Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/16/2008CN101221971A Plane display device and its testing method
07/16/2008CN101221967A CMOS image sensor and method for manufacturing the same
07/16/2008CN101221966A CMOS image sensor and method for manufacturing the same
07/16/2008CN101221964A Image sensor and method for manufacturing the same
07/16/2008CN101221963A Electronic assembly for image sensor device and fabrication method thereof
07/16/2008CN101221961A Pixel structure and its production method
07/16/2008CN101221959A Thin film transistor substrate and fabricating method thereof
07/16/2008CN101221958A Thin film transistor array panel having a means for visual inspection and a method of performing visual inspection
07/16/2008CN101221957A Dual-grid full-exhaustion SOI CMOS device and method for producing the same
07/16/2008CN101221954A Method and system for utilizing dram components in a system-on-chip
07/16/2008CN101221952A Semiconductor structure for protecting internal integrated circuit and its manufacturing method
07/16/2008CN101221949A Face-centred cubic structure capacitor and manufacturing method thereof
07/16/2008CN101221948A Bonding pad structure for optoelectronic device and fabricating method thereof
07/16/2008CN101221947A Semiconductor component including a semiconductor chip and a passive component
07/16/2008CN101221946A System-in-package packaging for minimizing bond wire contamination and yield loss
07/16/2008CN101221943A Electrostatic discharge protection structure, element and its production method
07/16/2008CN101221941A Substrate and production method for packaging structure
07/16/2008CN101221940A 厚膜电路元件及其制造方法 Thick film circuit device and manufacturing method
07/16/2008CN101221939A Package structure for optoelectronic device and fabrication method thereof
07/16/2008CN101221938A Semiconductor device with switch circuit
07/16/2008CN101221937A Wafer level package with die receiving through-hole and method of the same
07/16/2008CN101221936A Wafer level package with die receiving through-hole and method of the same
07/16/2008CN101221935A Transparent conductive film and method for producing the same
07/16/2008CN101221932A Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
07/16/2008CN101221930A Chip packaging structure and its packaging method
07/16/2008CN101221928A Methods for forming dual fully silicided gates over fins of finfet devices
07/16/2008CN101221927A Method for fabricating shallow trench isolation structures using diblock copolymer patterning
07/16/2008CN101221926A LCD unit structure and manufacturing method thereof
07/16/2008CN101221925A Method of manufacturing liquid crystal display
07/16/2008CN101221924A Ferroelectric memory devices having a protruding bottom electrode and methods of forming the same
07/16/2008CN101221923A Gated diode nonvolatile memory process
07/16/2008CN101221922A Methods for manufacturing a cmos device with dual work function
07/16/2008CN101221921A Semiconductor integrated circuit and process for forming same
07/16/2008CN101221920A Wafer adsorption mechanism
07/16/2008CN101221919A Apparatus for supplying articles
07/16/2008CN101221918A Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus
07/16/2008CN101221917A Process endpoint detection method using broadband reflectometry
07/16/2008CN101221916A Wire bonding machine table
07/16/2008CN101221915A Power MOSFET wafer level chip-scale package
07/16/2008CN101221914A Semiconductor device has conductive projection and its manufacturing method
07/16/2008CN101221913A Semiconductor device has conductive projection and its manufacturing method
07/16/2008CN101221912A Multi-layer projection structure and manufacturing method thereof
07/16/2008CN101221911A Packaging micro devices
07/16/2008CN101221910A Method of manufacturing flat panel display device
07/16/2008CN101221909A Cooling type packaging member production method and its applied cooling structure
07/16/2008CN101221908A Substrate technique and structure with projection
07/16/2008CN101221907A Method for forming a strained channel in a semiconductor device
07/16/2008CN101221906A Method of fabricating semiconductor device and method for fabricating electronic device
07/16/2008CN101221905A Silicon slice etching equipment
07/16/2008CN101221904A Silicon slice etching equipment and method for controlling cavity top cover lifting
07/16/2008CN101221903A Production method of transistor T-shaped nano grid
07/16/2008CN101221902A Mask used for continuous side direction crystal growing technology and laser crystallization method
07/16/2008CN101221901A Silicon field effect transistor on stress insulator and its production method
07/16/2008CN101221900A Reflowing process device and reflowing process method
07/16/2008CN101221899A Method for finishing hard mask layer, method for forming transistor grids, and stack structure
07/16/2008CN101221898A Method for manufacturing metallic substrate with high quality surface
07/16/2008CN101221897A Substrate treating method
07/16/2008CN101221896A Substrate support bushing
07/16/2008CN101221895A Method for manufacturing compound material wafers
07/16/2008CN101221894A Phase demodulation apparatus and method for sensor of radio frequency adaptation
07/16/2008CN101221893A Method for promoting electrostatic charge dissipation on semiconductor chip
07/16/2008CN101221892A Method for detecting releasing degree of semiconductor chip from electrostatic chuck
07/16/2008CN101221891A Etching terminal checking device and method for plasma etching equipment
07/16/2008CN101221890A Method for forming semiconductor structure
07/16/2008CN101221889A Method for forming graphic pattern
07/16/2008CN101221881A Impedance matching method and device
07/16/2008CN101221367A Photo-etching machine silicon slice bench double-bench switching system adopting cross slide rail
07/16/2008CN101221366A 6-freedom micro-motion platform capable of isolating exterior vibration
07/16/2008CN101221364A Lithographic apparatus, device manufacturing method and device
07/16/2008CN101221363A Lithographic apparatus and device manufacturing method
07/16/2008CN101221357A Device for fabricating thin film pattern and method for fabricating thin film with the same
07/16/2008CN101221356A Mask etch plasma reactor with backside optical sensors and multiple frequency control of etch distribution
07/16/2008CN101221355A Cleaning method and device for photo-etching mask plate in manufacture process of organic electroluminescence device
07/16/2008CN101221326A Motherboard of display panel and production method thereof
07/16/2008CN101221207A Multi-core cable detecting device and method thereof
07/16/2008CN101220958A Combustion heater and exhaust gas combustion device
07/16/2008CN101220836A Accurate mechanical bearing and aerostatic bearing associated shafting
07/16/2008CN101220505A Gas supply system, gas supply method, method of cleaning thin film forming apparatus, thin film forming method and thin film forming apparatus
07/16/2008CN101220500A Wafer convex point producing hanging fixture
07/16/2008CN101220499A Copper pre-plating conductive pole protecting equipment
07/16/2008CN101220466A Method for manufacturing gallium nitride nano-wire with tungsten auxiliary heat anneal
07/16/2008CN101220463A Process for chemical vapor deposition of materials with via filling capability and structure formed thereby
07/16/2008CN101220461A Method for cleaning reaction chamber of semiconductor manufacturing device
07/16/2008CN101220256A Polishing composition and polishing process
07/16/2008CN101220244A High surface quality GaN wafer and method of fabricating same
07/16/2008CN101219770A Laser modeling method for semiconductor material micro-nano multi-scale function surface
07/16/2008CN101219731A Overhead conveying system
07/16/2008CN101219720A Clean container with elastic positioning structure
07/16/2008CN101219596A Liquid droplet ejection apparatus, method of manufacturing electrooptical device, and electrooptical device
07/16/2008CN101219576A Wireless enabled device
07/16/2008CN101219534A Polishing pad and method of producing the same
07/16/2008CN101219531A Microporous polishing pads
07/16/2008CN101219429A Method for cleaning quartz parts surface in polycrystal etching cavity
07/16/2008CN101219427A Substrate processing device
07/16/2008CN100403861C Method of fixing IC package onto circuit board
07/16/2008CN100403576C Dual panel-type organic electroluminescent display device and method for fabricating the same
07/16/2008CN100403550C Vertical type wide bandgap semiconductor device structure and making method
07/16/2008CN100403547C Electrically programmed MOS transistor source/drain series resistance
07/16/2008CN100403546C Boron phosphide-based compound semiconductor device, production method thereof and light-emitting diode
07/16/2008CN100403545C Solid-state image sensing element and its design support method, and image pickup device