/2008CN101222814A Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
07/16/2008CN101222813A Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
07/16/2008CN101222025A Novel packaging device of organic EL device and its packaging method
07/16/2008CN101222020A Method of forming a phase change layer by electro-chemical deposition and manufacturing of a storage node and a phase change memory device using the method
07/16/2008CN101222004A Package structure of light emitting diode and its manufacturing method
07/16/2008CN101221998A Semiconductor optoelectronic component and its cutting method
07/16/2008CN101221991A Grid control varactor structure and producing method thereof
07/16/2008CN101221990A Semiconductor device and method of manufacturing the same
07/16/2008CN101221988A Semiconductor structure with high breakdown voltage and high resistance, and its manufacturing method
07/16/2008CN101221985A Double-grid field effect transistor and its forming method
07/16/2008CN101221982A Heterojunction bipolar transistor and its forming method
07/16/2008CN101221981A Electronic component with mixed high dielectric material layer and manufacturing method thereof
07/16/2008CN101221979A Semiconductor structure with sub-photoetching width faceting and its manufacturing method
07/16/2008CN101221976A 有机发光装置及其制造方法 The organic light emitting device and manufacturing method
07/16/2008CN101221973A Organic light emitting display device and method for fabricating the same