Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/17/2008WO2008084583A1 Current switch circuit, d/a converter using same, semiconductor integrated circuit, and communication device
07/17/2008WO2008084537A1 Electron gun and electron beam exposure device
07/17/2008WO2008084524A1 Process for producing semiconductor device and apparatus for semiconductor device production
07/17/2008WO2008084520A1 Optical device, pattern generating apparatus, pattern generating method, exposure apparatus, exposure method and device manufacturing method
07/17/2008WO2008084519A1 Method for manufacturing silicon epitaxial wafer
07/17/2008WO2008084440A1 Method of forming an interconnect structure
07/17/2008WO2008084366A1 Method of making an interconnect structure
07/17/2008WO2008084364A2 I-mosfet manufacturing method
07/17/2008WO2008084278A1 Semiconductor device and method of forming a semiconductor device
07/17/2008WO2008084276A1 A semiconductor package
07/17/2008WO2008084085A1 Method of fabricating a transistor with semiconductor gate combined locally with a metal
07/17/2008WO2008083905A1 Spacers for wafer bonding
07/17/2008WO2008083794A1 Led module with gold bonding
07/17/2008WO2008083469A1 Light emitting devices with a zinc oxide thin film structure
07/17/2008WO2008064035B1 Method of forming a structure having a high dielectric constant and a structure having a high dielectric constant
07/17/2008WO2008063742A2 Method of packaging a semiconductor device and a prefabricated connector
07/17/2008WO2008063543A3 Stress enhanced mos transistor and methods for its fabrication
07/17/2008WO2008061258A3 Selective metal wet etch composition and process
07/17/2008WO2008051883A3 Debris management for wafer sungulation
07/17/2008WO2008045099A3 Fused nanocrystal thin film semiconductor and method
07/17/2008WO2008033928A3 Electron beam enhanced surface wave plasma source
07/17/2008WO2008024761A3 Electrical device having boardless electrical component mounting arrangement
07/17/2008WO2008021340A3 Workpiece handling scan arm for ion implantation system
07/17/2008WO2008019277A3 Substrate bonding process with integrated vents
07/17/2008WO2008014339A3 Method and system for continuous large-area scanning implantation process
07/17/2008WO2008011741A3 Apparatus for storage of objects from the field of manufacture of electronic components
07/17/2008WO2007120866A3 Self-aligned method based on low-temperature selective epitaxial growth for fabricating silicon carbide devices
07/17/2008WO2007115309A3 Apparatus and method for treating a workpiece with ionizing gas plasma
07/17/2008WO2007109326A3 Methods and materials useful for chip stacking, chip and wafer bonding
07/17/2008WO2007059578A8 High efficiency solar cell fabrication
07/17/2008WO2007059551A8 Low area screen printed metal contact structure and method
07/17/2008WO2007001838A3 Methods and apparatus for igniting a low pressure plasma
07/17/2008WO2005124871A3 Hybrid substrate technology for high-mobility planar and multiple-gate mosfets
07/17/2008US20080172195 Semiconductor device, and test circuit and test method for testing semiconductor device
07/17/2008US20080171500 Retainer ring for polishing head
07/17/2008US20080171484 Method of Manufacturing Display Device
07/17/2008US20080171449 Method for cleaning salicide
07/17/2008US20080171448 System and method for selectively etching an integrated circuit
07/17/2008US20080171447 Method of forming semiconductor device with multiple level patterning
07/17/2008US20080171446 Method of forming semiconductor device
07/17/2008US20080171445 Novel chemical vapor deposition process
07/17/2008US20080171444 Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactor
07/17/2008US20080171443 Fabrication of hybrid substrate with defect trapping zone
07/17/2008US20080171442 Metal interconnect structure and process for forming same
07/17/2008US20080171441 Polishing compound and method for producing semiconductor integrated circuit device
07/17/2008US20080171440 2,3-benzopyrrole, 2-ethyl imidazole, 4-methyl imidazole, polyoxyethylene alkyl ether phosphate corrosion inhibitor dissolved in methanol, ethanol, propanol, butanol organic solvent; chemical mechanical polishing, electrolytic polishing and composite electrolytic polishing
07/17/2008US20080171439 Recycling of ion implantation monitor wafers
07/17/2008US20080171438 Methods of uniformly removing silicon oxide, a method of removing a sacrifical oxide, and an intermediate semiconductor device structure
07/17/2008US20080171437 Methods of Forming Titanium-Containing Materials
07/17/2008US20080171436 Methods of depositing a ruthenium film
07/17/2008US20080171435 Vacuum Processing Apparatus, Method for Manufacturing Semiconductor Device, and System For Manufacturing Semiconductor Device
07/17/2008US20080171434 Method of fabricating dual damascene structure
07/17/2008US20080171433 Damascene interconnection structure and dual damascene process thereof
07/17/2008US20080171432 Circuit Structure with Low Dielectric Constant Regions and Method of Forming Same
07/17/2008US20080171431 Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio
07/17/2008US20080171430 Methods of forming through-substrate interconnects
07/17/2008US20080171429 Semiconductor device including a floating gate electrode having stacked structure
07/17/2008US20080171428 Methods of Forming Spacer Patterns Using Assist Layer For High Density Semiconductor Devices
07/17/2008US20080171427 Eeprom memory cell with controlled geometrical features
07/17/2008US20080171426 Uniaxial strain relaxation of biaxial-strained thin films using ion implantation
07/17/2008US20080171425 Methods of forming an epitaxial layer on a group iv semiconductor substrate
07/17/2008US20080171424 Epitaxial growth of GaN and SiC on silicon using nanowires and nanosize nucleus methodologies
07/17/2008US20080171423 Low-cost strained soi substrate for high-performance cmos technology
07/17/2008US20080171422 Apparatus and methods for fabrication of thin film electronic devices and circuits
07/17/2008US20080171421 Manufacturing method of semiconductor device with smoothing
07/17/2008US20080171420 Structure and method to form improved isolation in a semiconductor device
07/17/2008US20080171419 Method for forming SOI device
07/17/2008US20080171418 Method to Fabricate Passive Components Using Conductive Polymer
07/17/2008US20080171417 Method and Apparatus for Reducing Patterning Effects on a Substrate During Radiation-Based Heating
07/17/2008US20080171416 Self-aligned patterning method by using non-conformal film and etch back for flash memory and other semiconductor applications
07/17/2008US20080171415 Methods of Forming NAND Memory with Virtual Channel
07/17/2008US20080171414 Method of fabricating semiconductor devices having a gate silicide
07/17/2008US20080171413 Method of Reducing Detrimental STI-Induced Stress in MOSFET Channels
07/17/2008US20080171412 Fabrication methods for mos device and cmos device
07/17/2008US20080171411 Nonvolatile semiconductor memory element excellent in charge retention properties and process for producing the same
07/17/2008US20080171410 Method for manufacturing crystalline semiconductor film and semiconductor device
07/17/2008US20080171409 Method for fabricating bottom-gate low-temperature polysilicon thin film transistor
07/17/2008US20080171408 Methods for forming dual fully silicided gates over fins of finfet devices
07/17/2008US20080171407 Manufacturing method of fin-type field effect transistor
07/17/2008US20080171406 Methods Of Forming Integrated Circuit Devices Using Composite Spacer Structures
07/17/2008US20080171405 Integrated circuit package system with leads having multiple sides exposed
07/17/2008US20080171404 Method and Device For Mutual Contacting of Two Wafers
07/17/2008US20080171402 Method of fabricating a semiconductor multi-package module having inverted land grid array (lga) package stacked over ball grid array (bga) package
07/17/2008US20080171401 Device for repairing conducting line and repairing method using same
07/17/2008US20080171291 Photomasks; photoresists
07/17/2008US20080171290 Resist material and nanofabrication method
07/17/2008US20080171230 depositing by sol-gel processing onto a substrate a composition containing a heterocyclic amide such as polyvinylpyrrolidone; reduced leakage current and enhanced breakdown strength; memory devices, pyroelectric sensor devices, wave guide modulators, and acoustic sensors
07/17/2008US20080171204 Fabrication of light emitting film coated fullerenes and their application for in-vivo light emission
07/17/2008US20080171187 Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
07/17/2008US20080171140 barium-strontium-titinate ferroelectric film structure incorporating a buffer layer prepared from a Ba0.5Sr0.5TiO3 precursor containing polyvinylpyrrolidione; size of the pores can be controlled by the polyvinylpyrrolidone content in the dielectric solution; improved top contact adhesion
07/17/2008US20080170930 Transport assembly
07/17/2008US20080170929 High temperature robot end effector
07/17/2008US20080170427 Resistive random access memory devices and methods of manufacturing the same
07/17/2008US20080170424 Semiconductor memory device capable of realizing a chip with high operation reliability and high yield
07/17/2008US20080170396 LED array and method for fabricating same
07/17/2008US20080170352 Capacitor and its manufacturing method
07/17/2008US20080170226 Particle monitor system and substrate processing apparatus
07/17/2008US20080170215 Lithographic apparatus and device manufacturing method
07/17/2008US20080170211 Immersion exposure technique
07/17/2008US20080169862 Semiconductor device and methods for controlling its patterns