| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 07/10/2008 | US20080166892 Mask for forming polysilicon and a method for fabricating thin film transistor using the same |
| 07/10/2008 | US20080166891 Heat treatment method for silicon wafer |
| 07/10/2008 | US20080166890 High Pressure Hydrogen Annealing for Mosfet |
| 07/10/2008 | US20080166889 Using alternating phase-shift implementation in lithography; electronic design automation (EDA); computer readable medium |
| 07/10/2008 | US20080166888 Sti of a semiconductor device and fabrication method thereof |
| 07/10/2008 | US20080166887 Method of Depositing Thin Film and Method of Manufacturing Semiconductor Using the Same |
| 07/10/2008 | US20080166886 Substrate processing apparatus |
| 07/10/2008 | US20080166885 Method and Apparatus for Semiconductor Wafer Planarization |
| 07/10/2008 | US20080166884 Delivery device comprising gas diffuser for thin film deposition |
| 07/10/2008 | US20080166883 Hemi-spherical structure and method for fabricating the same |
| 07/10/2008 | US20080166882 Substrate Processing Apparatus and Producing Method of Semiconductor Device |
| 07/10/2008 | US20080166881 Semiconductor Device Manufacturing Apparatus and Manufacturing Method of Semiconductor Device |
| 07/10/2008 | US20080166880 Delivery device for deposition |
| 07/10/2008 | US20080166879 Methods of manufacturing semiconductor structures using rie process |
| 07/10/2008 | US20080166878 Silicon nanostructures and fabrication thereof |
| 07/10/2008 | US20080166877 Method for manufacturing semiconductor device and polisher used in the method for manufacturing semiconductor device |
| 07/10/2008 | US20080166876 Method for fabricating semiconductor device |
| 07/10/2008 | US20080166875 Thermally contained/insulated phase change memory device and method (combined) |
| 07/10/2008 | US20080166874 Formation of vertical devices by electroplating |
| 07/10/2008 | US20080166873 Method of manufacturing semiconductor device |
| 07/10/2008 | US20080166872 Method of producing semiconductor device |
| 07/10/2008 | US20080166871 Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials |
| 07/10/2008 | US20080166870 Fabrication of Interconnect Structures |
| 07/10/2008 | US20080166869 Method of depositing a sculptured copper seed layer |
| 07/10/2008 | US20080166868 Semiconductor device and method for fabricating the same |
| 07/10/2008 | US20080166867 Semiconductor device, method of manufacturing the same, and method of manufacturing metal compound thin film |
| 07/10/2008 | US20080166866 Method for forming gate structure with local pulled-back conductive layer and its use |
| 07/10/2008 | US20080166865 Method of fabricating flash memory |
| 07/10/2008 | US20080166864 Method for forming trench gate and method for manufacturing semiconductor device |
| 07/10/2008 | US20080166863 Semiconductor transistors with contact holes close to gates |
| 07/10/2008 | US20080166862 Method and system for creating self-aligned twin wells with co-planar surfaces in a semiconductor device |
| 07/10/2008 | US20080166861 Impurity introducing apparatus and impurity introducing method |
| 07/10/2008 | US20080166860 Semiconductor device and manufacturing method thereof, liquid crystal television system, and el television system |
| 07/10/2008 | US20080166859 Integrated assist features for epitaxial growth |
| 07/10/2008 | US20080166858 Self-constrained anisotropic germanium nanostructure from electroplating |
| 07/10/2008 | US20080166857 Electrically conductive path forming below barrier oxide layer and integrated circuit |
| 07/10/2008 | US20080166856 Methods of Forming Recessed Access Devices Associated With Semiconductor Constructions |
| 07/10/2008 | US20080166855 Process for high voltage superjunction termination |
| 07/10/2008 | US20080166854 Semiconductor devices including trench isolation structures and methods of forming the same |
| 07/10/2008 | US20080166853 Method for manufacturing a semiconductor device |
| 07/10/2008 | US20080166852 Semiconductor element, semiconductor device, and method for fabrication thereof |
| 07/10/2008 | US20080166851 Metal-insulator-metal (mim) capacitor and method for fabricating the same |
| 07/10/2008 | US20080166850 Local collector implant structure for heterojunction bipolar transistors and methodof forming the same |
| 07/10/2008 | US20080166849 LDMOS device and method |
| 07/10/2008 | US20080166848 Method for reducing overlap capacitance in field effect transistors |
| 07/10/2008 | US20080166847 Method of forming source and drain of field-effect-transistor and structure thereof |
| 07/10/2008 | US20080166846 Method of Forming Trench Gate FETs with Reduced Gate to Drain Charge |
| 07/10/2008 | US20080166845 Method of manufacture for a semiconductor device |
| 07/10/2008 | US20080166844 Method of Forming a Non-volatile Memory Cell Using Off-set Spacers |
| 07/10/2008 | US20080166843 Isolation regions for semiconductor devices and their formation |
| 07/10/2008 | US20080166841 Method of fabricating a strained silicon channel metal oxide semiconductor transistor |
| 07/10/2008 | US20080166840 Method for manufacturing semiconductor device |
| 07/10/2008 | US20080166839 Sub-lithographics opening for back contact or back gate |
| 07/10/2008 | US20080166838 Manufacturing methods of metal wire, electrode and tft array substrate |
| 07/10/2008 | US20080166837 Power MOSFET wafer level chip-scale package |
| 07/10/2008 | US20080166836 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof |
| 07/10/2008 | US20080166835 Method of bonding a solder ball and a base plate and method of manufacturing packaging structure of using the same |
| 07/10/2008 | US20080166834 Thin film etching method |
| 07/10/2008 | US20080166832 Adjustments of Masks by Re-Flow |
| 07/10/2008 | US20080166830 Image sensor pixel having photodiode with multi-dopant implantation |
| 07/10/2008 | US20080166829 Forming method of liquid crystal layer using ink jet system |
| 07/10/2008 | US20080166828 Gallium-containing light-emitting semiconductor device and method of fabrication |
| 07/10/2008 | US20080166827 Thin film transistor array panel and method for manufacturing the same |
| 07/10/2008 | US20080166826 Systems and methods for on-die light sensing with low leakage |
| 07/10/2008 | US20080166824 Simulating method of ion implantaion and method for manufacturing semiconductor device |
| 07/10/2008 | US20080166823 Method for Evaluating Semiconductor Wafer, Apparatus for Evaluating Semiconductor Wafer, and Method for Manufacturing Semiconductor Wafer |
| 07/10/2008 | US20080166822 Semiconductor manufacturing apparatus |
| 07/10/2008 | US20080166668 Laser mask and method of crystallization using the same |
| 07/10/2008 | US20080166661 Low cost, rapid production; securing margins of overlapping and arrangement; forming composite photoresist pattern having pitch equal to half of individual pitches; first photoresist contains copolymer of such as 2-methyl-2-adamantyl methacrylate, 2-hydroxyethyl methacrylate and n-isopropyl acrylamide |
| 07/10/2008 | US20080166655 Resolution, sensitivity; forming rectangular, fine patterns; having acid dissociable, dissolution inhibiting component such as (4-oxo-2-adamantyloxy)methyl methacrylate containing copolymer |
| 07/10/2008 | US20080166638 Comprised of base resin, acrylic acid-3,3-dimethoxypropene copolymer, photoacid generator, organic base and solvent; reducing number of steps to perform etching and hard mask deposition |
| 07/10/2008 | US20080166582 Method for fabricating metal substrates with high-quality surfaces |
| 07/10/2008 | US20080166572 Semiconductor Constructions |
| 07/10/2008 | US20080166543 formed by bonding a semiconductor die to a substrate using a B-staged adhesive; before B-staging adhesive containing silver filler with average particle size 2-10 microne, first resin ( e.g. polybismaleimides ), solvents, curing agent ( curmene hydroperoxide), a second resin; curing |
| 07/10/2008 | US20080166213 High-speed substrate manipulator |
| 07/10/2008 | US20080166209 Molded Article Picker |
| 07/10/2008 | US20080166208 Wet clean system design |
| 07/10/2008 | US20080166054 Pattern inspection apparatus |
| 07/10/2008 | US20080165822 Laser light irradiation apparatus and laser light irradiation method |
| 07/10/2008 | US20080165811 Surface Emitting-Semiconductor Laser Component Featuring Emission in a Vertical Direction |
| 07/10/2008 | US20080165577 Semiconductor device |
| 07/10/2008 | US20080165576 Memory storage devices comprising different ferromagnetic material layers, and methods of making and using the same |
| 07/10/2008 | US20080165569 Resistance Limited Phase Change Memory Material |
| 07/10/2008 | US20080165565 Ferroelectric Thin Films and Devices Comprising Thin Ferroelectric Films |
| 07/10/2008 | US20080165521 Three-dimensional architecture for self-checking and self-repairing integrated circuits |
| 07/10/2008 | US20080165518 Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles |
| 07/10/2008 | US20080165458 Electrostatic protection device |
| 07/10/2008 | US20080165222 Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device |
| 07/10/2008 | US20080165110 Gate driving circuit, liquid crystal display having the same, and manufacturing method for thin film transistor substrate |
| 07/10/2008 | US20080164623 Wafer, semiconductor device, and fabrication methods therefor |
| 07/10/2008 | US20080164620 Multi-chip package and method of fabricating the same |
| 07/10/2008 | US20080164619 Semiconductor chip package and method of manufacturing the same |
| 07/10/2008 | US20080164618 Semiconductor package system with die carrier having mold flow restricting elements |
| 07/10/2008 | US20080164617 Method of Forming Vertical Contacts in Integrated Circuits |
| 07/10/2008 | US20080164616 Strip Conductor Structure for Minimizing Thermomechanical Loads |
| 07/10/2008 | US20080164613 ULTRA-THIN Cu ALLOY SEED FOR INTERCONNECT APPLICATION |
| 07/10/2008 | US20080164612 The back, inactive side of a semiconductor wafer is coated with a mixture of conductive filler such as silver that has an average particle size of less than 2 microns and a maximum particle size of less than 5 microns, solvent, and a soluble resin that has a softening point of 80-260 degrees C. |
| 07/10/2008 | US20080164611 Method for making an integrated circuit having a via hole |
| 07/10/2008 | US20080164609 Injection molded solder ball method |
| 07/10/2008 | US20080164608 Semiconductor device and method for producing the same |