Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/22/2008US7403237 Electro-optical device with electrolytic corrosion preventing film and multiple relay electrodes
07/22/2008US7403235 Integrated circuit and information signal processing apparatus having multiple processing portions
07/22/2008US7403228 Solid-state camera device and method of manufacturing the same, and method of making mask for manufacturing the device
07/22/2008US7403095 Thin film resistor structure and method of fabricating a thin film resistor structure
07/22/2008US7403024 Contactor having contact electrodes of metal springs embedded in a plate-like structure
07/22/2008US7402995 Jig device for transporting and testing integrated circuit chip
07/22/2008US7402945 Light emitting apparatus and method of fabricating the same
07/22/2008US7402913 High density nanostructured interconnection
07/22/2008US7402903 Semiconductor device
07/22/2008US7402902 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
07/22/2008US7402900 Semiconductor device substrate, semiconductor device, and manufacturing method thereof
07/22/2008US7402899 Hermetically sealable silicon system and method of making same
07/22/2008US7402897 Vertical system integration
07/22/2008US7402894 Integrated circuit carrier
07/22/2008US7402893 System and method for improved auto-boating
07/22/2008US7402888 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit
07/22/2008US7402884 Low crosstalk substrate for mixed-signal integrated circuits
07/22/2008US7402879 Layered magnetic structures having improved surface planarity for bit material deposition
07/22/2008US7402876 Zr— Sn—Ti—O films
07/22/2008US7402873 Semiconductor integrated circuit device having deposited layer for gate insulation
07/22/2008US7402871 Semiconductor device having resistor and method of fabricating the same
07/22/2008US7402867 Semiconductor device
07/22/2008US7402864 Method for forming a DRAM semiconductor device with a sense amplifier
07/22/2008US7402861 Memory cells and select gates of NAND memory arrays
07/22/2008US7402859 Field effect semiconductor switch and method for fabricating it
07/22/2008US7402858 Semiconductor memory device and method of manufacturing the same
07/22/2008US7402857 Flip FERAM cell and method to form same
07/22/2008US7402855 Split-channel antifuse array architecture
07/22/2008US7402849 Parallel, individually addressable probes for nanolithography
07/22/2008US7402843 Group III-V compound semiconductor and group III-V compound semiconductor device using the same
07/22/2008US7402837 Light emitting devices with self aligned ohmic contacts
07/22/2008US7402835 Heteroatom-containing diamondoid transistors
07/22/2008US7402833 Multilayer dielectric tunnel barrier used in magnetic tunnel junction devices, and its method of fabrication
07/22/2008US7402832 Quantum dots of group IV semiconductor materials
07/22/2008US7402830 Gallium nitride-based compound semiconductor light-emitting device
07/22/2008US7402820 Ion beam contamination determination
07/22/2008US7402801 Inspecting method of a defect inspection device
07/22/2008US7402787 Method of thin lightshield process for solid-state image sensors
07/22/2008US7402770 Nano structure electrode design
07/22/2008US7402626 Top coat composition
07/22/2008US7402621 capable of easily forming a film having a freely controlled thickness in the process ordinarily employed for semiconductor fabrication, and having excellent mechanical strength and dielectric properties; forming particles, imparting crosslinkability to particles, temporarily terminating crosslinkability
07/22/2008US7402552 Non-corrosive cleaning composition for removing plasma etching residues
07/22/2008US7402535 Method of incorporating stress into a transistor channel by use of a backside layer
07/22/2008US7402534 Pretreatment processes within a batch ALD reactor
07/22/2008US7402533 Masking without photolithography during the formation of a semiconductor device
07/22/2008US7402532 Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
07/22/2008US7402531 Method for selectively controlling lengths of nanowires
07/22/2008US7402530 Method for manufacturing semiconductor device and semiconductor device
07/22/2008US7402529 Method of applying cladding material on conductive lines of MRAM devices
07/22/2008US7402528 Fabricating method of active device array substrate
07/22/2008US7402527 Dry etching method, fabrication method for semiconductor device, and dry etching apparatus
07/22/2008US7402526 Plasma processing, deposition, and ALD methods
07/22/2008US7402525 Method for manufacturing semiconductor device
07/22/2008US7402524 Post high voltage gate oxide pattern high-vacuum outgas surface treatment
07/22/2008US7402523 Etching method
07/22/2008US7402522 Hard mask structure for deep trenched super-junction device
07/22/2008US7402521 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
07/22/2008US7402520 Edge removal of silicon-on-insulator transfer wafer
07/22/2008US7402519 Interconnects having sealing structures to enable selective metal capping layers
07/22/2008US7402518 Atomic layer deposition methods
07/22/2008US7402517 Method and apparatus for selective deposition of materials to surfaces and substrates
07/22/2008US7402516 Method for making integrated circuits
07/22/2008US7402515 Method of forming through-silicon vias with stress buffer collars and resulting devices
07/22/2008US7402514 Line-to-line reliability enhancement using a dielectric liner for a low dielectric constant interlevel and intralevel (or intermetal and intrametal) dielectric layer
07/22/2008US7402513 Method for forming interlayer insulation film
07/22/2008US7402512 High aspect ratio contact structure with reduced silicon consumption
07/22/2008US7402511 Configuration for testing the bonding positions of conductive drops and test method for using the same
07/22/2008US7402510 Etchant and method for forming bumps
07/22/2008US7402509 Method of forming self-passivating interconnects and resulting devices
07/22/2008US7402508 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
07/22/2008US7402507 Semiconductor package fabrication
07/22/2008US7402506 Depositing a colloidal solution nanoparticle reaction product of an organozinc precursor and a basic ionic compound on a substrate, at 300 degrees C. or less; transparent, dynamic random-access memory cell; optoelectronic display device
07/22/2008US7402505 Single electron devices formed by laser thermal annealing
07/22/2008US7402504 Epitaxial semiconductor deposition methods and structures
07/22/2008US7402503 Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
07/22/2008US7402502 Method of manufacturing a semiconductor device by using a matrix frame
07/22/2008US7402501 Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same
07/22/2008US7402500 Methods of forming shallow trench isolation structures in semiconductor devices
07/22/2008US7402499 Semiconductor device and method of manufacturing the same
07/22/2008US7402498 Methods of forming trench isolation regions
07/22/2008US7402497 Transistor device having an increased threshold stability without drive current degradation
07/22/2008US7402496 Complementary metal-oxide-semiconductor device and fabricating method thereof
07/22/2008US7402495 Method for manufacturing a semiconductor device
07/22/2008US7402494 Method for fabricating high voltage semiconductor device
07/22/2008US7402493 Method for forming non-volatile memory devices
07/22/2008US7402492 Method of manufacturing a memory device having improved erasing characteristics
07/22/2008US7402491 Methods of manufacturing a semiconductor device including a dielectric layer including zirconium
07/22/2008US7402490 Charge-trapping memory device and methods for operating and manufacturing the cell
07/22/2008US7402489 Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
07/22/2008US7402488 Method of manufacturing a semiconductor memory device
07/22/2008US7402487 Process for fabricating a semiconductor device having deep trench structures
07/22/2008US7402486 Cylinder-type capacitor and storage device, and method(s) for fabricating the same
07/22/2008US7402485 Method of forming a semiconductor device
07/22/2008US7402484 Methods for forming a field effect transistor
07/22/2008US7402483 Methods of forming a multi-bridge-channel MOSFET
07/22/2008US7402482 Non-volatile transistor memory array incorporating read-only elements with single mask set
07/22/2008US7402480 Method of fabricating a semiconductor device with multiple gate oxide thicknesses
07/22/2008US7402479 CMOS image sensor and fabricating method thereof
07/22/2008US7402478 Method of fabricating dual gate electrode of CMOS semiconductor device
07/22/2008US7402477 Method of making a multiple crystal orientation semiconductor device